Abstract: A separator containing a substrate and a release layer formed on at least one side of the substrate wherein the separator shows a strain of not more than 7% when a load of 5N/20 mm is applied for one minute in the pulling direction, and when the substrate is cut in half in the thickness direction to divide the separator into two, an apparent elastic modulus in the pulling direction of one of the divided separators is larger than an apparent elastic modulus in the pulling direction of the other divided separator.

Abstract: A pressure-bonding adhesive member having a superior positional-adjustment function relative to an adherend having a surface mainly constituted of low-polarity plastic typified by polypropylene, and capable of adhering to the adherend with a sufficiently high adhesive force after positional adjustment. The pressure-bonding adhesive member containing an adhesive layer and plural convex parts formed on one surface of the adhesive layer, wherein, when the convex parts are in contact with a polypropylene plate and the adhesive layer is not in contact with the polypropylene plate, the adhesive member shows a frictional force of not more than 0.6 N/cm2 on the polypropylene plate and a shear adhesive force of not less than 50 N/cm2 to the polypropylene plate.

Abstract: A separator containing a substrate and a release layer formed on at least one side of the substrate wherein the separator shows a strain of not more than 7% when a load of 5N/20 mm is applied for one minute in the pulling direction, and when the substrate is cut in half in the thickness direction to divide the separator into two, an apparent elastic modulus in the pulling direction of one of the divided separators is larger than an apparent elastic modulus in the pulling direction of the other divided separator.

Abstract: An aqueous dispersion-type acrylic adhesive composition of core-shell structured acrylic copolymer particles dispersed in an aqueous medium, the particles containing core layer (A) containing acrylic polymer (A) and shell layer (B) containing acrylic polymer (B), wherein the acrylic polymer (B) has a glass transition temperature of not less than 30° C. and the acrylic polymer (A) has a glass transition temperature lower than that of the acrylic polymer (B).

Abstract: This invention provides a PSA composition comprising a base polymer and a tackifier resin. The base polymer is a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound. The tackifier resin comprises a tackifier resin TH having a softening point of 120° C. or above. The tackifier resin TH comprises a tackifier resin THR1 having an aromatic ring while having a hydroxyl value of 30 mgKOH/g or lower.

Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract: The pressure-sensitive adhesive composition provided by the present invention comprises an acrylic polymer as a base polymer and a tackifier resin having a softening point of 125° C. or above. The tackifier resin content is less than 20 parts by mass relative to 100 parts by mass of the acrylic polymer.

Abstract: The present invention relates to an aqueous dispersion pressure-sensitive adhesive composition containing: an acrylic emulsion polymer (A); and a compound (B) in which the compound (B) has a solubility in water (25° C.) of 1 g/100 g or more, and has, in the molecule, at least one nitrogen atom and two or more substituents represented by the following formula (1) and bonded to the nitrogen atom: (wherein R represents a divalent group selected from the group consisting of linear or branched alkylene having a carbon number of 1 to 10, phenylene, alkyl group-substituted phenylene, halogen-substituted phenylene, and heteroatom-containing alkylene).

Abstract: A pressure-sensitive adhesive sheet according to the present invention is a double-sided pressure-sensitive adhesive sheet having a plastic substrate and pressure-sensitive adhesive layers provided on each side thereof. The pressure-sensitive adhesive layers are formed from a water-dispersed pressure-sensitive adhesive composition having an acrylic polymer dispersed in an aqueous solvent. An anchor layer formed from an anchor composition containing polyester-polyurethane dissolved in an organic solvent is provided between at least a first side of the substrate and the pressure-sensitive adhesive layer.

Abstract: A pressure-sensitive adhesive (PSA) composition comprising an aqueous dispersion solution containing an aqueous solvent and a PSA constituent dispersed in the aqueous solvent is provided. The PSA constituent contains an acrylic polymer and a tackifier L having a viscosity of 2000 Pa·s or lower at 30° C. In addition, the PSA constituent contains a surfactant S containing in the molecular structure an aryloxy group serving as a hydrophobic group and an anionic or non-ionic hydrophilic group. Here, the aryloxy group is a phenyloxy group having at least one substituent having an aromatic ring. Such a PSA composition has excellent dispersion stability, as well as rough-surface adhesion property and water-resistance of the PSA sheet formed from the composition.

Abstract: A PSA sheet 40 including a PSA layer formed from an aqueous PSA composition and having adequate bonding workability with respect to elastic foams is provided. When this PSA sheet 40 is pressure-bonded to a flexible urethane foam 42 of 10 mm in thickness under conditions where the urethane foam 42 is compressed to a thickness of 5 mm, the 180° peel adhesive strength 30 minutes after the pressure-bonding is 1.5 N/20 mm or greater. ECS (gray), a product from Inoac Corporation, is used as the flexible urethane foam 42.

Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.

Abstract: Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Abstract: The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer which is a specific acrylic polymer A, and the die-bonding film is formed of a die-adhering layer.

Abstract: The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, the laminated film being for use in a production step of a semiconductor device, in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet contains a water-supporting body, and the pressure-sensitive adhesive layer has a gel fraction of 90% by weight or more.

Abstract: The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, the laminated film being for use in a production step of a semiconductor device, in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet contains a peeling force-controlling component capable of lowering the pressure-sensitive adhesive force between the pressure-sensitive adhesive sheet and the die-adhering layer.

Abstract: The present invention provides a laminated film which includes a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer, and a die-adhering layer laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet, in which the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is formed of a pressure-sensitive adhesive composition containing a base polymer and a thermal crosslinking agent, and the pressure-sensitive adhesive layer is such that the gel fraction thereof before heating is less than 90% by weight and the gel fraction thereof after heating is changed to 90% by weight or more.

Abstract: The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer of the dicing film is a heat-expandable pressure-sensitive adhesive layer formed of a heat-expandable pressure-sensitive adhesive containing an acrylic polymer A and a foaming agent. The acrylic polymer A is an acrylic polymer composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2?CHCOOR (wherein R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer. The heat-expandable pressure-sensitive adhesive layer has a surface free energy of 30 mJ/m2 or less. The die-bonding film is constituted by a resin composition containing an epoxy resin.

Abstract: The present invention relates to a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film has a laminated structure of a heat-expandable pressure-sensitive adhesive layer containing a foaming agent and an active energy ray-curable antifouling pressure-sensitive adhesive layer, which are laminated on the base material in this order, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film.

Abstract: The present invention relates to a dicing die-bonding film comprising: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable heat-expandable pressure-sensitive adhesive layer containing a foaming agent, and in which the die-bonding film is constituted by a resin composition containing an epoxy resin. Moreover, the present invention provides a process for producing a semiconductor device which includes using the above-described dicing die-bonding film.