Patents by Inventor Hiromitsu Takashita
Hiromitsu Takashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9669567Abstract: The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.Type: GrantFiled: July 30, 2014Date of Patent: June 6, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Tsuyoshi Takeda, Hiromitsu Takashita, Keiko Kashihara, Shingo Yoshioka
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Patent number: 9351402Abstract: A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.Type: GrantFiled: November 26, 2014Date of Patent: May 24, 2016Assignee: PANASONIC CORPORATIONInventors: Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
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Patent number: 9332642Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 ?m or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.Type: GrantFiled: September 9, 2014Date of Patent: May 3, 2016Assignee: PANASONIC CORPORATIONInventors: Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
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Patent number: 9204530Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.Type: GrantFiled: April 24, 2013Date of Patent: December 1, 2015Assignee: PANASONIC CORPORATIONInventors: Hiromitsu Takashita, Tsuyoshi Takeda, Yuko Konno, Hiroaki Fujiwara, Shingo Yoshioka
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Patent number: 9175151Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).Type: GrantFiled: September 25, 2014Date of Patent: November 3, 2015Assignee: PANASONIC CORPORATIONInventors: Yuko Konno, Hiromitsu Takashita, Tsuyoshi Takeda, Hiroaki Fujiwara, Shingo Yoshioka
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Publication number: 20150271924Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.Type: ApplicationFiled: June 8, 2015Publication date: September 24, 2015Inventors: Shingo YOSHIOKA, Hiroaki FUJIWARA, Hiromitsu TAKASHITA, Tsuyoshi TAKEDA, Yuko KONNO
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Patent number: 9082635Abstract: A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device 1 of which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.Type: GrantFiled: May 11, 2011Date of Patent: July 14, 2015Assignee: PANASONIC CORPORATIONInventors: Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda, Yuko Konno
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Patent number: 9082825Abstract: One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated.Type: GrantFiled: October 18, 2012Date of Patent: July 14, 2015Assignee: PANASONIC CORPORATIONInventors: Hiromitsu Takashita, Tsuyoshi Takeda, Keiko Kashihara, Hiroaki Fujiwara, Shingo Yoshioka
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Patent number: 9082438Abstract: One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 ?m or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided.Type: GrantFiled: March 4, 2014Date of Patent: July 14, 2015Assignee: PANASONIC CORPORATIONInventors: Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
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Patent number: 9070393Abstract: One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.Type: GrantFiled: March 4, 2014Date of Patent: June 30, 2015Assignee: PANASONIC CORPORATIONInventors: Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
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Publication number: 20150156873Abstract: A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.Type: ApplicationFiled: November 26, 2014Publication date: June 4, 2015Inventors: Shingo YOSHIOKA, Hiroaki FUJIWARA, Hiromitsu TAKASHITA, Tsuyoshi TAKEDA
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Publication number: 20150034366Abstract: One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 ?m or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.Type: ApplicationFiled: September 9, 2014Publication date: February 5, 2015Inventors: Shingo YOSHIOKA, Hiroaki FUJIWARA, Hiromitsu TAKASHITA, Tsuyoshi TAKEDA
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Publication number: 20150035202Abstract: The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.Type: ApplicationFiled: July 30, 2014Publication date: February 5, 2015Inventors: Tsuyoshi TAKEDA, Hiromitsu TAKASHITA, Keiko KASHIHARA, Shingo YOSHIOKA
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Publication number: 20150008379Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).Type: ApplicationFiled: September 25, 2014Publication date: January 8, 2015Inventors: Yuko KONNO, Hiromitsu TAKASHITA, Tsuyoshi TAKEDA, Hiroaki FUJIWARA, Shingo YOSHIOKA
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Patent number: 8929092Abstract: A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.Type: GrantFiled: October 28, 2010Date of Patent: January 6, 2015Assignee: Panasonic CorporationInventors: Shingo Yoshioka, Hiroaki Fujiwara, Hiromitsu Takashita, Tsuyoshi Takeda
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Patent number: 8877843Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).Type: GrantFiled: November 28, 2011Date of Patent: November 4, 2014Assignee: Panasonic CorporationInventors: Yuko Konno, Hiromitsu Takashita, Tsuyoshi Takeda, Hiroaki Fujiwara, Shingo Yoshioka
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Publication number: 20140191406Abstract: One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated.Type: ApplicationFiled: October 18, 2012Publication date: July 10, 2014Applicant: Panasonic CorporationInventors: Hiromitsu Takashita, Tsuyoshi Takeda, Keiko Kashihara, Hiroaki Fujiwara, Shingo Yoshioka
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Publication number: 20140183751Abstract: One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: PANASONIC CORPORATIONInventors: Shingo YOSHIOKA, Hiroaki FUJIWARA, Hiromitsu TAKASHITA, Tsuyoshi TAKEDA
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Publication number: 20140182887Abstract: One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 ?m or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: PANASONIC CORPORATIONInventors: Shingo YOSHIOKA, Hiroaki FUJIWARA, Hiromitsu TAKASHITA, Tsuyoshi TAKEDA
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Publication number: 20130337188Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ?1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ?1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).Type: ApplicationFiled: November 28, 2011Publication date: December 19, 2013Applicant: PANASONIC CORPORATIONInventors: Yuko Konno, Hiromitsu Takashita, Tsuyoshi Takeda, Hiroaki Fujiwara, Shingo Yoshioka