Patent number: 7408188
Abstract: An organic semiconductor material characterized by having a structure represented by chemical formula 1, the planarity of a main chain A1-X-A2 being disintegrated by steric hindrance between B1 and X and steric hindrance between B2 and X, the organic semiconductor material having a number average molecular weight of about 2,000 to about 200,000: wherein A1, A2, B1, B2 and X each have a skeleton structure comprising L 6 ? electron rings, M 8 ? electron rings, N 10 ? electron rings, O 12 ? electron rings, P 14 ? electron rings, Q 16 ? electron rings, R 18 ? electron rings, S 20 ? electron rings, T 22 ? electron rings, U 24 ? electron rings, and V 26 ? electron rings, wherein L, M, N, O, P, Q, R, S, T, U, and V are each an integer of 0 (zero) to 6 and L+M+N+O+P+Q+R+S+T+U+V=1 to 6; and B1 and B2 have an alkyl group.
Type:
Grant
Filed:
June 7, 2006
Date of Patent:
August 5, 2008
Assignee:
Dai Nippon Printing Co., Ltd.
Inventors:
Shigeru Sugawara, Hiroki Maeda, Ken Tomino, Masanao Matsuoka