Patent number: 7060737
Abstract: The invention relates to a curable resin composition, cured products thereof, and laminated materials. The curable composition comprises: (A-1) acicular oxide particles, the oxide being an oxide of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium, (B) a compound having two or more polymerizable unsaturated groups, (C) a photopolymerization initiator is provided. After cure, the composition has excellent scratch resistance. In addition, it may have excellent antistatic characteristics and transparency. In a preferred embodiment the composition also comprises (A-2) particles other than the acicular particles (A-1), being oxide of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium.
Type:
Grant
Filed:
March 29, 2002
Date of Patent:
June 13, 2006
Assignees:
DSM IP Assets B.V., JSR Corporation, Japan Fine Coatings Co., Ltd.
Inventors:
Yoshikazu Yamaguchi, Takayoshi Tanabe, Hiroki Nakajima, Hideaki Takase
Publication number: 20050084859
Abstract: The present invention provides, for example, DNA encoding a herbicide metabolizing protein selected from the protein group below. Such DNA may, for example, be employed to produce herbicidally resistant plants. <protein group>a protein comprising the amino acid sequence shown in SEQ ID NO: 1, 2, 3, 108, 159, 160, 136, 137, 138, 215, 216, 217, 218, 219, 220, 221, 222, 223 or 224, a protein having an ability to convert in the presence of an electron transport system containing an electron donor, a compound of formula (II): to a compound of formula (III): and comprising an amino acid sequence having at least 80% sequence identity with an amino acid sequence shown in any one of SEQ ID NO: 1, 2, 3, 108, 159, 136, 137, 138, 215, 216, 217, 218, 219, 220, 221, 222, 223 or 224 or an amino acid sequence having at least 90% sequence identity with an amino acid sequence shown in any one of SEQ ID NO: 160, 215, 216, 218, 222 or 224.
Type:
Application
Filed:
October 17, 2002
Publication date:
April 21, 2005
Inventors:
Hiroki Nakajima, Fujio Mukumoto, Masanao Takaishi