Patents by Inventor Hironao Ootake

Hironao Ootake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100129988
    Abstract: The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is a pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer, the base polymer is an acrylic polymer A composed of a monomer composition containing 50% by weight or more of an acrylic acid ester represented by CH2?CHCOOR (in which R is an alkyl group having 6 to 10 carbon atoms) and 1% by weight to 30% by weight of a hydroxyl group-containing monomer and containing no carboxyl group-containing monomer, and the die-bonding film is formed of a die-adhering layer.
    Type: Application
    Filed: November 25, 2009
    Publication date: May 27, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hironao OOTAKE, Katsuhiko KAMIYA
  • Publication number: 20100129985
    Abstract: The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer which is a specific acrylic polymer A, and the die-bonding film is formed of a die-adhering layer.
    Type: Application
    Filed: November 25, 2009
    Publication date: May 27, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hironao OOTAKE, Katsuhiko KAMIYA
  • Publication number: 20100028687
    Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising an acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), an acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer to 100 mol % of the total of the acrylic ester A and the acrylic ester B, 70-90 mol % isocyanate compound to 100 mol % of the hydroxyl group-containing monomer, and the die-bonding film is formed from an epoxy resin.
    Type: Application
    Filed: July 31, 2009
    Publication date: February 4, 2010
    Inventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake
  • Publication number: 20100029061
    Abstract: A dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic pressure-sensitive adhesive comprising an acrylic polymer which comprises an acrylic ester, a hydroxyl group-containing monomer where a ratio is in a range of 10-40 mol % to 100 mol % of the acrylic ester, an isocyanate compound having a radical reactive carbon-carbon double bond where a ratio is in a range of 70-90 mol % to 100 mol % of the hydroxyl group-containing monomer, and a compound having two or more radical reactive carbon-carbon double bonds where a ratio is in a range of 10-60 parts by weight to 100 parts by weight of the acrylic polymer, and the die-bonding film is formed from an epoxy resin and is laminated on the pressure-sensitive adhesive layer.
    Type: Application
    Filed: July 31, 2009
    Publication date: February 4, 2010
    Inventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake
  • Publication number: 20100029060
    Abstract: A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH2?CHCOOR1 (where R1 is an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH2?CHCOOR2 (where R2 is an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond, where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.
    Type: Application
    Filed: July 31, 2009
    Publication date: February 4, 2010
    Inventors: Katsuhiko Kamiya, Takeshi Matsumura, Shuuhei Murata, Hironao Ootake