Abstract: A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.

Abstract: A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.

Abstract: A semiconductor device having a heat dissipation plate which is lighter in weight and smaller in thickness than the conventional metal plate while ensuring a good thermal dissipation and mechanical support, which comprises: a semiconductor chip having a back surface bonded to a lower surface of a heat dissipation plate having an area larger than that of the semiconductor chip; a wiring board composed of a substrate having an upper surface with conductor patterns formed thereon, the conductor patterns having first ends connected to external connection terminals downwardly penetrating through the substrate via through holes extending through the substrate, the external connection terminals being disposed between a periphery of the semiconductor chip and a periphery of the wiring substrate; the semiconductor chip and the wiring board being bonded to each other so that electrode terminals formed on an active surface of the semiconductor chip are electrically connected to second ends of the conductor patterns; and

Abstract: A heat radiation fin comprises a substrate having a high thermal conductivity and a plurality of heat radiation plates. The heat radiation plates are arranged upright on the substrate with predetermined intervals therebetween. Each of the heat radiation plates is formed of a heat-resistant resin containing carbon fibers.

Abstract: A semiconductor device having a first electronic part and a second electronic part, the first electronic part being larger than the second electronic part in area and in the number of connection terminal pads including pad form electrode terminals, and external connection terminals or other connection terminals bonded to the connection terminal pads, wherein the first and second electronic parts are disposed one upon the other with respective pad forming surfaces facing each other and are electrically connected to each other by flip-chip bonding; and springy wire form connection terminals stand on, and are bonded to, the connection terminal pads of the first electronic part other than those electrically connected to the connection terminal pads of the second electronic part.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: A positioning apparatus includes: a stage having a flat placement surface on which a thin plate is mounted. The placement surface has a flat region which is slightly larger than and completely covers that of said thin plate. The placement surface also has lateral side edges. An optical detecting means is arranged above the stage for detecting a mark provided on the thin plate and has such a view that the mark can be caught by the view if the thin plate placed on the placement surface is within the flat region, but the mark cannot be caught by the view if the thin plate placed on the placement surface protrudes by a part thereof from the region of the placement surface. A movable part pushes the thin plate until it comes into contact with the lateral edge to move the thin plate so that the thin plate is brought within the flat region of the placement surface.

Abstract: A semiconductor device comprises a substantially flat interconnection substrate having an interconnection pattern formed on a surface thereof. A semiconductor element is mounted on the substantially flat interconnection substrate so that an electrode terminal of the semiconductor element is electrically connected to the interconnection pattern. A heat radiation plate is formed in a form of a sheet having a concave portion so as to cover the semiconductor element and is bonded on the surface of the substantially flat interconnection substrate. An external connection terminal is formed on the other surface of the substantially flat interconnection substrate so as to penetrate through the substantially flat interconnection substrate and be electrically connected to the interconnection pattern. The heat radiation plate is formed of a heat-resistant resin containing carbon fibers.

Abstract: In a semiconductor device including an insulating core substrate, a plurality of layers of wiring patterns on the core substrate and insulating layers interposed between the wiring patterns, each adjacent pair of the wiring patterns being electrically connected through a conductor portion penetrating through the insulating layer interposed between them, each of the insulating layers is formed integrally, semiconductor chips thinner than one layer of the insulating layer are mounted into at least one of the insulating layers, and the semiconductor chips are electrically connected to one layer of the wiring pattern of one insulating layer adjacent on the side of the core substrate.