Abstract: Provided is a metal-resin joined body having a high joint strength and sufficient airtightness and a metal member for obtaining the same. The metal member includes a metal base material made of a metal and a marking pattern having an uneven part formed on a surface of the metal base material, in which the marking pattern is one continuous straight line or curved line, a plurality of the marking patterns is formed to be adjacent to each other and run parallel, and, in a direction orthogonal to a running direction of the plurality of marking patterns, a maximum height roughness Rz of unevenness of the uneven parts and an average interval Rsm of the unevenness by the uneven parts have a relationship of 45?(180/?)×arctan(Rz/(Rsm/2))?75, and a metal-resin joined body includes a resin molded body formed on a surface of this metal member.

Abstract: Provided is a Cu-based alloy powder that is suitable for shaping by a process involving rapid melting and rapid solidification, and is capable of producing a Cu-based alloy shaped object having excellent relative density, electrical conductivity, and strength. The Cu-based alloy powder includes, in terms of % by mass, from 0.05 to 10.0% of an additive element M1 component and from 0.01 to 1.00% of a third element M2 component, with a balance of Cu and unavoidable impurities. The M1 component consists of one or more of Nd, Zr, Mo, and Cr, and the M2 component consists of one or more elements that have a solid solubility limit in the M1 component added to the alloy powder of 1.0% by mass or less.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: Provided are: a method for producing a corrosion-resistant member, wherein the method enables the formation of an anodized aluminum coating with the occurrence of burning due to irradiation with laser light prevented in spite of the inclusion of aluminum or an aluminum alloy as a substrate; and a laser CVD device to be used for obtaining this. They are: a method for producing a corrosion-resistant member, the method comprising: a coating formation step of forming an yttria coating on a surface of a substrate consisting of aluminum or an aluminum alloy by irradiating the substrate with laser light while the substrate is blown with a raw material gas containing yttrium, wherein the laser light is in the form of a pulse wave, and the substrate is allowed to have a temperature of 300° C. to 600° C. in deposition for forming an yttria coating; and a laser CVD device to be used in this method.

Abstract: A powder for additive manufacturing excellent in high-temperature strength, and an additively manufactured article excellent in high-temperature strength produced using the powder for additive manufacturing are provide. An alloy powder material for additive manufacturing, including an alloy powder; and oxide nanoparticles that have not been subjected to surface treatment with an organic substance, wherein the oxide nanoparticles are attached to surfaces of alloy particles constituting the alloy powder, is provided. An additively manufactured article produced using the alloy powder material for additive manufacturing is also provided.

Abstract: Provided is a metal-resin joined body having a high joint strength and sufficient airtightness and a metal member for obtaining the same. The metal member includes a metal base material made of a metal and a marking pattern having an uneven part formed on a surface of the metal base material, in which the marking pattern is one continuous straight line or curved line, a plurality of the marking patterns is formed to be adjacent to each other and run parallel, and, in a direction orthogonal to a running direction of the plurality of marking patterns, a maximum height roughness Rz of unevenness of the uneven parts and an average interval Rsm of the unevenness by the uneven parts have a relationship of 45?(180/?)×arctan(Rz/(Rsm/2))?75, and a metal-resin joined body includes a resin molded body formed on a surface of this metal member.

Abstract: Provided is a shaped article which can satisfy both high heat conducting properties and hardness (quenching and tempering hardness, and hardness after retention at a high temperature and softening). The shaped article produced from an Fe-based alloy powder, the Fe-based alloy powder consisting of, in mass %: 0.20<C<0.60; Si<0.60; Mn<0.90; Cr<4.00; Ni<2.00; Mo<1.20; W<2.00; V<0.60; Al<0.10; and the balance consisting of Fe and unavoidable impurities, wherein the shaped article satisfies the following formulae (1) to (3): (1) T1?30.67; (2) T2>50.0; (3) PC<3.0.

Abstract: Provided is a steel powder for a hot work tool, suitable for additive manufacturing. A stacked shaped article produced by the powder can satisfy both high heat conducting properties and hardness. An Fe-based alloy powder consisting of, in mass %, 0.40<C<0.70, Si<0.60, Mn<0.90, Cr<4.00, Ni<2.00, 0.90<Mo<1.20, W<2.00, V<0.60, and Al<0.10, and the balance consisting of Fe and unavoidable impurities, wherein the Fe-based alloy powder satisfies formulae (1) and (2): K1>21.7 (1); K2>29.0 (2), and wherein the Fe-based alloy powder has an average particle size D50 of 200 ?m or less.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: A cartridge vane pump includes: a linkage member being configured to link the side member and the cover member, the linkage member has: a first support portion configured to support the side member; a second support portion configured to support the cover member; and an extended portion formed so as to extend between the first support portion and the second support portion, the extended portion extending in an axial direction of the rotor, grooves are respectively formed in outer circumferential surfaces of the side member and the cover member so as to extend in a circumferential direction, and the first support portion and the second support portion are respectively received in the grooves formed in the side member and the cover member.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet. cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression a a mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: A mat mounting structure for mounting a mat on a seat back frame in a seat back may have a guide wire attachable to the mat configured to receive a force from a back of an occupant on the seat back. The guide wire may have a straight part extending linearly in a longitudinal direction of the seat back frame on a head side or a root side of the seat back frame. A bushing including a penetration hole in which the straight part is insertable in the longitudinal direction may be included in the structure. An attachment hole part in the seat back frame may also be part of the structure. The bushing may be detachably engageable with and attachable to the attachment hole part.

Abstract: An image processing apparatus includes an image reading unit that reads an image of an original document, an image processing unit that processes image data of the image read by the image reading unit, and a suspension unit that suspends, if a predetermined pattern has been detected from the image read by the image reading unit, the image processing unit in an operation of processing the image data until the original document is removed from the image reading unit.

Abstract: There is provided an app management software 16 for cooperating with a bandwidth control system 2 for dynamically changing a communication bandwidth of the mobile information terminal 3 for each type of application 3a which is installed on the mobile information terminal.

Abstract: An image processing apparatus includes an image reading unit that reads an image of an original document, an image processing unit that processes image data of the image read by the image reading unit, and a suspension unit that suspends, if a predetermined pattern has been detected from the image read by the image reading unit, the image processing unit in an operation of processing the image data until the original document is removed from the image reading unit.

Abstract: There is provided an app management software 16 for cooperating with a bandwidth control system 2 for dynamically changing a communication bandwidth of the mobile information terminal 3 for each type of application 3a which is installed on the mobile information terminal.