Abstract: A portable electrical tool includes a tip tool; a cylindrical housing accommodating a motor including a chuck attachably and detachably holding the tip tool at tip end of a rotation shaft; a base including a surface plate which slides on an upper surface of work material, and which allows the tip tool to protrude from the surface plate downwardly, a cylindrical portion including a cutout portion, and a lever having a cam surface, and rotatable to a fixed position and a release position. When the lever is in the fixed position, a gap at the cutout portion is narrowed to stop movement of the cylindrical housing. When the lever is in the release position, the cylindrical housing is movable by weight in the cylindrical portion. The tool includes a stopper to stop a rotation of the lever between the fixed position and the release position.

Abstract: A body flow path in a first housing having an MPU element communicates with an inner flow path and outer flow path formed in an inner heat-dissipating board and an outer heat-dissipating board, respectively, and a pump drives a cooling liquid to circulate in these flow paths. A beam is arranged between a pivot provided in a second housing and a pivot provided in the inner heat-dissipating board, a beam is arranged between the pivot of the inner heat-dissipating board and a pivot provided in the outer heat-dissipating board, and the inner heat-dissipating board and the outer heat-dissipating board are movable to the second housing. According to the operation of opening the second housing, a distance between the second housing and the inner heat-dissipating board, and a distance between the inner flow path and the outer flow path are increased.

Abstract: A plurality of carbon fibers having a surface having a metal-plated layer (Cu-plated layer) are stood vertically on a flat plate-like provisional substrate by electrostatic flocking, and one end of the carbon fibers is provisionally adhered to the provisional substrate with an adhesive. The other end of the carbon fibers which is not provisionally adhered is contacted with a substrate (Cu plate) having a surface coated with a solder paste and, in this state, a brazing material (solder) is melted and cooled, and carbon fibers and a substrate are brazed (soldered). After completion of mechanical and thermal connection between the substrate and the carbon fibers, this is immersed in an organic solvent, and the provisionally adhered provisional substrate is peeled from the carbon fibers to manufacture a radiating fin.

Abstract: A pattern is formed with an insulative resin on a bonding face of a silicon chip, which is a heat generating element, and a pattern is formed with the insulative resin on a bonding face of a heat sink, which is a heat dissipating element, in alignment with the insulative resin parts formed on the silicon chip. The silicon chip and the heat sink are bonded to each other via a heat transfer sheet. The silicon chip and the heat sink are bonded to each other by a metal to form metal connection portions in a region where no insulative resin parts are formed, while the silicon ship and the heat sink are bonded to each other by a resin to form resin connection portions in a region where the insulative resin parts are formed.

Abstract: A small-size and light-weight electronic apparatus with a cooling structure capable of exhibiting good cooling performance is provided. A cover member with a plurality of grooves for forming a channel is joined by brazing to a housing on a lid body side to which an LCD panel is attached, and these grooves are covered with the housing to form a channel for circulating a coolant. The housing constitutes a part of the channel, and the channel for the coolant is integrated into the housing. Heat generated by a main body is transferred to the lid body side by the coolant and dissipated outside through the housing that performs the function of a heat-radiation plate.

Abstract: A cooling structure for electronic equipment is designed for cooling a heat-generating body (2a) disposed inside a case (20) by recovering heat generated by the heat-generating body (2a) and dissipating the heat to the outside of the case (20). The cooling structure includes a heat-receiving section (4) for recovering heat generated in the heat-generating body (2a), a thermally insulated space (6) provided with an air inflow orifice (42a) and an air outflow orifice (42b) and thermally insulated from the heat-generating body (2a) and heat-receiving section (4) by a thermally insulating member (40), a heat-dissipating section (7) provided inside the thermally insulated space (6), a heat transfer member (5) for transferring the heat recovered in the heat-receiving section (4) to the heat-dissipating section (7), and a fan (22) for generating forcibly an air flow in the thermally insulated space (6).

Abstract: A portable electrical tool includes a tip tool; a cylindrical housing accommodating a motor including a chuck attachably and detachably holding the tip tool at tip end of a rotation shaft; a base including a surface plate which slides on an upper surface of work material, and which allows the tip tool to protrude from the surface plate downwardly, a cylindrical portion including a cutout portion, and a lever having a cam surface, and rotatable to a fixed position and a release position. When the lever is in the fixed position, a gap at the cutout portion is narrowed to stop movement of the cylindrical housing. When the lever is in the release position, the cylindrical housing is movable by weight in the cylindrical portion. The tool includes a stopper to stop a rotation of the lever between the fixed position and the release position.

Abstract: A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is contained in an amount exceeding the solubility limit of the metal powder with respect to the solder alloy at the melting point of the solder alloy powder. The solder paste may be used to form a structure for electrically connecting two objects by interposing a solder layer between their terminals.

Abstract: A cooperative diagnosis system for allowing a plurality of doctors to efficiently make a diagnosis in cooperation with each other is provided. When a terminal apparatus 112 on a requesting side 110 issues a diagnosis request to a server 120, the server 120 selects a doctor in charge of a diagnosis in accordance with preset priority levels, and transmits diagnosis request mail to the selected doctor's address in charge of the diagnosis. The doctor in charge of the diagnosis accesses the server 120 from his/her terminal 131A to browse examination data and register a diagnosis result in the server 120. The doctor on the requesting side 110 accesses the server 120 by using his/her terminal 112 to browse the diagnosis result.

Abstract: A thermal analysis in heating a print-circuit board in a reflowing furnace is simulated by a processor using data required for the design and thermal analysis of the printed-circuit board that carries solder-bonded components. The result of simulation indicates the possibility of existence of unmelted solder bonds heated at peak temperature below a predetermined lower limit and solder bonds heated at temperature above a predetermined upper limit. On the basis of the result, the components that are likely to be heated at inapplicable temperature are redesigned so that they can actually be heated at temperature in the predetermined range. The modification of design is displayed.

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

Abstract: A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is contained in an amount exceeding the solubility limit of the metal powder with respect to the solder alloy at the melting point of the solder alloy powder. The solder paste may be used to form a structure for electrically connecting two objects by interposing a solder layer between their terminals.

Abstract: A solder bump forming method includes the steps of packing solder (5) into a plurality of recesses (11) provided to the surface layer (12) of a substrate (1); and melting/hardening the solder to form solder bumps (5A) within the recesses (11). The solder bump forming method further includes, prior to the step of packing solder (5) into the plurality of recesses (11), a step of adhering or arranging a film (4) over the surface layer (12), and a step of producing in the film (4) a plurality of window portions (40) communicating with the plurality of recesses. The film (4) is composed of a material principal component of which is different from the material of the substrate (1).

Abstract: A thermal analysis in heating a print-circuit board in a reflowing furnace is simulated by a processor using data required for the design and thermal analysis of the printed-circuit board that carries solder-bonded components. The result of simulation indicates the possibility of existence of unmelted solder bonds heated at peak temperature below a predetermined lower limit and solder bonds heated at temperature above a predetermined upper limit. On the basis of the result, the components that are likely to be heated at inapplicable temperature are redesigned so that they can actually be heated at temperature in the predetermined range. The modification of design is displayed.

Abstract: A solder paste, includes a flux, a solder alloy particle scattered or mixed in the flux and including Sn and Zn as composition elements, and a metal particle scattered or mixed in the flux and including an element in the IB group in the periodic table as a composition element.

Abstract: The present invention relates to a method and apparatus for setting heating conditions in a heating furnace wherein a temperature distribution of an object to be heated is measured required minimum times and thermal analysis for the object is performed, thereby optimally heating the object.

Abstract: To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.

Abstract: An electronic apparatus comprising a housing, and an electronic part accommodated in the housing, wherein the housing includes a metallic member and a resin member molded integrally with the metallic member, the metallic member forming an outside part of the housing and being treated on its outer surface for enhancing a coefficient of heat radiation.

Abstract: In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit boad, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit boad with the first heater; and heating the electronic component with the second heater; wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.