Abstract: A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

Abstract: A security establishment method includes generating a pair of keys via mutual authentication between a terminal device (110) and a serving network, and the terminal device (110) and the serving network sharing KASME by using the generated pair of keys (Steps S50 and S100), the terminal device (110) and a roaming destination network of the terminal device (110) generating, by using the KASME, KSEAF mapped with SEAF (50) (Steps S140 and S150), and the terminal device (110) and the roaming destination network generating, by using at least the KSEAF and SUPI used to recognize a subscriber in the serving network, KAMF mapped with AMF (60) (Steps S140 and S150).

Abstract: A security establishment method includes generating a pair of keys via mutual authentication between a terminal device (110) and a serving network, and the terminal device (110) and the serving network sharing KASME by using the generated pair of keys (Steps S50 and S100), the terminal device (110) and a roaming destination network of the terminal device (110) generating, by using the KASME, KSEAF mapped with SEAF (50) (Steps S140 and S150), and the terminal device (110) and the roaming destination network generating, by using at least the KSEAF and SUPI used to recognize a subscriber in the serving network, KAMF mapped with AMF (60) (Steps S140 and S150).

Abstract: vSEPP (210) encapsulates a predetermined element included in an original message received via a mobile communication network and adds a first signature to a first message of which the predetermined element is encapsulated. A relay device (310) receives the first message, decapsulates the predetermined element included in the first message, and then executes a modification to the predetermined element. The relay device (310) adds a second signature to a second message including the modified predetermined element and relays the second message to HPLMN (30).

Abstract: A security establishment method includes generating a pair of keys via a mutual authentication between a terminal device (110) and a serving network, and the terminal device (110) and the serving network sharing KASME by using the generated pair of keys (Steps S50 and S100), generating in which the terminal device (110) generates KSEAF by using the KASME and SUPI used to recognize a subscriber in the serving network (Step S140), and generating in which a roaming destination network of the terminal device (110) generates the KSEAF by using the KASME, notified from the serving network, and the SUPI (Step S150).

Abstract: A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

Abstract: A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Abstract: A polishing apparatus includes a polishing table supplied with liquid on a upper surface and rotating around a central axis, a liquid receiver having an annular shape and disposed below a peripheral portion of the polishing table, and a drain member having a tubular shape, attached to a peripheral portion of the polishing table, and including a lower end portion extending toward the liquid receiver.

Abstract: A head-up display device includes a housing, a reflecting member, a projection light emitting unit, and a vibration transmitting member. The housing is fixed to a vehicle. The reflecting member is rotatably supported by the housing and is held at a rotation position. The projection light emitting unit projects projection light corresponding to information onto a window of the vehicle through the reflecting member. The vibration transmitting member is provided between the housing and the reflecting member and has elasticity. The vibration transmitting member is fixed to the housing and makes contact with the reflecting member in an elastically compressed state in an entire rotatable range of the reflecting member.

Abstract: A substrate processing apparatus includes a substrate processing part 3 and a washing unit 40. The washing unit 40 includes a main body 43 having a liquid supplying port 41 and a liquid jetting port 42, a flow channel 44 formed between the liquid supplying port 41 and the liquid jetting port 42, and a valve 45 provided in the flow channel 44. In the washing unit 40, when the valve 45 is opened, the flow channel 44 is opened, thereby causing the liquid jetting port 42 to jet liquid, and when the valve 45 is closed, the flow channel 44 is closed, thereby causing the liquid jetting port 42 to stop jetting liquid. The flow channel 44 is provided with a water-hammer reducing mechanism 48 that operates to reduce damage to the flow channel 44 caused by a water hammer phenomenon when the valve 45 is closed.

Abstract: An eUICC 100 embedded in an UE 200 authenticates an AUTN transmitted from an HSS 300, and calculates a transfer key TK by using a secret key K. The eUICC 100 acquires a transfer Token by decoding an enc Token by using the transfer key TK, and acquires a new Customer ID by decoding an enc New ID by using the transfer key TK. The eUICC 100 transmits a user auth resp in response to a User auth+transfer Setup Req including the AUTN, the enc Token, and the enc New ID to the HSS 300. The eUICC 100 generates a shared-Secret Key shared between the eUICC 100 and an HSS 400 by using the transfer Token, and executes an attach procedure for the HSS 400 by using the generated shared-Secret Key and the new Customer ID.

Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.

Abstract: The cleaning apparatus includes multiple kinds of cleaning modules each configured to perform a cleaning processing of a substrate, a first accommodating section configured to accommodate the multiple kinds of cleaning modules therein, and a fluid supply section configured to supply a fluid to the cleaning modules accommodated in the first accommodating section through a pipe. Each of the multiple kinds of cleaning modules includes a pipe connection portion having a common connection position to be connected with the pipe.

Abstract: There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Abstract: A lifting device 630b includes a lifting mechanism 640 and an adjustment member 660. The lifting mechanism 640 is provided between at least one of a plurality of units of a substrate processing apparatus and an installation surface of the unit, and adjusts height of the at least one unit with respect to the installation surface. The adjustment member 660 is provided with an extended section 664 extended from the lifting mechanism 640, and is capable of operating the lifting mechanism 640 through the extended section 664.

Abstract: A head-up display device includes a housing, a reflecting member, a projection light emitting unit, and a vibration transmitting member. The housing is fixed to a vehicle. The reflecting member is rotatably supported by the housing and is held at a rotation position. The projection light emitting unit projects projection light corresponding to information onto a window of the vehicle through the reflecting member. The vibration transmitting member is provided between the housing and the reflecting member and has elasticity. The vibration transmitting member is fixed to the housing and makes contact with the reflecting member in an elastically compressed state in an entire rotatable range of the reflecting member.

Abstract: There is provided a cover to which a polishing liquid is less likely to stick and solidify. The cover for a component of a polishing apparatus for polishing substrates is provided with a locking mechanism disposed inside the cover and configured to latch together a main body of the component and the cover. An external surface of the cover exposed to the outside has no recessed portion, and has no horizontal plane, except on the top portion of the cover.

Abstract: A substrate processing apparatus includes a substrate processing part 3 and a washing unit 40. The washing unit 40 includes a main body 43 having a liquid supplying port 41 and a liquid jetting port 42, a flow channel 44 formed between the liquid supplying port 41 and the liquid jetting port 42, and a valve 45 provided in the flow channel 44. In the washing unit 40, when the valve 45 is opened, the flow channel 44 is opened, thereby causing the liquid jetting port 42 to jet liquid, and when the valve 45 is closed, the flow channel 44 is closed, thereby causing the liquid jetting port 42 to stop jetting liquid. The flow channel 44 is provided with a water-hammer reducing mechanism 48 that operates to reduce damage to the flow channel 44 caused by a water hammer phenomenon when the valve 45 is closed.