Abstract: Irradiation with a laser beam is started at a welding start position of two members that are stacked together, and the output of the laser beam is set so that spatter is not generated. After the start of the irradiation, the output of the laser beam is gradually increased so that a penetration depth from an irradiated edge to a deeper location between abutting surfaces of the two members falls within a predetermined penetration depth range while the laser beam is not moved. After the output of the laser beam is gradually increased, the laser beam is moved toward a welding end position so that the penetration depth is maintained within the penetration depth range.

Abstract: In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Abstract: A light-emitting element according to the present invention includes a semiconductor light-emitting element having a front surface and a rear surface so that light is extracted from the rear surface, and having a first n-side electrode and a first p-side electrode on the front surface, and a support element having a conductive substrate having a front surface and a rear surface as well as a second n-side electrode and a second p-side electrode formed on the front surface of the conductive substrate, the first n-side electrode and the second n-side electrode, and the first p-side electrode and the second p-side electrode are so bonded to one another respectively that the semiconductor light-emitting element is supported by the support element in a facedown posture downwardly directing the front surface, and the support element has an n-side external electrode and a p-side external electrode formed on the rear surface of the conductive substrate, a conductive via passing through the conductive substrate from th

Abstract: An information processing apparatus includes: an object aggregating unit configured to aggregate spot color objects that are object to be printed in respective spot colors, for each of types of the spot color objects based on drawing information indicating the spot colors or methods of printing in the spot colors, to place the spot color objects on spot color layers corresponding to the types.

Abstract: A chip part includes a substrate, an element formed on the substrate, and an electrode formed on the substrate. A recess and/or projection expressing information related to the element is formed at a peripheral edge portion of the substrate.

Abstract: The present invention is directed to a chip diode with a Zener voltage Vz of 4.0 V to 5.5 V, including a semiconductor substrate having a resistivity of 3 m?·cm to 5 m?·cm and a diffusion layer formed on a surface of the semiconductor substrate and defining a diode junction region with the semiconductor substrate therebetween, in which the diffusion layer has a depth of 0.01 ?m to 0.2 ?m from the surface of the semiconductor substrate.

Abstract: A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

Abstract: In an electronic component mounting system 1 configured by coupling electronic component mounting devices M1 to M4A each having a first substrate transport mechanism 12A and a second substrate transport mechanism 12B together, the electronic component mounting device M4A includes a first tray feeder 20A that stores an electronic component extracted by a first mounting head 15A of a component mounting mechanism as a first work operation mechanism, and a second tray feeder 20B that stores an electronic component extracted by a second mounting head 15B of a component mounting mechanism as a second work operation mechanism.

Abstract: There is provided an insulator target which, when mounted on a sputtering apparatus and supplied with AC power, is capable of preventing the discharging from occurring in a clearance between a shield and the target. The insulator target for the sputtering apparatus according to this invention, around which is disposed a shield at the time of assembling the insulator target on the sputtering apparatus, is made up of: a plate-shaped target material to be enclosed by the shield; and, suppose that one surface of the target material is defined as a sputtering surface to be subjected to sputtering, an annular supporting material coupled to an outer peripheral portion of the opposite surface of the target material. The supporting material has an extended portion which is extended outward from a peripheral surface of the target material and which keeps a predetermined clearance to the shield.

Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.

Abstract: A chip part includes a substrate, an element formed on the substrate, and an electrode formed on the substrate. A recess and/or projection expressing information related to the element is formed at a peripheral edge portion of the substrate.

Abstract: The present invention is directed to a chip diode with a Zener voltage Vz of 4.0 V to 5.5 V, including a semiconductor substrate having a resistivity of 3 m?·cm to 5 m?·cm and a diffusion layer formed on a surface of the semiconductor substrate and defining a diode junction region with the semiconductor substrate therebetween, in which the diffusion layer has a depth of 0.01 ?m to 0.2 ?m from the surface of the semiconductor substrate.

Abstract: A manufacturing apparatus for manufacturing a composite sheet associated with an absorbent article, including: a producing device that produces a substrate sheet by fixing a stretchable sheet to at least low-extensible sheet, the stretchable sheet continuing along a transporting direction, the stretchable sheet being in an extended state in which the stretchable sheet is extended in the transporting direction, the producing is performed while the producing device is transporting the stretchable sheet; a reference-section forming apparatus that forms a physical reference section on the substrate sheet, the substrate sheet being in a first extended state and being transported; a contraction apparatus in which the substrate sheet that has the reference section formed on it contracts until the substrate sheet becomes in a second extended state whose extension ratio is smaller than an extension ratio of the first extended state; and a processing apparatus that performs the certain process to the substrate sheet, t

Abstract: A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

Abstract: There is provided a cutter apparatus for cutting a composite sheet including a stretchable sheet and a low-extensible sheet, the low-extensible sheet being stacked on the stretchable sheet from a thickness direction and fixed to the stretchable sheet, the low-extensible sheet having an extensibility lower than that of the stretchable sheet. The cutter apparatus includes: a cutter blade that abuts the composite sheet from a side closer to the stretchable sheet; and a receiving section that have a surface area and that receives the cutter blade while abutting the composite sheet from a side closer to the low-extensible sheet.

Abstract: A restraining roller of a hook winch has a roller middle part and first and second roller end parts. The roller middle part is formed in a columnar shape. Each of the first and second roller end parts is formed in a roughly circular truncated cone shape. The widths of the first and second roller end parts are greater than the diameter of a wire rope. A difference in diameter between an inner end and outer end of each of the first and second roller end parts is less than the diameter of the wire rope. Taper angles of the first and second roller end parts are different from each other.

Abstract: A bidirectional Zener diode includes a substrate. A first conductivity type base region is formed in a surficial portion of the substrate. A second conductivity type first impurity region is formed in a surficial portion of the base region so as to form a pn junction with the base region. A second conductivity type second impurity region is formed in a surficial portion of the base region in a manner spaced apart from the first impurity region so as to form a pn junction with the base region. A first electrode is arranged at the surface of the substrate. A second electrode is arranged at the surface of the substrate. A dimension of the base region along the surface of the substrate between the first impurity region and the second impurity region is equal to or greater than 4.0 ?m and equal to or smaller than 12.5 ?m.

Abstract: An information processing apparatus includes an attribute specifying unit, a first identifying unit, and a creating unit. The attribute specifying unit is configured to specify an attribute of an image object that is a subject on which an additional object indicating an additional image object is superimposed. The first identifying unit is configured to identify all image objects having the attribute specified by the attribute specifying unit from among a plurality of image objects included in image data. The creating unit is configured to create, for each of the image objects identified by the first identifying unit, the additional object that has an identical shape to the image object and that is to be superimposed on the image object.

Abstract: A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.