Patents by Inventor Hiroki Maruo

Hiroki Maruo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070254497
    Abstract: A print circuit substrate is composed of a base material, a wiring pattern formed on the base material, the wiring pattern constituting a predetermined circuit pattern, and a connection terminal of a shape narrowing toward an end thereof, the connection terminal being formed on the base material and extending from the wiring pattern.
    Type: Application
    Filed: March 14, 2007
    Publication date: November 1, 2007
    Applicant: FUJIKURA LTD.
    Inventor: Hiroki Maruo
  • Publication number: 20070202306
    Abstract: There is provided a configuration in which rigid substrates are connected via flexible substrates, the connection configuration having a pair of rigid substrates each having a predetermined circuit pattern on a front and a reverse surface thereof, a first flexible substrate attached on the front surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the front surfaces, a second flexible substrate attached on the reverse surfaces of the pair of the rigid substrates so as to electrically connect the circuit patterns provided respectively on the reverse surfaces. The first and the second substrate have a gap therebetween smaller than a thickness of the pair of the rigid substrates.
    Type: Application
    Filed: February 27, 2007
    Publication date: August 30, 2007
    Applicant: FUJIKURA LTD.
    Inventors: Shinichi Nikaldo, Hiroki Maruo
  • Publication number: 20070197058
    Abstract: A printed wiring board having an insulating base material; a wiring formed on at least one surface of the insulating base material, the wiring forming a predetermined circuit pattern; a first connection terminal portion formed on the surface and electrically connected to the wiring, the first connection terminal portion having a first width; a second connection terminal portion formed on the surface and electrically connected to the wiring, the second connection terminal portion having a second width; and a cover layer configured to cover the wiring and expose the first and the second connection terminal portion.
    Type: Application
    Filed: February 16, 2007
    Publication date: August 23, 2007
    Applicant: FUJIKURA LTD
    Inventors: Tomofumi Kitada, Hiroki Maruo