Abstract: A method for producing an electrode foil includes an electrolytic etching step of etching a metal foil containing first metal by applying current between the metal foil and an electrode in etching liquid while a principal surface of the metal foil faces the electrode. A masking member is disposed between the principal surface of the metal foil and the electrode so as to cover a partial region of the principal surface. The masking member is an electric conductor. The masking member is electrically connected with the metal foil.

Abstract: An optical module includes a light-forming part configured to form light; and a protective member that includes an output window configured to transmit light from the light-forming part and that is disposed so as to surround the light-forming part. The light-forming part includes a base member; a plurality of semiconductor light-emitting devices mounted on the base member and configured to emit light differing from each other in wavelength; and a filter mounted on the base member and configured to directly receive and coaxially multiplex diverging light from the plurality of semiconductor light-emitting devices.

Abstract: A method for producing an electrode foil includes: a first step of preparing a metal foil, the metal foil having a strip shape; a second step of disposing a masking member so as to cover part of a principal surface of the metal foil; and a third step of partially etching the principal surface of the metal foil by applying current between the metal foil and an electrode while the metal foil faces the electrode via the masking member in etching liquid after the second step. The masking member has a strip shape. In the second step, the masking member is disposed along a longitudinal direction of the metal foil so as to be separated from both side edges of the metal foil.

Abstract: An optical module includes a semiconductor laser and a linear polarizer that is disposed in an emission direction of the semiconductor laser and that is configured to transmit, of light emitted by the semiconductor laser, only light containing a linearly polarized light component in a specific direction.

Abstract: An optical module includes a base member, a red semiconductor laser, a green semiconductor laser, a blue semiconductor laser, a first lens to change a spot size of light emitted from the red semiconductor laser, a second lens to change a spot size of light emitted from the green semiconductor laser, a third lens to change a spot size of light emitted from the blue semiconductor laser, a first light receiving device having a first light receiving face that receives backward red light emitted from the red semiconductor laser in an opposite direction to light emitted therefrom toward the first lens, a second light receiving device having a second light receiving face that receives backward green light emitted from the green semiconductor laser in an opposite direction to light emitted therefrom toward the second lens, a third light receiving device having a third light receiving face that receives backward blue light emitted from the blue semiconductor laser in an opposite direction to light emitted therefrom to

Abstract: An optical module control method is a method for controlling an optical module that includes a semiconductor light emitting element and an electronic cooling module configured to adjust a temperature of the semiconductor light emitting element. The optical module control method includes a step of detecting a temperature of a light emitting unit including the semiconductor light emitting element, and outputting temperature information of the semiconductor light emitting element; a step of detecting an environmental temperature and outputting temperature information of the environmental temperature, the environmental temperature being a temperature of environment where the light emitting unit is placed; and a step of controlling an output of the electronic cooling module on the basis of the temperature information of the semiconductor light emitting element and the temperature information of the environmental temperature, and adjusting the temperature of the light emitting unit.

Abstract: An optical module includes a first base member, a second base member disposed spatially away from the first base member, a first laser disposed on the first base member and configured to emit red light, a second laser disposed on the second base member and configured to emit light with a color other than red, and a first electronic cooling module disposed in contact with the first base member and configured to adjust a temperature of the first laser.

Abstract: A three-color light source 1 is a three-color light source that combines red, green, and blue laser light so as to output light. The three-color light source 1 includes a red LD 11, a green LD 12, a blue LD 13, a first collimator lens 61, a second collimator lens 62, a third collimator lens 63, a first wavelength filter 81, a second wavelength filter 82, a carrier 30 that is equipped with the LDs 11 to 13, the collimator lenses 61 to 63, and the wavelength filters 81 and 82, and a TEC 40 that is equipped with the carrier 30. The red LD 11 is formed of a GaAs-based material, and the green LD 12 and the blue LD 13 are formed of GaN-based materials.

Abstract: An optical module includes a semiconductor laser and a linear polarizer that is disposed in an emission direction of the semiconductor laser and that is configured to transmit, of light emitted by the semiconductor laser, only light containing a linearly polarized light component in a specific direction.

Abstract: An optical module includes a light-forming part and a protective member. The light-forming part includes a base member; semiconductor light-emitting devices mounted on the base member; lenses mounted on the base member and configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting devices; and light-receiving devices that are mounted on the base member, that are disposed, in the emission directions of the semiconductor light-emitting devices, between the semiconductor light-emitting devices and the lenses, and that are configured to directly receive light from the semiconductor light-emitting devices.

Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.

Abstract: An optical module includes a light-forming part configured to form light; and a protective member that includes an output window configured to transmit light from the light-forming part and that is disposed so as to surround the light-forming part. The light-forming part includes a base member; a plurality of semiconductor light-emitting devices mounted on the base member and configured to emit light differing from each other in wavelength; and a filter mounted on the base member and configured to directly receive and coaxially multiplex diverging light from the plurality of semiconductor light-emitting devices.

Abstract: An optical module 1 according to an embodiment includes a plurality of laser diodes (LDs) 21 to 23, a multiplexing optical system 30 combining a plurality of laser beams from the respective plurality of LDs, and a package 10 accommodating the plurality of LDs and the multiplexing optical system. The package includes a support mounted with the multiplexing optical system, and a cap having a transmissive window that allows a resultant light beam to pass through. At least one of the LDs has an oscillation wavelength of nor more than 550 nm. The package has an internal moisture content of not more than 3000 ppm. The multiplexing optical system is fixed to the support by a resin curing adhesive.

Abstract: An optical module includes a light-forming part; a protective member and including an output window and disposed so as to surround the light-forming part; an adapter connected to the protective member and including an optical passage through which light emitted from the light-forming part and transmitted by the output window passes; and an optical coupling component that is connected to the adapter and that light passing through the optical passage enters. The light-forming part includes semiconductor light-emitting devices and lenses configured to convert, in terms of spot size, light emitted from the semiconductor light-emitting devices. The optical coupling component includes an optical component and a support member supporting the optical component. The support member and the adapter are connected together.

Abstract: A method for producing an electrode foil includes an electrolytic etching step of etching a metal foil containing first metal by applying current between the metal foil and an electrode in etching liquid while a principal surface of the metal foil faces the electrode. A masking member is disposed between the principal surface of the metal foil and the electrode so as to cover a partial region of the principal surface. The masking member is an electric conductor. The masking member is electrically connected with the metal foil.

Abstract: A method for producing an electrode foil includes: a first step of preparing a metal foil, the metal foil having a strip shape; a second step of disposing a masking member so as to cover part of a principal surface of the metal foil; and a third step of partially etching the principal surface of the metal foil by applying current between the metal foil and an electrode while the metal foil faces the electrode via the masking member in etching liquid after the second step. The masking member has a strip shape. In the second step, the masking member is disposed along a longitudinal direction of the metal foil so as to be separated from both side edges of the metal foil.

Abstract: An optical module includes a transmitting member. The transmitting member is fixed to a cap member so as to cover a through-hole. On the assumption that the height of one point on a first surface in a state in which the transmitting member is detached from the cap member is zero and the direction toward the outside of the optical module is a positive direction, the amount of warp that is a difference between the displacement at the central point and the displacement at a standard point, on the first surface, corresponding to a reference point, on the projection image, away from a center of gravity by a particular distance is different between a first geodesic line and a second geodesic line, the displacement being a height of the one point in a direction of the optical axis in a state in which the transmitting member is fixed to the cap member. The transmitting member is joined to the cap member at the first surface or the second surface.

Abstract: A three-color light source 1 is a three-color light source that combines red, green, and blue laser light so as to output light. The three-color light source 1 includes a red LD 11, a green LD 12, a blue LD 13, a first collimator lens 61, a second collimator lens 62, a third collimator lens 63, a first wavelength filter 81, a second wavelength filter 82, a carrier 30 that is equipped with the LDs 11 to 13, the collimator lenses 61 to 63, and the wavelength filters 81 and 82, and a TEC 40 that is equipped with the carrier 30. The red LD 11 is formed of a GaAs-based material, and the green LD 12 and the blue LD 13 are formed of GaN-based materials.

Abstract: An optical module includes a light forming part and a protective member that has an emitting window transmitting light from the light forming part and is disposed to surround the light forming part. The light forming part 20 includes a base member, a semiconductor light-emitting element mounted on the base member, a lens mounted on the base member, and the first supporting member that is disposed between the base member and the lens and supports the lens with respect to the base member. The first supporting member has constriction, which has a smaller cross-sectional area than a region in which the first supporting member is in contact with the lens and a region in which the first supporting member is in contact with the base member in a cross section perpendicular to a thickness direction of the first supporting member.

Abstract: An optical module includes a light forming part and a protective member that has an emitting window transmitting light from the light forming part and is disposed to surround the light forming part. The light forming part 20 includes a base member, a semiconductor light-emitting element mounted on the base member, a lens mounted on the base member, and the first supporting member that is disposed between the base member and the lens and supports the lens with respect to the base member. The first supporting member has constriction, which has a smaller cross-sectional area than a region in which the first supporting member is in contact with the lens and a region in which the first supporting member is in contact with the base member in a cross section perpendicular to a thickness direction of the first supporting member.