Patents by Inventor Hiroki Maruo
Hiroki Maruo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140158751Abstract: A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.Type: ApplicationFiled: February 26, 2013Publication date: June 12, 2014Applicant: PANASONIC CORPORATIONInventors: Koji Motomura, Arata Kishi, Hiroki Maruo, Yasuhiro Suzuki, Hironori Munakata
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Patent number: 8673685Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.Type: GrantFiled: October 19, 2012Date of Patent: March 18, 2014Assignee: Panasonic CorporationInventors: Tadashi Maeda, Hiroki Maruo, Tsubasa Saeki
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Publication number: 20140073088Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.Type: ApplicationFiled: October 19, 2012Publication date: March 13, 2014Applicant: PANASONIC CORPORATIONInventors: Tadashi Maeda, Hiroki Maruo, Tsubasa Saeki
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Publication number: 20140053398Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream.Type: ApplicationFiled: October 19, 2012Publication date: February 27, 2014Inventors: Tadashi Maeda, Hiroki Maruo, Tsubasa Saeki
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Patent number: 8492657Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: GrantFiled: July 21, 2010Date of Patent: July 23, 2013Assignee: Fujikura Ltd.Inventors: Tomofumi Kitada, Hiroki Maruo, Ryo Takami
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Patent number: 8345436Abstract: A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.Type: GrantFiled: February 16, 2007Date of Patent: January 1, 2013Assignee: Fujikura Ltd.Inventors: Tomofumi Kitada, Hiroki Maruo
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Publication number: 20120234496Abstract: A substrate backing device 3 places and holds a rigid substrate 6 thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate 8 thereto. The substrate backing device 3 includes a plate-shaped backing plate 4 provided with a backing support surface 4a adapted to come into contact with the lower surface of the rigid substrate 6 for supporting it. The backing support surface 4a is provided with an opening portion 4d having a planar opening shape encompassing the area of the rigid substrate 6 to be compressively bonded to the flexible substrate 8.Type: ApplicationFiled: July 5, 2011Publication date: September 20, 2012Inventors: Hiroki Maruo, Koji Motomura, Hideki Eifuku, Tadahiko Sakai
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Patent number: 8222531Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: GrantFiled: July 21, 2010Date of Patent: July 17, 2012Assignee: Fujikura Ltd.Inventors: Tomofumi Kitada, Hiroki Maruo, Ryo Takami
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Publication number: 20110223236Abstract: The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (?)-(R)—N,?-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and a component which is liquid at 25° C. and has two or more ester bonds in one molecule thereof.Type: ApplicationFiled: March 11, 2011Publication date: September 15, 2011Applicants: NITTO DENKO CORPORATION, FUJIMOTO CO., LTD.Inventors: Satoshi AMEYAMA, Eri NISHIURA, Koji NAKAMURA, Masashi KAMIYAMA, Hiroki MARUO, Kyoko HOSAKA, Mitsuhiko HORI
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Patent number: 8003892Abstract: A print circuit substrate is composed of a base material, a wiring pattern formed on the base material, the wiring pattern constituting a predetermined circuit pattern, and a connection terminal of a shape narrowing toward an end thereof, the connection terminal being formed on the base material and extending from the wiring pattern.Type: GrantFiled: March 14, 2007Date of Patent: August 23, 2011Assignee: Fujikura Ltd.Inventor: Hiroki Maruo
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Patent number: 7974104Abstract: A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.Type: GrantFiled: October 13, 2009Date of Patent: July 5, 2011Assignee: Fujikura Ltd.Inventors: Tomofumi Kitada, Hiroki Maruo
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Patent number: 7964800Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: GrantFiled: May 23, 2007Date of Patent: June 21, 2011Assignee: Fujikura Ltd.Inventors: Tomofumi Kitada, Hiroki Maruo, Ryo Takami
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Publication number: 20100282501Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: FUJIKURA LTD.Inventors: Tomofumi KITADA, Hiroki MARUO, Ryo TAKAMI
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Publication number: 20100282499Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Applicant: FUJIKURA LTD.Inventors: Tomofumi KITADA, Hiroki MARUO, Ryo TAKAMI
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Patent number: 7829265Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: GrantFiled: October 3, 2008Date of Patent: November 9, 2010Assignee: Fujikura Ltd.Inventors: Tomofumi Kitada, Hiroki Maruo, Ryo Takami
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Publication number: 20100027229Abstract: A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.Type: ApplicationFiled: October 13, 2009Publication date: February 4, 2010Applicant: FUJIKURA LTD.Inventors: Tomofumi Kitada, Hiroki Maruo
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Patent number: 7642466Abstract: There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.Type: GrantFiled: February 27, 2007Date of Patent: January 5, 2010Assignee: Fujikura Ltd.Inventors: Shinichi Nikaido, Hiroki Maruo
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Publication number: 20090042144Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: ApplicationFiled: October 3, 2008Publication date: February 12, 2009Applicant: FUJIKURA LTD.Inventors: Tomofumi KITADA, Hiroki Maruo, Ryo Takami
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Publication number: 20080251280Abstract: A substrate coupling structure including a flexible circuit board having first conductors provided thereon, a rigid circuit board having second conductors provided thereon so as to face the first conductors, solder plating disposed on at least one of the first conductors and the second conductors, and an insulating layer which has a thickness larger than the sum of thicknesses of the first and second conductors while having a thickness smaller than the sum of the thicknesses of the first and second conductors plus a thickness of the solder plating.Type: ApplicationFiled: September 5, 2007Publication date: October 16, 2008Applicant: Fujikura Ltd.Inventors: Honmo SHI, Hiroki Maruo
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Publication number: 20070273045Abstract: A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion.Type: ApplicationFiled: May 23, 2007Publication date: November 29, 2007Applicant: FUJIKURA LTD.Inventors: Tomofumi Kitada, Hiroki Maruo, Ryo Takami