Abstract: The electronic device is provide that includes a body having an underside; a plurality of conducting members for transferring electronic signals; and at least two alignment pins mounted perpendicularly on the underside. Each of the alignment pins has a flexible portion that is more easily bendable than the other portions.

Abstract: A semiconductor device mount structure containing a semiconductor device (10), a connection substrate (30) disposed at the lower side of the semiconductor device (10), and leads (20) which are connected to external connection terminals (12) of the semiconductor device (10) at one ends thereof, turned back and connected to wires provided on the connection substrate (30) at the other ends thereof. The connection substrate (30) is constructed by plural carrier substrates. Each of the plural carrier substrates is right-angled isosceles triangular, and the plural carrier substrates are arranged so as to form a substantially square shape at the lower portion of the semiconductor device (10).

Abstract: A mounting structure wherein, in a semiconductor package mounting position on a wiring board, a package bearing substrate whose external size is substantially equal to or larger than that of the semiconductor package and which has on its upper surface pads for connection to a semiconductor package and on its lower surface pads for connection to the wiring board is arranged, the pads on the wiring board and those on the lower surface of the package bearing substrate are connected by soldering, and the soldered junction is filled and fixed with an under-fill.

Abstract: A cooling structure for an integrated circuit that uses a liquid coolant to absorb heat directly from the integrated circuit includes a wiring substrate, an integrated circuit mounted on the wiring substrate, and a hollow cooling block, in which liquid coolant accumulates, disposed on a heat radiating surface of the integrated circuit. The upper portion of the cooling block is provided with an inlet port and an outlet port to allow the liquid coolant to enter and exit, respectively. A nozzle is mounted on the inlet port to jet the liquid coolant to the heat radiating surface. The lower portion of the cooling block consists of an opening portion which is opposed to the heat radiating surface, and which allows the liquid coolant to come in contact with and directly cool the heat radiating surface. The opening portion is liquid-tightly sealed to the heat radiating surface by a sealing member and/or a frame mounted on the heat radiating surface.

Abstract: A cooling structure cools integrated circuits (I.C.'s) by circulating a liquid coolant in the vicinity of the I.C.'s and causing the heat generated by the I.C.'s to be conducted to the liquid coolant. The cooling structure includes a wiring substrate, an I.C. mounted on the wiring substrate, storage means for a liquid coolant having an opening in its bottom and an inlet and an outlet for the liquid coolant at its top, adhering means for fastening together the bottom of the storage means and the heat radiating face of the I.C., and spraying means for directly spraying the liquid coolant on the heat radiating face of the I.C. through the opening.