Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

Abstract: Obtained is a polypropylene fiber that selectively satisfies any of the following requirements: the degree of amorphous orientation being not lower than 85%; the degree of crystalline orientation being not lower than 90%; the degree of crystallinity being 60-75%; the strength being not lower than 7 cN/dtex; the initial elastic modulus being not lower than 100 cN/dtex; the rupture elongation being 10-30%; and the single fiber fineness being 3-20 dtex. This polypropylene fiber, in which a crystalline chain and an amorphous chain are highly oriented and that has high strength and high initial elastic modulus, is produced through a two-stage drawing method and by controlling the drawing tension of the final stage while maintaining production speed.

Abstract: An electronic component includes: a plurality of first substrates that are connected in series along a coupling path; and a second substrate that is connected with one first substrate of the plurality of first substrates. The second substrate is in line with the one first substrate along a connection direction intersecting the coupling path, and the plurality of first substrates and the second substrate are configured to be foldable such that they are stacked.

Abstract: An electronic component includes: a first substrate that comprises a first substrate surface; a second substrate that is arranged on the first substrate; and a connecting member that connects the first substrate and a peripheral edge portion of the second substrate. The second substrate is fixed to the first substrate by the connecting member.

Abstract: An object of the present invention is to provide a polyolefin fiber, particularly a core-sheath composite polypropylene fiber which is possible to be easily deformed corresponding to a stress applied from a direction perpendicular to a fiber axis, to be less fibrillated, and to have an excellent knot strength. The problem of the present invention is solved by providing the polyolefin fiber having a compressive strength of 30 to 51 MPa calculated by the following formula 1 when compressed and deformed by 30% with respect to a fiber diameter in a direction perpendicular to the fiber axis in each single fiber.

Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

Abstract: An electronic component includes: a plurality of first substrates that are connected in series along a coupling path; and a second substrate that is connected with one first substrate of the plurality of first substrates. The second substrate is in line with the one first substrate along a connection direction intersecting the coupling path, and the plurality of first substrates and the second substrate are configured to be foldable such that they are stacked.

Abstract: An electronic component includes: a first substrate that comprises a first substrate surface; a second substrate that is arranged on the first substrate; and a connecting member that connects the first substrate and a peripheral edge portion of the second substrate. The second substrate is fixed to the first substrate by the connecting member.

Abstract: Obtained is a polypropylene fiber that selectively satisfies any of the following requirements: the degree of amorphous orientation being not lower than 85%; the degree of crystalline orientation being not lower than 90%; the degree of crystallinity being 60-75%; the strength being not lower than 7 cN/dtex; the initial elastic modulus being not lower than 100 cN/dtex; the rupture elongation being 10-30%; and the single fiber fineness being 3-20 dtex. This polypropylene fiber, in which a crystalline chain and an amorphous chain are highly oriented and that has high strength and high initial elastic modulus, is produced through a two-stage drawing method and by controlling the drawing tension of the final stage while maintaining production speed.

Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

Abstract: The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010?/? or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.

Abstract: An apparatus, includes a plurality of pins which include a longitudinal axis, each of the pins to be respectively electronically contacted with each of a plurality of terminals of an electronic component by pressing each of the terminals onto each of the pins from a direction corresponding to the longitudinal axis, and an adjusting unit which adjusts a position of the electronic component so that each of the terminals corresponds to each of the pins respectively.

Abstract: A heat sink for an electronic component includes a structure that is bendable.

Abstract: A device comprises a plurality of first electrodes which are arranged on a surface of a substrate at predetermined space, a component which has an elasticity and a longitudinal axis, a plurality of conductors which are applied to a surface of said component at predetermined space, and each of which are connected to a corresponding one of said first electrodes, and a plurality of second electrodes which are arranged on a surface of a electronic component at predetermined space, and each of which are connected to a corresponding one of said conductors.

Abstract: An apparatus, includes a plurality of pins which include a longitudinal axis, each of the pins to be respectively electronically contacted with each of a plurality of terminals of an electronic component by pressing each of the terminals onto each of the pins from a direction corresponding to the longitudinal axis, and an adjusting unit which adjusts a position of the electronic component so that each of the terminals corresponds to each of the pins respectively.

Abstract: A device comprises a plurality of first electrodes which are arranged on a surface of a substrate at predetermined space, a component which has an elasticity and a longitudinal axis, a plurality of conductors which are applied to a surface of said component at predetermined space, and each of which are connected to a corresponding one of said first electrodes, and a plurality of second electrodes which are arranged on a surface of a electronic component at predetermined space, and each of which are connected to a corresponding one of said conductors.

Abstract: A heat sink for an electronic component includes a structure that is bendable.

Abstract: A circuit board includes a wiring board 2 and plural integrated circuit chips (LSI 1) mounted on the wiring board. At least one of the integrated circuit chips is mounted on a first surface of the wiring board 2 as a flip chip and the part mounted as a flip chip is sealed with resin. Further, a bare plate (a flat plate 5) is mounted on a second surface of the wiring board 2 with a resin (sealing resin 3) opposite the first surface where the integrated circuit chip mounted as a flip chip.

Abstract: A PCB is fixed to a PCB stiffener to be held thereby, while an LSI is fixed to an LSI stiffener to be held thereby. The distal ends of four supporting bars provided in the LSI stiffener are screwed on the PCB stiffener, whereby the two stiffeners are firmly integrated with each other to be prevented from being warped. Since a heat sink can be mounted through tapped holes provided in the LSI stiffener, even if the PCB is a thin board such as a build-up substrate, it is possible to mount the heat sink without any difficulties.