Patents by Inventor Hiroki Yamagishi

Hiroki Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11968057
    Abstract: A document-usage control apparatus includes a memory in which a piece of relationship information is registered for each pair of users, the piece of relationship information indicating a relationship between the pair of users, and a processor configured to control use of a document to be shared at an online conference for each user attending the online conference, the use being controlled based on one or more pieces of relationship information registered in the memory.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: April 23, 2024
    Assignee: FUJIFILM Business Innovation Corp.
    Inventor: Hiroki Yamagishi
  • Patent number: 11916296
    Abstract: An antenna device, for a mobile body, of this disclosure includes an antenna configured to be installed in the mobile body, and a reflector having a reflection surface configured to change a beam direction of the antenna.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: February 27, 2024
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Yutaro Miki, Suguru Yamagishi, Takanori Fukunaga, Ichiro Kuwayama, Toyohisa Takano, Hiroki Hirai, Norichika Oomi, Kosuke Sone, Yasuyuki Yamamoto
  • Publication number: 20230086705
    Abstract: A document-usage control apparatus includes a memory in which a piece of relationship information is registered for each pair of users, the piece of relationship information indicating a relationship between the pair of users, and a processor configured to control use of a document to be shared at an online conference for each user attending the online conference, the use being controlled based on one or more pieces of relationship information registered in the memory.
    Type: Application
    Filed: April 1, 2022
    Publication date: March 23, 2023
    Applicant: FUJIFILM Business Innovation Corp.
    Inventor: Hiroki YAMAGISHI
  • Publication number: 20220083292
    Abstract: An information processing apparatus includes a processor configured to: perform a first authentication process to authenticate a user; and if a job is stored on a second accumulator having a higher security level than a first accumulator by the user authenticated via the first authentication process, perform as an additional authentication process a second authentication process different from the first authentication process.
    Type: Application
    Filed: April 7, 2021
    Publication date: March 17, 2022
    Applicant: FUJIFILM Business Innovation Corp.
    Inventor: Hiroki YAMAGISHI
  • Patent number: 9768045
    Abstract: The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: September 19, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 9711385
    Abstract: The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: July 18, 2017
    Assignees: Shin-Etsu Polymer Co., Ltd., Miraial Co., Ltd.
    Inventors: Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi, Tsuyoshi Nagashima, Shuichi Inoue, Chiaki Matsutori, Takaharu Oyama
  • Patent number: 9698033
    Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 4, 2017
    Assignees: MIRAIAL CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 9387960
    Abstract: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
    Type: Grant
    Filed: July 3, 2012
    Date of Patent: July 12, 2016
    Assignees: Miraial Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventors: Tsuyoshi Nagashima, Shuichi Inoue, Takaharu Oyama, Chiaki Matsutori, Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi
  • Publication number: 20150318195
    Abstract: The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.
    Type: Application
    Filed: November 21, 2013
    Publication date: November 5, 2015
    Applicants: Shin-Etsu Polymer Co., Ltd., Miraial Co., Ltd.
    Inventors: Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi, Tsuyoshi Nagashima, Shuichi Inoue, Chiaki Matsutori, Takaharu Oyama
  • Publication number: 20150294882
    Abstract: The lid body side wafer support parts allow flexibility to be exhibited and supports the wafers. If a closed state substrate is defined as being a wafer which is stored in the substrate storing space in a container main body in a state wherein the container main body opening portion is closed by the lid body, and a closed time center is defined as being the center of a closed state substrate, the back side substrate support portion, when a closed state substrate is viewed in the thickness direction, are disposed in a pair about a depth direction reference line and support the wafer. A center angle which the back side substrate support portion form toward the depth direction with respect to a left/right direction reference line when a closed state substrate is viewed in the thickness direction is 20-55°.
    Type: Application
    Filed: November 20, 2012
    Publication date: October 15, 2015
    Inventors: Chiaki MATSUTORI, Tsuyoshi NAGASHIMA, Takaharu OYAMA, Shuichi INOUE, Hiroyuki SHIDA, Hiroki YAMAGISHI, Kazumasa OHNUKI
  • Publication number: 20150279711
    Abstract: A substrate storing container is provided with a lid-body-side substrate support section that can support the edges of a plurality of substrates when a container main body opening is occluded by the lid body. The lid-body-side substrate support section is provided with: a lid-body-side substrate receiving section and a pair of lid-body-side leg sections respectively connected to one end and the other end of the lid-body-side substrate receiving section. One lid-body-side leg section of the pair of lid-body-side leg sections is fixed at the outside of a concavity for fixing a lid-body leg section, and the other lid-body-side leg section of the pair of lid-body-side leg sections is fixed within the concavity for fixing a lid-body leg section.
    Type: Application
    Filed: October 12, 2012
    Publication date: October 1, 2015
    Inventors: Chiaki Matsutori, Tsuyoshi Nagashima, Takaharu Oyama, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Ohnuki
  • Patent number: 8960442
    Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: February 24, 2015
    Assignees: Miraial Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventors: Takaharu Oyama, Chiaki Matsutori, Tsuyoshi Nagashima, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Onuki
  • Publication number: 20140367307
    Abstract: Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.
    Type: Application
    Filed: November 8, 2011
    Publication date: December 18, 2014
    Inventors: Takaharu Oyama, Chiaki Matsutori, Tsuyoshi Nagashima, Shuichi Inoue, Hiroyuki Shida, Hiroki Yamagishi, Kazumasa Onuki
  • Patent number: 8881907
    Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: November 11, 2014
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Hiroki Yamagishi, Toshiyuki Kamada
  • Publication number: 20140138279
    Abstract: A substrate storing container includes: a container body for storing semiconductor wafers; a door that is fitted to the front of the container body; and a locking mechanism locking the door. The locking mechanism includes: a rotary driver that is supported by the door and operated from a cover plate side; and a locking bar that vertically slides as the rotary driver rotates to bring the distal end into, and out of, a locking hollow of the container body. The rotary driver is separated into first and second rotary drivers. The first and second rotary drivers are formed with first and second cam portions, respectively. The first and second cam portions are made to support the proximal end of the locking bar therebetween so that the locking bar can sway in the thickness direction of the door.
    Type: Application
    Filed: July 3, 2012
    Publication date: May 22, 2014
    Applicants: SHIN-ETSU POLYMER CO., LTD., MIRAIAL CO., LTD.
    Inventors: Tsuyoshi Nagashima, Shuichi Inoue, Takaharu Oyama, Chiaki Matsutori, Kazumasa Ohnuki, Hiroyuki Shida, Hiroki Yamagishi
  • Publication number: 20130032509
    Abstract: A substrate storage container is provided with a container body for aligning and storing a plurality of sheets of semiconductor wafers, and a lid for detachably opening/closing an open front of the container body, in which a robotic flange for conveyance is attached on a substantially center portion of a ceiling of the container body, in which heavy gravity center position adjustment member is provided at a rear portion of the container body such as on a rear wall, a side wall rear portion so that inclination of the substrate container body toward the lid side is regulated with the gravity center position adjustment member.
    Type: Application
    Filed: April 8, 2011
    Publication date: February 7, 2013
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Hiroki Yamagishi, Toshiyuki Kamada
  • Publication number: 20120325708
    Abstract: A substrate storage container includes: a container body molded of molding material in a front open box type for storing substrates; a door element fitted to an opening at the front of the container body; and a compressively deformable gasket for sealing between the container body and the door element. The opening of the container body is projected sidewards and outwards forming a rim portion. A sealing surface for the gasket is formed on an inner surface of the rim portion. The container body is formed with a reinforcing rib directed toward the rim portion. An opposing portion of the reinforcing rib that opposes the rim portion of the container body is reduced in thickness so as to prevent a depression from forming in the sealing surface of the rim portion during molding the container body.
    Type: Application
    Filed: September 5, 2012
    Publication date: December 27, 2012
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Shigenobu Sasaki, Shinichi Ohori, Hiroki Yamagishi
  • Patent number: 8318275
    Abstract: A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.
    Type: Grant
    Filed: November 14, 2007
    Date of Patent: November 27, 2012
    Assignees: Shin-Etsu Handotai Co., Ltd., Shin-Etsu Polymer Co., Ltd.
    Inventors: Hideo Kudo, Hiroki Yamagishi
  • Patent number: 8292081
    Abstract: A container includes: a container body for storing substrates of semiconductor wafers; a door element detachably fitted to an open front portion of the container body; and a compressively deformable gasket for sealing between the container body and the door element. While a sealing surface for the gasket is formed on an inner periphery of an open front portion of the container body so that the difference between the maximum and minimum of a flatness is less than 0.50 mm, a fitting portion for the gasket is formed in a frame shape. The gasket is formed of a base fitted to the fitting portion; a flexible sealing part extended from the base toward the sealing surface; and a contact portion that is curvedly formed at a distal end of the sealing part and put in press-contact with the sealing surface.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: October 23, 2012
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Shigenobu Sasaki, Shinichi Ohori, Hiroki Yamagishi
  • Publication number: 20110064896
    Abstract: A multicolor molding article is integrally formed of first and second molding materials in combination. At least part of the peripheral portion in the boundary between a first molding part of the first molding material and a second molding part of the second molding material is formed with a thin projected piece. The tapering inclined angle of the thin projected piece is specified to range from 5° to 40°.
    Type: Application
    Filed: November 14, 2007
    Publication date: March 17, 2011
    Applicants: SHIN-ETSU HANDOTAI CO., LTD., SHIN-ETSU POLYMER CO., LTD.
    Inventors: Hideo Kudo, Hiroki Yamagishi