Abstract: A door device for a vehicle includes: a cable for connecting a handle device, which is mounted to the door panel of the door body covering a door opening of the vehicle body in an openable and closable manner, and a lock unit, with which the door body is engaged. A cable holding member mounted to the handle device is displaced between an engagement position at which the cable holding member engages with the cable and a non-engagement position at which the cable holding member does not engage with the cable. An interference section, which is provided to the door panel, is configured such that, in a state in which the handle device is mounted to the door panel, the interference section interferes with the cable holding member located at the non-engagement position and does not interfere with the cable holding member located at the engagement position.

Abstract: A sample, which has a mesa portion having a pattern thereon, is placed on a Z table. Light is irradiated to the mesa portion through an optical system and light reflected by the mesa portion is received to measure a height of the mesa portion. A height map of the mesa portion is created based on a height of a corner position. A height using the height map is corrected based on a deviation of a measured value from a target value, and a temporal variation of a focal position of light irradiated to the mesa portion. An optical image of the pattern is obtained while controlling the Z table based on the corrected height of the mesa portion. The optical image is compared with a reference image and a defect is determined when a difference value between the optical image and reference image is more than a predetermined threshold value.

Abstract: According to one embodiment, a defect inspection apparatus comprises an illumination optical system, an image formation optical system, a image data conversion unit, a singular part detecting circuit, an optical path length adjusting mechanism, and a defect determining unit. The image formation optical system forms an optical image derived from light passing through first and second optical paths. The image data conversion unit converts, to image data, each of the optical images. The singular part detecting circuit detects a singular part in each of the image data. The optical path length adjusting mechanism equalizes the optical path lengths of the first and second optical paths. The defect determining unit determines a defect on the basis of singular part detection.

Abstract: A pattern inspection device according to the embodiment, includes: an image picking-up portion for picking-up an image of a pattern formation member in which a plurality of opening patterns are formed so as to obtain a picked-up image of the pattern formation member; a reference image obtaining portion for obtaining a reference image used for comparing with the picked-up image; and a pattern defect detecting portion for matching the center locations of the opening pattern images respectively between the picked-up image and the reference image, forming difference images of the opening pattern images between the picked-up image and the reference image per the opening pattern and detecting the defect of the opening pattern base on the difference images.

Abstract: According to one embodiment, a pattern inspection apparatus includes a first inspection data creation section, a first delay section, a first recognition section, a first extraction section, a first and a second level difference calculation section, a first and a second determination section, and a first logic OR calculation section. The first extraction section extracts data of a sub-resolution pattern from the first inspection data and the first delay data. The first and second level difference calculation section calculate differences between an average output level of a surrounding region for a target pixel of the extracted data from the first inspection data or the first delay data and an output level of the extracted data. The first and second determination sections determine presence or absence of a defect. The first logic OR calculation section calculates logic OR of determination results of the first and second determination sections.

Abstract: A method and system for imaging an object to be inspected and obtaining an optical image; creating a reference image from design pattern data; preparing an inspection recipe including one or more templates and parameter settings necessary for the inspection; checking the pattern and the template against each other, and selecting the reference image which corresponds to the template; detecting first and second edges in the selected reference image in accordance with the parameter setting using determined coordinates as a reference; detecting first and second edges in the optical image, this optical image corresponds to the selected reference image; and determining an inspection value by acquiring the difference between the line width of the optical image and the reference image using the first edge and second edge of the reference image and the first edge and second edges of the optical image.

Abstract: According to one embodiment, a pattern characteristic detection apparatus for a photomask includes a detection-data creating portion, a reference-data creating portion, an extracting portion, a first area-setting portion, a detecting portion and an collecting portion. The detection-data creating portion is configured to create detection data on the basis of an optical image of a pattern formed on a photomask. The reference-data creating portion is configured to create reference data of the pattern. The extracting portion is configured to extract a pattern for pattern characteristic detection and positional information of the extracted pattern. The first area-setting portion is configured to set an area where pattern characteristics are to be detected, and configured to extract a target pattern. The detecting portion is configured to detect pattern characteristics of the target pattern within the area. In addition, the collecting portion is configured to collect the detected pattern characteristics.

Abstract: A pattern inspection device according to the embodiment, includes: an image picking-up portion for picking-up an image of a pattern formation member in which a plurality of opening patterns are formed so as to obtain a picked-up image of the pattern formation member; a reference image obtaining portion for obtaining a reference image used for comparing with the picked-up image; and a pattern defect detecting portion for matching the center locations of the opening pattern images respectively between the picked-up image and the reference image, forming difference images of the opening pattern images between the picked-up image and the reference image per the opening pattern and detecting the defect of the opening pattern base on the difference images.

Abstract: A pair of edges that are located at ends as viewed in the widthwise direction of a design pattern are recognized. On the basis of the edge direction in which the paired edges are recognized, edge points on the design pattern are detected as sub-pixels. The widthwise dimension of the design pattern is calculated on the basis of the edge points. In addition, the widthwise dimension of a circuit pattern is calculated at the same position as the widthwise dimension of the design pattern. On the basis of the calculated widthwise dimensions, the semiconductor wafer circuit pattern is checked.

Abstract: A focusing device comprises a first imaging optical system, a second imaging optical system which splits the optical image in the direction of an AF sensor and further splits the optical image so that a front focus image in which the point that is in focus is in front of the optical image on the inspecting sensor and a back focus image in which the point that is in focus is behind the optical image on the inspecting sensor are formed on the AF sensor, a focus detecting circuit which detects an optimum focus position on the basis of a high-frequency component of a front sensor image in a front focus position and a high-frequency component of a back sensor image in a back focus position, and a focus control circuit which controls the focusing of the first imaging optical system on the basis of the focus position.

Abstract: A method for inspecting a photomask, comprising generating a laser beam, changing a phase of the laser beam to smooth the brightness distribution of the laser beam, applying the smoothed laser beam to the photomask, acquiring an image of the photomask using a sensor while the laser beam and the photomask are relatively moved, examining the image of the photomask for a defect of the mask-pattern of the photomask.

Abstract: An apparatus for inspecting a pattern, including: at least one of a first floodlight system for inspection by transmissive light and a second floodlight system for inspection by reflective light; an inspection optical system for capturing an image of the pattern on an object under inspection; and a stage for mounting and moving the object under inspection. The one of the first floodlight system and the second floodlight system includes a diffracted light control means for enhancing light diffracted by the pattern.

Abstract: A photolithography mask inspection apparatus has at least two sensors. One sensor is configured to sense light transmitted through an object to be inspected, and the other sensor senses light reflected off the object. A first optical system is arranged to expose a first portion of the object with a first light beam, and a second optical system is arranged to expose a second portion of the object, spaced form the first portion, with a second light beam. A third optical system focuses the transmitted light on to the first sensor, as well as the reflected light on to the second sensor. A defect detecting circuit is also provided to detect a defect of the object, based upon image data associated with the reflected and transmitted light.

Abstract: A photolithography mask inspection apparatus has at least two sensors. One sensor is configured to sense light transmitted through an object to be inspected, and the other sensor senses light reflected off the object. A first optical system is arranged to expose a first portion of the object with a first light beam, and a second optical system is arranged to expose a second portion of the object, spaced form the first portion, with a second light beam. A third optical system focuses the transmitted light on to the first sensor, as well as the reflected light on to the second sensor. A defect detecting circuit is also provided to detect a defect of the object, based upon image data associated with the reflected and transmitted light.

Abstract: A focusing device comprises a first imaging optical system, a second imaging optical system which splits the optical image in the direction of an AF sensor and further splits the optical image so that a front focus image in which the point that is in focus is in front of the optical image on the inspecting sensor and a back focus image in which the point that is in focus is behind the optical image on the inspecting sensor are formed on the AF sensor, a focus detecting circuit which detects an optimum focus position on the basis of a high-frequency component of a front sensor image in a front focus position and a high-frequency component of a back sensor image in a back focus position, and a focus control circuit which controls the focusing of the first imaging optical system on the basis of the focus position.

Abstract: A method for inspecting a photomask, comprising generating a laser beam, changing a phase of the laser beam to smooth the brightness distribution of the laser beam, applying the smoothed laser beam to the photomask, acquiring an image of the photomask using a sensor while the laser beam and the photomask are relatively moved, examining the image of the photomask for a defect of the mask-pattern of the photomask.

Abstract: A method for inspecting a photomask, comprising generating a laser beam, changing a phase of the laser beam to smooth the brightness distribution of the laser beam, applying the smoothed laser beam to the photomask, acquiring an image of the photomask using a sensor while the laser beam and the photomask are relatively moved, examining the image of the photomask for a defect of the mask-pattern of the photomask.

Abstract: A pair of edges that are located at ends as viewed in the widthwise direction of a design pattern are recognized. On the basis of the edge direction in which the paired edges are recognized, edge points on the design pattern are detected as sub-pixels. The widthwise dimension of the design pattern is calculated on the basis of the edge points. In addition, the widthwise dimension of a circuit pattern is calculated at the same position as the widthwise dimension of the design pattern. On the basis of the calculated widthwise dimensions, the semiconductor wafer circuit pattern is checked.

Abstract: A pair of edges that are located at ends as viewed in the widthwise direction of a design pattern are recognized. On the basis of the edge direction in which the paired edges are recognized, edge points on the design pattern are detected as sub-pixels. The widthwise dimension of the design pattern is calculated on the basis of the edge points. In addition, the widthwise dimension of a circuit pattern is calculated at the same position as the widthwise dimension of the design pattern. On the basis of the calculated widthwise dimensions, the semiconductor wafer circuit pattern is checked.

Abstract: An image input apparatus for inputting an image of an object and outputting the image as an electric signal, the image input apparatus comprises a stage which supports the object, a laser interferometer which measures a position of the stage, a light source which emits a pulse light, an illumination optical system which irradiates the object with an illuminating light, a sensor which converts an image-formed optical image into an electric image signal, an imaging optical system which forms an image of the object on the sensor, a synchronization control circuit which controls a light-emission interval of the light source and synchronization of the sensor on the basis of position information of the laser interferometer, a light quantity monitor which measures a quantity of light, and a light quantity correction circuit which corrects the electric image signal on the basis of an output of the light quantity monitor.