Patents by Inventor Hiroki Kihara
Hiroki Kihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11969984Abstract: A laminate includes a core obtained by impregnating a mat of fibers with a thermoplastic resin (B); and a skin obtained by impregnating continuous fiber(s) with a thermoplastic resin (A), wherein sheet-form intermediate substrates in the laminate have a thermal expansibility, the usable temperature region of said thermoplastic resin (A) and that of said thermoplastic resin (B) overlap over a temperature range of at least 5° C., said thermoplastic resin (A) has a temperature region that does not melt at a lower limit of said usable temperature region, said fibers contained in said mat penetrate through interface layers formed by said thermoplastic resin (A) and said thermoplastic resin (B), and said thermoplastic resin (A) and said thermoplastic resin (B) form interface layers each with a concave-convex shape having a maximum height Ry of not less than 50 ?m and an average roughness Rz of not less than 30 ?m.Type: GrantFiled: June 7, 2021Date of Patent: April 30, 2024Assignee: Toray Industries, Inc.Inventors: Yoshiki Takebe, Hiroki Kihara, Noriyuki Hirano
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Patent number: 11834575Abstract: There is provided an epoxy resin composition including: an epoxy resin, a thixotropic agent, a photobase generator, and an ether skeleton polythiol.Type: GrantFiled: January 8, 2021Date of Patent: December 5, 2023Assignee: CANON KABUSHIKI KAISHAInventors: Haruka Yamaji, Yasushi Iijima, Isao Imamura, Sachiko Yamauchi, Hiroki Kihara
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Publication number: 20210291487Abstract: A laminate includes a core obtained by impregnating a mat of fibers with a thermoplastic resin (B); and a skin obtained by impregnating continuous fiber(s) with a thermoplastic resin (A), wherein sheet-form intermediate substrates in the laminate have a thermal expansibility, the usable temperature region of said thermoplastic resin (A) and that of said thermoplastic resin (B) overlap over a temperature range of at least 5° C., said thermoplastic resin (A) has a temperature region that does not melt at a lower limit of said usable temperature region, said fibers contained in said mat penetrate through interface layers formed by said thermoplastic resin (A) and said thermoplastic resin (B), and said thermoplastic resin (A) and said thermoplastic resin (B) form interface layers each with a concave-convex shape having a maximum height Ry of not less than 50 ?m and an average roughness Rz of not less than 30 ?m.Type: ApplicationFiled: June 7, 2021Publication date: September 23, 2021Inventors: Yoshiki Takebe, Hiroki Kihara, Noriyuki Hirano
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Publication number: 20210222000Abstract: There is provided an epoxy resin composition including: an epoxy resin, a thixotropic agent, a photobase generator, and an ether skeleton polythiol.Type: ApplicationFiled: January 8, 2021Publication date: July 22, 2021Inventors: Haruka Yamaji, Yasushi Iijima, Isao Imamura, Sachiko Yamauchi, Hiroki Kihara
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Publication number: 20210221964Abstract: There is provided an epoxy resin composition containing an epoxy resin, a solid basic compound, and a polythiol. By preparing a mixture 1 by kneading the epoxy resin with the solid basic compound, and then kneading the polythiol therewith, the dissolution of the solid basic compound into the polythiol is rate-limited to ensure the pot life, and due to a catalyst action by the dissolution of the solid basic compound at a time of heating, heat curability in a short time is realized.Type: ApplicationFiled: January 7, 2021Publication date: July 22, 2021Inventors: Isao Imamura, Sachiko Yamauchi, Hiroki Kihara, Haruka Yamaji, Yasushi Iijima
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Patent number: 11059261Abstract: A sandwich laminate, includes as a layer forming a core, a sheet-form intermediate substrate obtained by impregnating a mat composed of reinforcement fibers with a thermoplastic resin; and, as layers forming a skin, sheet-form intermediate substrates obtained by impregnating a mat composed of reinforcement fibers or continuous reinforcement fibers with a thermoplastic resin, wherein at least the sheet-form intermediate substrate used as the layer forming a core has a thermal expansibility, the usable temperature region of a thermoplastic resin (A) constituting the layers forming a skin and that of a thermoplastic resin (B) constituting the layer forming a core overlap each other over a temperature range of at least 5° C., and the thermoplastic resin (A) has a temperature region where it does not melt at a lower limit of the usable temperature region of the thermoplastic resin (B).Type: GrantFiled: March 19, 2014Date of Patent: July 13, 2021Assignee: Toray Industries, Inc.Inventors: Yoshiki Takebe, Hiroki Kihara, Noriyuki Hirano
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Patent number: 11005477Abstract: The present technology relates to a driver circuit, a control method therefor, and a transmission/reception system that enable implementation of a large amplitude signal output required for long distance transmission with low power consumption. The driver circuit includes: a current drive circuit that outputs a predetermined current; and a termination resistance circuit connected in parallel with the current drive circuit, in which the termination resistance circuit connects a termination resistance to a transmission line when the current drive circuit outputs a current, and disconnects the termination resistance from the transmission line when the current drive circuit does not output the current. The present technology can be applied to, for example, a driver circuit that outputs a signal to a long distance transmission line, and the like.Type: GrantFiled: September 28, 2017Date of Patent: May 11, 2021Assignee: Sony Semiconductor Solutions CorporationInventor: Hiroki Kihara
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Publication number: 20190214994Abstract: The present technology relates to a driver circuit, a control method therefor, and a transmission/reception system that enable implementation of a large amplitude signal output required for long distance transmission with low power consumption. The driver circuit includes: a current drive circuit that outputs a predetermined current; and a termination resistance circuit connected in parallel with the current drive circuit, in which the termination resistance circuit connects a termination resistance to a transmission line when the current drive circuit outputs a current, and disconnects the termination resistance from the transmission line when the current drive circuit does not output the current. The present technology can be applied to, for example, a driver circuit that outputs a signal to a long distance transmission line, and the like.Type: ApplicationFiled: September 28, 2017Publication date: July 11, 2019Applicant: Sony Semiconductor Solutions CorporationInventor: Hiroki Kihara
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Patent number: 10093777Abstract: A fiber-reinforced resin sheet and an integrally molded article are provided. The fiber-reinforced resin sheet comprises a nonwoven fabric made of reinforcing fibers having a thermoplastic resin (A) impregnated on one side of the nonwoven fabric. The fiber-reinforced resin sheet satisfies any one of the following conditions (I) and (II): (I) the nonwoven fabric has an area wherein the reinforcing fibers constituting the nonwoven fabric are exposed on the other side in the thickness direction of the nonwoven fabric, and (II) the nonwoven fabric has a thermoplastic resin (B) impregnated on the other side in thickness direction of the nonwoven fabric, and the nonwoven fabric has a reinforcing fiber volume ratio Vfm of up to 20% by volume, and wherein the thermoplastic resin (A) and the thermoplastic resin (B) form an interface layer in the sheet, and the interface layer has a concave-convex shape with a maximum height Ry of at least 50 ?m and an average roughness Rz of at least 30 ?m.Type: GrantFiled: December 6, 2013Date of Patent: October 9, 2018Assignee: TORAY INDUSTRIES, INC.Inventors: Yoshiki Takebe, Hiroki Kihara, Noriyuki Hirano
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Patent number: 9827765Abstract: As a sealing member to be disposed on the periphery of an element substrate, a cured substance of a first sealing material at least containing an epoxy resin, a curing agent, and a filler containing a silica filler and a silicone filler, the first sealing material having a filling amount of the filler of 40% by mass or more and having a difference between the median diameter of the silica filler and the median diameter of the silicone filler of 4.0 ?m or less is used.Type: GrantFiled: August 3, 2016Date of Patent: November 28, 2017Assignee: Canon Kabushiki KaishaInventor: Hiroki Kihara
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Publication number: 20170036444Abstract: As a sealing member to be disposed on the periphery of an element substrate, a cured substance of a first sealing material at least containing an epoxy resin, a curing agent, and a filler containing a silica filler and a silicone filler, the first sealing material having a filling amount of the filler of 40% by mass or more and having a difference between the median diameter of the silica filler and the median diameter of the silicone filler of 4.0 ?m or less is used.Type: ApplicationFiled: August 3, 2016Publication date: February 9, 2017Inventor: Hiroki Kihara
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Publication number: 20160303824Abstract: A sandwich laminate, includes as a layer forming a core, a sheet-form intermediate substrate obtained by impregnating a mat composed of reinforcement fibers with a thermoplastic resin; and, as layers forming a skin, sheet-form intermediate substrates obtained by impregnating a mat composed of reinforcement fibers or continuous reinforcement fibers with a thermoplastic resin, wherein at least the sheet-form intermediate substrate used as the layer forming a core has a thermal expansibility, the usable temperature region of a thermoplastic resin (A) constituting the layers forming a skin and that of a thermoplastic resin (B) constituting the layer forming a core overlap each other over a temperature range of at least 5° C., and the thermoplastic resin (A) has a temperature region where it does not melt at a lower limit of the usable temperature region of the thermoplastic resin (B).Type: ApplicationFiled: March 19, 2014Publication date: October 20, 2016Inventors: Yoshiki TAKEBE, Hiroki KIHARA, Noriyuki HIRANO
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Publication number: 20150376353Abstract: A fiber-reinforced resin sheet and an integrally molded article are provided. The fiber-reinforced resin sheet comprises a nonwoven fabric made of reinforcing fibers having a thermoplastic resin (A) impregnated on one side of the nonwoven fabric. The fiber-reinforced resin sheet satisfies any one of the following conditions (I) and (II): (I) the nonwoven fabric has an area wherein the reinforcing fibers constituting the nonwoven fabric are exposed on the other side in the thickness direction of the nonwoven fabric, and (II) the nonwoven fabric has a thermoplastic resin (B) impregnated on the other side in thickness direction of the nonwoven fabric, and the nonwoven fabric has a reinforcing fiber volume ratio Vfm of up to 20% by volume, and wherein the thermoplastic resin (A) and the thermoplastic resin (B) form an interface layer in the sheet, and the interface layer has a concave-convex shape with a maximum height Ry of at least 50 ?m and an average roughness Rz of at least 30 ?m.Type: ApplicationFiled: December 6, 2013Publication date: December 31, 2015Applicant: TORAY Industries, Inc.Inventors: Yoshiki TAKEBE, Hiroki KIHARA, Noriyuki HIRANO
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Patent number: 8970750Abstract: An image outputting apparatus includes a header production section for producing a header including header information formed from first and second frame information regarding whether pixel data included in a payload are of first and last lines of one frame, respectively, first line information regarding whether or not the pixel data included in the payload are valid, and second line information regarding a line number of a line formed from the pixel data included in the payload, and an error detection code for use for detection of an error of the header information. A packet production section produces a packet which includes, in the payload thereof, pixel data for one line which configure an image obtained by imaging by an imaging section and to which the header is added. An outputting section outputs the produced packet to an image processing apparatus.Type: GrantFiled: September 23, 2011Date of Patent: March 3, 2015Assignee: Sony CorporationInventors: Tatsuya Sugioka, Hiroshi Shiroshita, Miho Ozawa, Hiroki Kihara, Kenichi Maruko, Tatsuo Shinbashi, Kazuhisa Funamoto, Hideyuki Matsumoto, Takayuki Toyama, Hayato Wakabayashi, Naohiro Koshisaka, Shigetoshi Sasaki, Masato Tamori
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Patent number: 8964073Abstract: The present disclosure provides an image outputting apparatus, including, an image pickup section, an error correction code calculation section adapted to calculate an error correction code using pixel data, which configure an image obtained by image pickup by the image pickup section, as an information word, and an outputting section adapted to output coded data, which are data of a codeword obtained by adding the error correction code to the pixel data, to an image processing apparatus provided in an apparatus in which the image outputting apparatus is provided.Type: GrantFiled: October 20, 2011Date of Patent: February 24, 2015Assignee: Sony CorporationInventors: Kazuhisa Funamoto, Tatsuo Shinbashi, Hideyuki Matsumoto, Hiroshi Shiroshita, Hiroki Kihara, Kenichi Maruko, Tatsuya Sugioka, Naohiro Koshisaka, Shigetoshi Sasaki, Masato Tamori, Takayuki Toyama, Miho Ozawa, Hayato Wakabayashi
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Patent number: 8833901Abstract: A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.Type: GrantFiled: January 24, 2013Date of Patent: September 16, 2014Assignee: Canon Kabushiki KaishaInventors: Yoshihiro Hamada, Tadayoshi Inamoto, Isao Imamura, Hiroki Kihara
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Publication number: 20130201249Abstract: A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.Type: ApplicationFiled: January 24, 2013Publication date: August 8, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Yoshihiro Hamada, Tadayoshi Inamoto, Isao Imamura, Hiroki Kihara
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Patent number: 8467490Abstract: A communication system includes: a transmitter adapted to transmit a synchronizing clock and serial data synchronous with the synchronizing clock over a line at low amplitude; and a receiver adapted to receive the serial data and synchronizing clock from the transmitter. The receiver includes an amplifier adapted to amplify the received synchronizing clock of low amplitude to restore the clock to its original amplitude, a latched comparator adapted to latch the received serial data in synchronism with a reproduction clock, and a phase-locked circuit.Type: GrantFiled: March 11, 2009Date of Patent: June 18, 2013Assignee: Sony CorporationInventors: Takaaki Yamada, Hiroki Kihara, Tatsuya Sugioka, Hisashi Owa, Taichi Niki, Yukio Shimomura
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Patent number: 8439483Abstract: A liquid ejection head includes a chip having a liquid ejection pressure generating element and an electrode terminal for electrically connecting the liquid ejection pressure generating element to an external source, an electrical wiring board having a lead wiring to be electrically connected to the electrode terminal, and a lead sealing material for covering an electrical connection portion between the electrode terminal and the lead wiring. The lead sealing material contains an epoxy resin which has an average number of functional groups per molecule of more than two and is solid at 25° C., an acid anhydride curing agent having a polybutadiene backbone, a curing accelerator, and an inorganic filler.Type: GrantFiled: April 8, 2011Date of Patent: May 14, 2013Assignee: Canon Kabushiki KaishaInventors: Hiroki Kihara, Tadayoshi Inamoto, Isao Imamura, Yoshihiro Hamada
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Patent number: 8376518Abstract: A liquid discharge head includes a substrate having, on one side thereof, energy generating elements for generating energy used for discharging liquid, and a sealing member arranged in contact with at least a part of one or more end faces of the substrate, the sealing member being a cured product of a composition having an epoxy resin having a butadiene skeleton and an epoxy resin curing agent having a butadiene skeleton.Type: GrantFiled: June 11, 2010Date of Patent: February 19, 2013Assignee: Canon Kabushiki KaishaInventors: Isao Imamura, Tadayoshi Inamoto, Akane Hisanaga, Hiroki Kihara