Patents by Inventor Hiroki Yamagishi

Hiroki Yamagishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7789240
    Abstract: A substrate container includes: a container main body including an opening and containing a substrate; a lid body closing the opening; and a pair of handles provided on a pair of opposing side walls of the container main body, and the handle is secured to an edge portion of the side wall.
    Type: Grant
    Filed: April 16, 2008
    Date of Patent: September 7, 2010
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Hiroki Yamagishi, Yoshiaki Fujimori
  • Publication number: 20090206001
    Abstract: A container includes: a container body for storing substrates of semiconductor wafers; a door element detachably fitted to an open front portion of the container body; and a compressively deformable gasket for sealing between the container body and the door element. While a sealing surface for the gasket is formed on an inner periphery of an open front portion of the container body so that the difference between the maximum and minimum of a flatness is less than 0.50 mm, a fitting portion for the gasket is formed in a frame shape. The gasket is formed of a base fitted to the fitting portion; a flexible sealing part extended from the base toward the sealing surface; and a contact portion that is curvedly formed at a distal end of the sealing part and put in press-contact with the sealing surface.
    Type: Application
    Filed: May 21, 2007
    Publication date: August 20, 2009
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Shigenobu Sasaki, Shinichi Ohori, Hiroki Yamagishi
  • Publication number: 20080251415
    Abstract: A substrate container includes: a container main body including an opening and containing a substrate; a lid body closing the opening; and a pair of handles provided on a pair of opposing side walls of the container main body, and the handle is secured to an edge portion of the side wall.
    Type: Application
    Filed: April 16, 2008
    Publication date: October 16, 2008
    Applicant: SHIN-ETSU POLYMER CO., LTD.
    Inventors: Hiroki Yamagishi, Yoshiaki Fujimori
  • Patent number: 6638091
    Abstract: A socket for an electrical part comprises an open/close member mounted, to be rotatable about a rotational shaft, to a socket body in which an electrical part is accommodated, an urging member for urging the open/close member in a closed direction thereof, and an operation member vertically movable with respect to the socket body. The open/close member is opened against the urging force of the urging member by depressing the operation member the urging member has one end portion engaged with a portion of the open/close member apart from a rotation center thereof and another end portion engaged with the operation member.
    Type: Grant
    Filed: February 1, 2002
    Date of Patent: October 28, 2003
    Assignee: Enplas Corporation
    Inventor: Hiroki Yamagishi
  • Publication number: 20020106925
    Abstract: A socket for an electrical part comprises an open/close member mounted, to be rotatable about a rotational shaft, to a socket body in which an electrical part is accommodated, an urging member for urging the open/close member in a closed direction thereof, and an operation member vertically movable with respect to the socket body. The open/close member is opened against the urging force of the urging member by depressing the operation member. the urging member has one end portion engaged with a portion of the open/close member apart from a rotation center thereof and another end portion engaged with the operation member.
    Type: Application
    Filed: February 1, 2002
    Publication date: August 8, 2002
    Applicant: Enplas Corporation
    Inventor: Hiroki Yamagishi
  • Patent number: 6083013
    Abstract: An IC socket includes a socket body (1) for supporting lower end sections of bow-shaped contact pins (3), a floating member (2) provided with holes (2a) for guiding upper end sections of the contact pins (3), and a cover member (4) for pressing the floating member. Borders of the guide holes (2a) act as stoppers for the upper end sections of the contact pins (3) for regulating height of projection thereof from the floating member (2) and contact positions thereof in reference to solder ball terminals to prevent damage to the solder ball terminals of the IC package even if the solder balls are softened under a heat-resistance test or the like. In one embodiment, the IC socket can effectively perform wiping of the solder balls when it is used at an ordinary temperature. The cover member (4) may be used and formed with a surface (4b) for first engaging the IC package and another surface (4a) for subsequently engaging the top surface of the floating member (2).
    Type: Grant
    Filed: July 9, 1997
    Date of Patent: July 4, 2000
    Assignee: Enplas Corporation
    Inventor: Hiroki Yamagishi
  • Patent number: 5800194
    Abstract: An IC socket includes a cover member vertically movable; a mounting device for placing an IC package; a slide member having a plurality of contact pins inserted therein, horizontally movable; an operating member reciprocating in accordance with the vertical movement of the cover member; and a position control device coming in contact with the slide member to press and move the slide member in a direction perpendicular to the contact surface and to enable the slide member to regain its original position. Thus, the connecting terminals of the IC package are wiped at a moderate contact pressure, and the IC socket having excellent conducting properties can be provided.
    Type: Grant
    Filed: September 25, 1996
    Date of Patent: September 1, 1998
    Assignee: Enplas Corporation
    Inventor: Hiroki Yamagishi
  • Patent number: 5095706
    Abstract: A start-up method of a steam turbine plant including a condenser is disclosed. The condenser includes a tube bundle composed of a number of pipes for condensing an exhaust steam from a steam turbine and a hot well for receiving and storing a condensate therein. The interior of the condenser is airtightly divided into two spaces with a partition therebetween, one of them being an upper space containing the tube bundle and the other one being a lower space containing the hot well. A communication passageway(s) extends between the upper space and the lower space with an isolation valve in the form of a butterfly valve disposed on the communication passageway. At the shut-down of the steam turbine plant, the isolation valve is closed to isolate the upper space from the lower space while the lower space is maintained in vacuum.
    Type: Grant
    Filed: March 21, 1991
    Date of Patent: March 17, 1992
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Kohei Saito, Hiroki Yamagishi, Toshiki Furukawa, Toshio Sato, Hiroshi Hamano, Yoshio Nakano, Katsuaki Tanaka, Satoru Sakamoto