Abstract: A workpiece to be treated including aluminum or an aluminum alloy on at least a surface thereof is subjected to surface treatment by a method including the steps of immersing in an acidic or alkaline aluminum oxide film-removing solution containing a salt or oxide of a metal capable of substitution with aluminum and forming a substituted metal layer of the metal which is capable of substitution with aluminum and is contained in the removing solution on a surface of the aluminum or aluminum alloy while removing an aluminum oxide film on said aluminum or aluminum alloy surface, forming a substituted zinc film by zinc substitution treatment without removal of the substituted metal layer, removing the substituted metal layer along with the substituted zinc film by means of a liquid having an oxidizing behavior, and subjecting again to zinc substitution treatment to form a substituted zinc film.

Abstract: A medical imaging apparatus capable of concurrently performing a plurality of imaging operations including an imaging sequence setting unit configured to set a sequence for each of the plurality of imaging operations, an overlapping determination unit configured to determine temporal overlapping between an imaging sequence of an imaging operation that is currently performed and an imaging sequence for an imaging operation that is to be started, and an imaging sequence adjustment unit configured to adjust, based on a result of determination made by the overlapping determination unit, the imaging sequence for the imaging operation that is to be started.

Abstract: A medical imaging apparatus includes an imaging unit configured to capture an image of a subject, an imaging sequence registration unit configured to register an imaging sequence, and a display unit configured to display the imaging sequence registered by the imaging sequence registration unit.

Abstract: A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

Abstract: A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU 2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: There is disclosed a processing solution for metal replacement for metal aluminum or an aluminum alloy. The processing solution is used for surface processing of an underlying aluminum material. The processing solution for metal replacement removes an oxide film on the underlying aluminum material and suppresses corrosive attack to it to allow a plating film having high smoothness and good plating appearance to be deposited on the underlying aluminum material. The processing solution for metal replacement at least includes a metal salt capable of being replaced with aluminum, and an alkaline compound. A quaternary ammonium hydroxide is contained in the processing solution for metal replacement as the alkaline compound.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: To provide a cordless power tool which can suppress heat generation of a protection unit and prevent the erroneous operation. A cordless power tool 1 includes a body casing 10; a battery 20 which is detachably attached to the body casing 10 and can supply electric power; a motor 30 which is housed in the body casing 10, and generates rotation force by the electric power of the battery 20; a cooling fan 40 which rotates by the rotation force of the motor 30; and a protection unit 50 which shuts off the power supply to the motor 30, in accordance with a detection result of the state of the battery 20, so that the battery 20 does not enter an overdischarge state or an overcurrent state. Herein, a passage of cool air generated by the cooling fan 40 is formed in the body casing 10, and the 16 protection unit 50 is arranged so that at least its part is located in the passage of the cool air.

Abstract: A power tool including: a base slidable on a workpiece, and an opening provided through the base; a main unit supported to the base and movable in a first direction substantially perpendicular to the base, the main unit including an electric motor; a cutter driven by the electric motor, the cutter being capable of protruding through the opening from the base; a stopper pole supported to a housing coupled to the main unit, the stopper pole being movable in the first direction, the stopper pole having one end protruding from the housing toward the base, thereby regulating a moving distance of the cutter; a digital display unit including a moving distance detection portion for detecting a moving distance of the stopper pole and a digital display portion for displaying the moving distance; and a dust prevention member provided between a part of the stopper pole protruding toward the base and the moving distance detection portion, thereby preventing dust from entering into the housing.

Abstract: A solution for removing an aluminum oxide film from an aluminum or aluminum alloy surface, which includes a salt or oxide of a metal capable of substituting aluminum, a solubilizing agent for ions of the metal, and an alkali, and which has a pH Of 10 to 13.5. The removing solution makes it possible to form a film of the metal derived from the metal salt or oxide contained in the removing solution by dissolving away the oxide film from the aluminum or aluminum alloy surface at a low temperature and a high speed while restraining, as securely as possible, erosion of the aluminum or aluminum alloy surface. Besides, the removing solution ensures that even in the case where the thickness of the aluminum or aluminum alloy basis material is very small, the aluminum or aluminum alloy surface can be activated while assuredly leaving the aluminum or aluminum alloy basis material.

Abstract: A power tool has a base, a main unit, a cutter, a bolt, an engagement member, and a unit. The base has a sliding surface slidable on a workpiece, another surface opposite to the sliding surface, and an opening in the base. The main unit is movable in a first direction substantially perpendicular to the sliding surface. The cutter is driven by a electric motor in the main unit to protrude through the opening from the sliding surface during an operation. The bolt extends in the first direction on the first side, a first male thread, and one end supported by the base. The bolt is rotatable about the longitudinal axis. The engagement member has a first female thread threadably engaged with the male thread. The engagement member is movable between an engaged position with the boot and a disengaged position therewith. The unit maintains the engagement member at the disengaged position in a second direction.

Abstract: Electronic components differing in height (a CPU 2a, a capacitor 2b, and coil elements 2c) are mounted on a printed circuit board 1. A heat-absorbing member 3 is provided above the printed circuit board 1 in such a way that the member 3 contacts not only the top surface of the CPU 2a that is the shortest but the sides of the capacitor 2b and the coil elements 2c. To circulate a cooling medium, a flow path 4 is formed in the heat-absorbing member 3. Heat generated at the CPU2a is transmitted from its top surface to the cooling medium in the flow path 4 via the heat-absorbing member 3; heat generated at the capacitor 2b and the coil elements 2c is transmitted from their sides to the cooling medium in the flow path 4 via the heat-absorbing member 3.

Abstract: A soldering technology, particularly a lead-free soldering technology, that can secure the reliability of a whole electronic device is provided. In a method for manufacturing a printed circuit board for electronic devices with a substrate to which a plurality of electronic parts having connection terminals with different metal compositions are connected by soldering, a plurality of solder pastes comprising solder components with different compositions are used, and when the electronic parts are connected by soldering to the substrate, a solder paste having a solder component with a different composition is used for each of the metal compositions for the connection terminals of the electronic parts.

Abstract: To realize a flat heat exchanger with superior stability of the flow path, a heat exchanger for liquid cooling in which a cooling liquid flows inside the heat exchanger includes a pouch made of a water-resistant sheet having an inflow port and an outflow port for the cooling liquid; a heat exchange plate overlapping with the pouch; a presser plate pressing the pouch against the heat exchange plate; wherein protrusions and depressions delimiting a flow path linking the inflow port and the outflow port are formed on the inner side of at least one of the heat exchange plate and the presser plate.

Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).

Abstract: A power tool has a base, a main unit, a cutter, a bolt, an engagement member, and a unit. The base has a sliding surface slidable on a workpiece, another surface opposite to the sliding surface, and an opening in the base. The main unit is movable in a first direction substantially perpendicular to the sliding surface. The cutter is driven by a electric motor in the main unit to protrude through the opening from the sliding surface during an operation. The bolt extends in the first direction on the first side, a first male thread, and one end supported by the base. The bolt is rotatable about the longitudinal axis. The engagement member has a first female thread threadably engaged with the male thread. The engagement member is movable between an engaged position with the boot and a disengaged position therewith. The unit maintains the engagement member at the disengaged position in a second direction.