Abstract: The present disclosure provides an inorganic/organic hybrid complementary semiconductor device that can be manufactured at a lower cost, has excellent long-term stability, has a well-balanced operation between the p-type transistor and the n-type transistor, and operates at a high speed.

Abstract: A refrigeration cycle apparatus includes a main circuit and a bypass circuit. The main circuit includes: a compressor; a first condenser; a first refrigerant-to-refrigerant heat exchanger; a first expansion device; a first branching portion; a first evaporator; a third branching; and a fourth branching portion. The bypass includes: a second expansion device; the first refrigerant-to-refrigerant heat exchanger; and a second branching portion. The second branching portion includes a liquid outflow pipe and a gas outflow pipe. The liquid outflow pipe defines one outlet for the refrigerant and is located below the gas outflow pipe. The gas outflow pipe defines another outlet for the refrigerant and is located above the liquid outflow pipe. The one outlet of the second branching portion communicates with the third branching portion. The other outlet of the second branching portion communicates with the fourth branching portion.

Abstract: The present disclosure provides a sealing material suitable for a compound having a non-stoichiometric composi263tion. The present disclosure is related to a sealing material for a compound having a non-stoichiometric composition, the sealing material including a polymer layer and an inorganic oxide insulator layer, wherein the polymer layer includes a first polymer layer containing an organic solvent soluble polymer.

Abstract: An electrode formed by molding a semiconductor device with resin. The electrode comprises: a first resin mold portion formed on a front surface of the semiconductor device and having a first thickness (t1); a second resin mold portion formed on a back surface of the semiconductor device and having a second thickness (t2) greater than the first thickness; and an exposed portion formed in a part of the first resin mold portion corresponding to an end of the semiconductor device.

Abstract: A refrigeration cycle device with a main circuit, a bypass circuit and a supercooling heat exchanger further includes: a controller to control an opening degree of the bypass expansion valve; a first sensor to detect a temperature at the refrigerant inflow side of the evaporator; and a second sensor to detect a pressure of the non-azeotropic mixed refrigerant flowing from the evaporator, wherein the controller controls the opening degree of the bypass expansion valve using temperatures of the evaporator, that is, the temperature at the refrigerant inflow side and a saturated gas temperature of the non-azeotropic mixed refrigerant calculated from the pressure so as to adjust a flow rate of the non-azeotropic mixed refrigerant flowing into the evaporator, to eliminate the temperature difference in the evaporator for suppressing uneven frost formation on the evaporator, and thus to prevent heat exchange performance from degrading.

Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: An information processing apparatus (10) includes a time and space information acquisition unit (110) that acquires high-risk time and space information indicating a spatial region with an increased possibility of an accident occurring or of a crime being committed and a corresponding time slot, a possible surveillance target acquisition unit (120) that identifies a video to be analyzed from among a plurality of videos generated by capturing an image of each of a plurality of places, on the basis of the high-risk time and space information, and analyzes the identified video to acquire information of a possible surveillance target, and a target time and space identification unit (130) that identifies at least one of a spatial region where surveillance is to be conducted which is at least a portion of the spatial region or a time slot when surveillance is to be conducted, from among the spatial region and the time slot indicated by the high-risk time and space information, on the basis of the information of the

Abstract: Provided is a shaped article which can satisfy both high heat conducting properties and hardness (quenching and tempering hardness, and hardness after retention at a high temperature and softening). The shaped article produced from an Fe-based alloy powder, the Fe-based alloy powder consisting of, in mass %: 0.20<C<0.60; Si<0.60; Mn<0.90; Cr<4.00; Ni<2.00; Mo<1.20; W<2.00; V<0.60; Al<0.10; and the balance consisting of Fe and unavoidable impurities, wherein the shaped article satisfies the following formulae (1) to (3): (1) T1?30.67; (2) T2>50.0; (3) PC<3.0.

Abstract: Provided is a steel powder for a hot work tool, suitable for additive manufacturing. A stacked shaped article produced by the powder can satisfy both high heat conducting properties and hardness. An Fe-based alloy powder consisting of, in mass %, 0.40<C<0.70, Si<0.60, Mn<0.90, Cr<4.00, Ni<2.00, 0.90<Mo<1.20, W<2.00, V<0.60, and Al<0.10, and the balance consisting of Fe and unavoidable impurities, wherein the Fe-based alloy powder satisfies formulae (1) and (2): K1>21.7 (1); K2>29.0 (2), and wherein the Fe-based alloy powder has an average particle size D50 of 200 ?m or less.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: A cartridge vane pump includes: a linkage member being configured to link the side member and the cover member, the linkage member has: a first support portion configured to support the side member; a second support portion configured to support the cover member; and an extended portion formed so as to extend between the first support portion and the second support portion, the extended portion extending in an axial direction of the rotor, grooves are respectively formed in outer circumferential surfaces of the side member and the cover member so as to extend in a circumferential direction, and the first support portion and the second support portion are respectively received in the grooves formed in the side member and the cover member.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet. cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression a a mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: A mat mounting structure for mounting a mat on a seat back frame in a seat back may have a guide wire attachable to the mat configured to receive a force from a back of an occupant on the seat back. The guide wire may have a straight part extending linearly in a longitudinal direction of the seat back frame on a head side or a root side of the seat back frame. A bushing including a penetration hole in which the straight part is insertable in the longitudinal direction may be included in the structure. An attachment hole part in the seat back frame may also be part of the structure. The bushing may be detachably engageable with and attachable to the attachment hole part.

Abstract: An image processing apparatus includes an image reading unit that reads an image of an original document, an image processing unit that processes image data of the image read by the image reading unit, and a suspension unit that suspends, if a predetermined pattern has been detected from the image read by the image reading unit, the image processing unit in an operation of processing the image data until the original document is removed from the image reading unit.

Abstract: There is provided an app management software 16 for cooperating with a bandwidth control system 2 for dynamically changing a communication bandwidth of the mobile information terminal 3 for each type of application 3a which is installed on the mobile information terminal.

Abstract: An image processing apparatus includes an image reading unit that reads an image of an original document, an image processing unit that processes image data of the image read by the image reading unit, and a suspension unit that suspends, if a predetermined pattern has been detected from the image read by the image reading unit, the image processing unit in an operation of processing the image data until the original document is removed from the image reading unit.