Patents by Inventor Hirosato Ochimizu

Hirosato Ochimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5762706
    Abstract: The present invention includes a process of growing a compound semiconductor layer locally, after applying radical particles that do not become an etchant of a compound semiconductor layer to an insulating mask so as to terminate the surface of the insulating mask in a state that the compound semiconductor layer is covered with the insulating mask, on the surface of the compound semiconductor layer exposed from the insulating mask.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: June 9, 1998
    Assignee: Fujitsu Limited
    Inventors: Junji Saito, Toshihide Kikkawa, Hirosato Ochimizu
  • Patent number: 5521404
    Abstract: A high electron mobility transistor type group III-V compound semiconductor device includes a substrate of a group III-V compound semiconductor, an electron transfer layer of a group III-V compound semiconductor formed on the substrate, an impurity doped electron supply layer of a group III-V compound semiconductor having a wider band gap and smaller electron affinity than the electron transfer layer, and a spacer layer of a group III-V compound semiconductor having a lattice mismatch with the electron supply layer, the spacer layer being formed between the electron transfer layer and the electron supply layer. A HEMT type group III-V compound semiconductor device is provided which uses an Si-doped electron supply layer of material such as InGaP other than AlGaAs and has good device properties.
    Type: Grant
    Filed: December 9, 1994
    Date of Patent: May 28, 1996
    Assignee: Fujitsu Limited
    Inventors: Toshihide Kikkawa, Hirosato Ochimizu
  • Patent number: 5460654
    Abstract: In an apparatus for forming a film of MOCVD, gas source MBE or the like, there is provided a gas supply pipe for supplying gas obtained by gasifying a liquid or solid organic metal raw material to a reaction chamber. A mechanism in which a pressure gauge is fitted in the vicinity of a gas generating source in the gas supply pipe and the gas supply quantity from the gas generating source is regulated based on an indicated value of the pressure gauge so as to suppress variation of the gas pressure is installed in the apparatus for forming a film.There is a heating system for heating the organic metal raw material or an ultrasonic vibrator for applying ultrasonic vibration to the organic metal raw material as the mechanism for regulating the gas supply quantity, and the gasified quantity of the organic metal raw material is varied by regulating the heating temperature of the heating system or by varying the output of the ultrasonic vibrator.
    Type: Grant
    Filed: June 30, 1993
    Date of Patent: October 24, 1995
    Assignee: Fujitsu Limited
    Inventors: Toshihide Kikkawa, Hitoshi Tanaka, Hirosato Ochimizu