Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

Abstract: A method for manufacturing an absorbent article, the method including: while a lower bandlike member is transported in a transport direction, a process in which a cutting position is determined and an adhesion area is formed on each side of the cutting position of the lower bandlike member in the transport direction; a process in which leg elastic members are placed so that a part of each of the leg elastic members overlaps the adhesion area, the leg elastic members being stretched in a direction having a component parallel to the transport direction; a process in which an upper bandlike member is stacked on and adheres to the lower bandlike member and the leg elastic member on the adhesion area; a process in which the lower bandlike member and the upper bandlike member are folded on the center in the intersecting direction; a process in which a welded section on which the lower bandlike member and the upper bandlike member are to be welded to each other is formed on each side of the cutting position in the t

Abstract: Irradiation with a laser beam is started at a welding start position of two members that are stacked together, and the output of the laser beam is set so that spatter is not generated. After the start of the irradiation, the output of the laser beam is gradually increased so that a penetration depth from an irradiated edge to a deeper location between abutting surfaces of the two members falls within a predetermined penetration depth range while the laser beam is not moved. After the output of the laser beam is gradually increased, the laser beam is moved toward a welding end position so that the penetration depth is maintained within the penetration depth range.

Abstract: A chip part includes a substrate, an element formed on the substrate, and an electrode formed on the substrate. A recess and/or projection expressing information related to the element is formed at a peripheral edge portion of the substrate.

Abstract: An information processing apparatus includes circuitry to designate an attribute of an image object to be superimposed with an additional object and perform first identification to identify an image object indicating the attribute designated, among image objects included in image data. The circuitry performs second identification to identify an image object that has not yet been superimposed with an additional object, among image objects identified by the first identification, and generates the additional object to be superimposed on the image object identified by the second identification.

Abstract: An information processing apparatus includes an attribute specifying unit, a first identifying unit, and a creating unit. The attribute specifying unit is configured to specify an attribute of an image object that is a subject on which a n additional object indicating an additional image object is superimposed. The first identifying unit is configured to identify all image objects having the attribute specified by the attribute specifying unit from among a plurality of image objects included in image data. The creating unit is configured to create, for each of the image objects identified by the first identifying unit, the additional object that has an identical shape to the image object and that is to be superimposed on the image object.

Abstract: A method for manufacturing a spark plug includes pressing a tip in a first direction from a first surface thereof toward a second surface thereof via a jig when the tip is in contact with an electrode base material; and welding the electrode base material to the tip being pressed by the jig. The jig has a recessed portion which is brought into contact with an edge of the tip, and the recessed portion has a diameter-decreasing portion having an inner dimension that gradually decreases toward a second direction opposite to the first direction. The inner dimension of a first end portion in the first direction of the diameter-decreasing portion is larger than the outer dimension of the edge, and the inner dimension of a second end portion in the second direction of the diameter-decreasing portion is equal to the outer dimension of the edge.

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Abstract: A method for manufacturing a spark plug includes pressing a tip in a first direction from a first surface thereof toward a second surface thereof via a jig when the tip is in contact with an electrode base material; and welding the electrode base material to the tip being pressed by the jig. The jig has a recessed portion which is brought into contact with an edge of the tip, and the recessed portion has a diameter-decreasing portion having an inner dimension that gradually decreases toward a second direction opposite to the first direction. The inner dimension of a first end portion in the first direction of the diameter-decreasing portion is larger than the outer dimension of the edge, and the inner dimension of a second end portion in the second direction of the diameter-decreasing portion is equal to the outer dimension of the edge.

Abstract: A cathode assembly is provided in which, while preventing the occurrence of abnormal electric discharging between a projected portion of a backing plate and a side surface of a target, particles can be prevented from being generated. The cathode assembly for a sputtering apparatus of this invention has: a target made of an insulating material; a backing plate bonded to one surface of the target; and, where such a side of the backing plate as is on the side of the target is defined as a lower side, an annular shield plate disposed to lie opposite to the lower side of that projected portion of the backing plate which is projected outward beyond an outer peripheral end of the target. The cathode assembly has a bonding portion arranged to be protruded relative to the projected portion.

Abstract: An apparatus for generating data includes a display unit that displays an area object the contour of which is extracted from an image to be processed by an image processing application, an operating unit that receives selection conditions for selecting an area object that is intended by a user out of the area objects displayed by the display unit, and a contour extracting unit that extracts a contour of an area object selected based on the selection conditions received by the operating unit. When the contour extracting unit extracts a contour of a selected area object, the display unit displays the selected area object and an unselected area object in a distinguishable manner.

Abstract: While conveying paper, the paper is folded in a first folding pattern at right angles to the conveyance direction. By bending and rupturing the folded paper, one or multiple perforation lines corresponding to a second folding pattern that is at right angles to the fold(s) are formed in the paper. While conveying the paper with perforations in a direction at right angles to the previous conveyance direction, the paper is folded in the second folding pattern along the perforations, thereby forming a quire.

Abstract: A manufacturing apparatus for manufacturing an absorbent article, the manufacturing apparatus including: an upstream transport mechanism and a downstream transport mechanism that transports a stretchable sheet-like member along a transporting direction, the stretchable sheet-like member continuing along the transporting direction; an extension-ratio adjustment mechanism that is located between the upstream transport mechanism and the downstream transport mechanism, and that adjusts an extension ratio at which the stretchable sheet-like member extends in the transporting direction; and a processing apparatus that performs the certain process to the stretchable sheet-like member that is being transported by the downstream transport mechanism.

Abstract: An information processing apparatus includes processing circuitry configured to specify, with respect to image data including a plurality of image objects each having an attribute. The processing circuitry is further configured to identify all image objects having the specified attribute from among the plurality of image objects, and to create, for each of the identified image objects with the same attribute, an additional object that has an identical shape to the image object and that is to be superimposed on the image object.

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Abstract: A first press unit 2 presses each of a plurality of signatures S along a fold f, the signatures being supplied one at a time with the fold facing forward. The unit is arranged a signature conveyance unit 3 that conveys each signature received from, the first press unit while controlling the attitude to make the fold orthogonal to the conveyance direction. The unit is arranged a gluing unit 4 that applies glue to both lateral edges of a top surface of each signature received from the signature conveyance unit. The unit is arranged an accumulation unit 5 that sequentially stacks the signatures received from the gluing unit on one another while jogging the stacked signatures to form a book block B. The unit is arranged a second press unit 6 that discharges the book block received from the accumulation unit after pressing the same along the folds.

Abstract: A manufacturing apparatus for manufacturing an absorbent article, the manufacturing apparatus including: an upstream transport mechanism and a downstream transport mechanism that transports a stretchable sheet-like member along a transporting direction, the stretchable sheet-like member continuing along the transporting direction; an extension-ratio adjustment mechanism that is located between the upstream transport mechanism and the downstream transport mechanism, and that adjusts an extension ratio at which the stretchable sheet-like member extends in the transporting direction; and a processing apparatus that performs the certain process to the stretchable sheet-like member that is being transported by the downstream transport mechanism.

Abstract: Provided is an insulated radiating rubber molded article that can be pre-installed in an electrical apparatus such as an LED package, can improve handling properties during attachment work, and moreover can exert superior insulating characteristics and radiating characteristics. To achieve the objective, the insulated radiating rubber molded article, which, by means of being interposed between a base and the electrical apparatus when attaching the electrical apparatus, which emits heat alongside the operation thereof, to the base, promotes radiating from the electrical apparatus and electrically insulates the electrical apparatus from the base, is characterized by having a 3D shape by means of being integrally provided with: a flat surface section disposed between the electrical apparatus and the base; and a lateral surface section disposed around the electrical apparatus.

Abstract: A Schottky barrier diode includes a semiconductor layer having a major surface, a diode region of a first conductivity type formed in a surface layer portion of the semiconductor layer, a first conductivity type impurity region formed in the surface layer portion of the semiconductor layer and electrically connected to the diode region, a first electrode layer formed on the major surface of the semiconductor layer and forming a Schottky junction with the diode region, a second electrode layer formed on the major surface of the semiconductor layer and forming an ohmic junction with the first conductivity type impurity region, and a contact electrode layer formed on a peripheral region of the major surface of the semiconductor layer surrounding the first electrode layer so as to be electrically connected to the diode region via the semiconductor layer and being electrically connected to the second electrode layer.

Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.