Patents by Inventor Hiromi Yajima

Hiromi Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for planarizing a semiconductor device having a amorphous layer
    Patent number: 5445996
    Abstract: To planarize an insulating film formed on a semiconductor substrate, a polishing slurry containing cerium oxide is used to polish the surface of the insulating film. Using the cerium oxide included slurry as a polishing agent, the insulating film is not contaminated by alkali metals during the polishing process. Furthermore, the insulating film is polished at an enhanced polishing rate.
    Type: Grant
    Filed: May 25, 1993
    Date of Patent: August 29, 1995
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Masako Kodera, Hiroyuki Yano, Atsushi Shigeta, Riichirou Aoki, Hiromi Yajima, Haruo Okano