Patents by Inventor Hiromichi Suzuki

Hiromichi Suzuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11298275
    Abstract: A disposable diaper 1 has an elasticized leg cuff 10 on each longitudinally extending, lateral side of the crotch portion C. The elasticized leg cuff 10 includes an elastic member fixing sheet 5, an elastic member 6, an inner sheet 31, and an outer sheet 32 in order from the skin facing side. The inner sheet 31 and the outer sheet 32 are bonded to each other via a plurality of longitudinally extending and laterally spaced bonds 7. The elastic member 6 is located between the elastic member fixing sheet 5 and the inner sheet 31 and arranged at a location that does not overlap the bonds 7.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: April 12, 2022
    Assignee: KAO CORPORATION
    Inventors: Yumi Furukawa, Hiromichi Suzuki
  • Publication number: 20190159943
    Abstract: A disposable diaper 1 has an elasticized leg cuff 10 on each longitudinally extending, lateral side of the crotch portion C. The elasticized leg cuff 10 includes an elastic member fixing sheet 5, an elastic member 6, an inner sheet 31, and an outer sheet 32 in order from the skin facing side. The inner sheet 31 and the outer sheet 32 are bonded to each other via a plurality of longitudinally extending and laterally spaced bonds 7. The elastic member 6 is located between the elastic member fixing sheet 5 and the inner sheet 31 and arranged at a location that does not overlap the bonds 7.
    Type: Application
    Filed: July 25, 2017
    Publication date: May 30, 2019
    Applicant: KAO CORPORATION
    Inventors: Yumi FURUKAWA, Hiromichi SUZUKI
  • Patent number: 9820394
    Abstract: According to one embodiment, a circuit board attachment structure comprise a housing to which the circuit board is attached, a mount provided on the housing and provided outside a portion of the housing where the circuit board is attached, a holding piece extending from the mount to and on the circuit board and sandwiching the circuit board with the housing, and a conductive gasket contacting the circuit board. The gasket is provided at least in a region where the circuit board is sandwiched between the holding piece and the housing, and the gasket is pressed between the holding piece and the housing, and the circuit board and the housing is electrically connected to each other via the pressed gasket.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: November 14, 2017
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiromichi Suzuki, Masataka Tokoro
  • Publication number: 20170105295
    Abstract: According to one embodiment, a circuit board attachment structure comprise a housing to which the circuit board is attached, a mount provided on the housing and provided outside a portion of the housing where the circuit board is attached, a holding piece extending from the mount to and on the circuit board and sandwiching the circuit board with the housing, and a conductive gasket contacting the circuit board. The gasket is provided at least in a region where the circuit board is sandwiched between the holding piece and the housing, and the gasket is pressed between the holding piece and the housing, and the circuit board and the housing is electrically connected to each other via the pressed gasket.
    Type: Application
    Filed: October 7, 2016
    Publication date: April 13, 2017
    Inventors: Hiromichi Suzuki, Masataka Tokoro
  • Patent number: 9324636
    Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: April 26, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
  • Patent number: 9274557
    Abstract: According to one embodiment, a stand for an electronic device, includes a first housing and a connector. The connector is configured to detachably connect to the electronic device and to be rotatably supported by the first housing. The electronic device includes a display face and a second housing. The second housing includes a first opening formed at an end thereof. The connector includes a support, a protrusion, and a base member. The support is configured to support the second housing from outside. The protrusion is spaced from the support and inserted into the first opening. The base member includes a first part configuring at least a portion of the support and a second part integrated with the first part and configuring at least a portion of the protrusion.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: March 1, 2016
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Seiji Hashimoto, Hiromichi Suzuki, Ryosuke Saito
  • Patent number: 9259176
    Abstract: A biological optical measurement instrument includes a single temperature sensor that detects a radiation temperature from a plurality of light emitting elements that emit light of a predetermined wavelength, and an absorption coefficient correcting unit that corrects an absorption coefficient value of a notable substance inside the object on the basis of the radiation temperature detected by the temperature sensor, referring to data indicating a correspondence relationship between a temperature obtained in advance for each emitted light of the plurality of light emitting elements and an absorption coefficient value that varies according to the temperature.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: February 16, 2016
    Assignee: HITACHI MEDICAL CORPORATION
    Inventor: Hiromichi Suzuki
  • Patent number: 9263374
    Abstract: A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: February 16, 2016
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masachika Masuda, Koji Tomita, Tadashi Okamoto, Yasunori Tanaka, Hiroshi Ohsawa, Kazuyuki Miyano, Atsushi Kurahashi, Hiromichi Suzuki
  • Publication number: 20150153902
    Abstract: According to one embodiment, an information processing apparatus includes a display, a protective glass, a camera, a sensor and a correction module. The protective glass is configured to protect the display. The sensor is configured to detect a touch input on the protective glass and to output positional data. The correction module is configured to correct the touch input position indicated by the positional data obtained by the sensor, by using an image obtained by the camera.
    Type: Application
    Filed: February 9, 2015
    Publication date: June 4, 2015
    Inventors: Hiromichi Suzuki, Nobutaka Nishigaki
  • Publication number: 20150116278
    Abstract: According to one embodiment, an electronic apparatus comprises a detector and a processor. The detector is configured to chronologically detect coordinates of positions sequentially indicated by an indicator on a detection surface. The processor is configured to determine a level of noise based on the coordinates, and to correct the coordinates using a correction strength value corresponding to the level of noise.
    Type: Application
    Filed: July 8, 2014
    Publication date: April 30, 2015
    Inventors: Dai Oyama, Isao Ohba, Saori Michihata, Hiromichi Suzuki
  • Patent number: 9013057
    Abstract: A starter circuit includes a battery, a starter electrically coupled with the battery, a relay disposed between the battery and the starter, and a starter switch mounted remotely from the starter. The starter includes a switch assembly and a starter motor. The switch assembly includes an actuator and a start signal switch. The relay is configured to operate to provide current to the switch assembly to close the start signal switch in response to a received signal. The starter switch closes in response to the start signal switch being closed, whereby the battery delivers current to the starter motor when the starter switch is closed. A starter unit is also disclosed.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: April 21, 2015
    Assignee: Honda Motor Co., Ltd.
    Inventors: Joaquin A. Pelaez, Brian Reynolds, Kevin Ireland, Hiromichi Suzuki
  • Publication number: 20140355196
    Abstract: According to one embodiment, a stand for an electronic device, includes a first housing and a connector. The connector is configured to detachably connect to the electronic device and to be rotatably supported by the first housing. The electronic device includes a display face and a second housing. The second housing includes a first opening formed at an end thereof. The connector includes a support, a protrusion, and a base member. The support is configured to support the second housing from outside. The protrusion is spaced from the support and inserted into the first opening. The base member includes a first part configuring at least a portion of the support and a second part integrated with the first part and configuring at least a portion of the protrusion.
    Type: Application
    Filed: January 10, 2014
    Publication date: December 4, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Seiji Hashimoto, Hiromichi Suzuki, Ryosuke Saito
  • Publication number: 20140355210
    Abstract: According to one embodiment, a stand for an electronic device, includes a first housing, a connector, and an elastic member. The first housing includes a first surface and exhibits a quadrilateral appearance with four sides when viewed in a direction crossing the first surface. The connector is configured to detachably connect the electronic device including a second housing including a second surface, and to be rotatably supported by one of the four sides between at least a first position at which the second surface of the connected second housing faces the first surface and a second position at which the second surface of the connected second housing is separated from the first surface. The elastic member protrudes from the first surface, is positioned at at least one of the four sides, and extends along the one of the four sides.
    Type: Application
    Filed: January 10, 2014
    Publication date: December 4, 2014
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Seiji Hashimoto, Hiromichi Suzuki, Masataka Tokoro
  • Patent number: 8867200
    Abstract: According to one embodiment, an electronic apparatus includes a first housing, a first display and a transparent first panel. The first display in the first housing includes a first display portion. The first panel covers the first display portion and includes a first flat surface portion and a first curved surface portion along an outer edge of the first flat surface portion. The first display portion displays images in a location corresponding to the first flat surface portion and a location corresponding to the first curved surface portion respectively at different aspect ratios from each other.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: October 21, 2014
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiromichi Suzuki, Takashi Minemura, Yuji Nakajima
  • Publication number: 20140299995
    Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
    Type: Application
    Filed: June 23, 2014
    Publication date: October 9, 2014
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Susumu BABA, Masachika MASUDA, Hiromichi SUZUKI
  • Patent number: 8796832
    Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.
    Type: Grant
    Filed: February 23, 2012
    Date of Patent: August 5, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
  • Publication number: 20140204038
    Abstract: An information apparatus according to an embodiment includes a first input device for carrying out a pen input, a second input device for carrying out a touch panel input, and a correction processor for correcting a first coordinate detected by the first input device based on a second coordinate detected by the second input device.
    Type: Application
    Filed: August 29, 2013
    Publication date: July 24, 2014
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Isao Ohba, Dai Oyama, Hiromichi Suzuki, Saori Michihata
  • Patent number: 8768420
    Abstract: A mobile terminal includes a first antenna configured to receive power from the first circuit board housed in the first housing, a second antenna configured to receive power from the second circuit board housed in the second housing, a first signal cable configured to electrically connect the first circuit board to the second circuit board and transmit a signal between the first circuit board and the second circuit board, and a second signal cable configured to electrically connect the first circuit board to the second circuit board and bypasses a board current flowing through the first signal cable from the first circuit board to the second antenna during operation of the second antenna.
    Type: Grant
    Filed: September 9, 2008
    Date of Patent: July 1, 2014
    Assignee: Fujitsu Mobile Communications Limited
    Inventors: Hiromichi Suzuki, Isao Ohba
  • Patent number: 8757119
    Abstract: A system that automatically stops an engine when the vehicle is stopped and restarts the engine in response to a predetermined condition is disclosed. The system may generally include an engine and a motor for restarting the engine and driving an auxiliary machine when the engine is stopped, and an electrical power source for supplying electrical power to the motor. The motor may be disposed within a crank pulley housing and configured to be connected to a crankshaft. The motor may restart the engine in response to a predetermined condition. The system may include a gear reduction system for amplifying the torque provided by the motor. The motor may drive an auxiliary machine when the engine is stopped. The engine may drive the auxiliary machine when the engine is operating in drive.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: June 24, 2014
    Assignee: Honda Motor Co., Ltd.
    Inventor: Hiromichi Suzuki
  • Publication number: 20130211218
    Abstract: A biological optical measurement instrument includes a single temperature sensor that detects a radiation temperature from a plurality of light emitting elements that emit light of a predetermined wavelength, and an absorption coefficient correcting unit that corrects an absorption coefficient value of a notable substance inside the object on the basis of the radiation temperature detected by the temperature sensor, referring to data indicating a correspondence relationship between a temperature obtained in advance for each emitted light of the plurality of light emitting elements and an absorption coefficient value that varies according to the temperature.
    Type: Application
    Filed: November 2, 2011
    Publication date: August 15, 2013
    Applicant: HITACHI MEDICAL CORPORATION
    Inventor: Hiromichi Suzuki