Abstract: An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves relatively with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

Abstract: The present invention relates to sliding parts, precision parts and timepieces and electronic equipment using those parts. Sliding parts are composed by a resin in which the degree of orientation of a fibrous filler is higher at the portion serving as the sliding surface than inside the sliding part, and the fibrous filler is oriented along the sliding surface on the sliding surface. Alternatively, precision parts are composed by a resin to which has been added carbon fibers for which a carbon compound is thermally decomposed to carbon in the vapor phase and simultaneously grown directly into fibers simultaneous to this thermal decomposition. Moreover, timepieces and electronic equipment are composed by these sliding parts or these precision parts.

Abstract: The invention relates to an RFID medium 1 in which an interposer 10 having a semiconductor chip 11 mounted on a sheet-like chip holding member 13 is bonded to a sheet-like base circuit sheet 20. The interposer 10 has the IC chip 11 mounted on a substantially planar surface of the chip holding member 13, and an interposer terminal that is electrically extended from a terminal of the IC chip 11. The base circuit sheet 20 has a base terminal 22 electrically connected to the interposer terminal 12, and has a through chip housing portion 210 for housing the semiconductor chip 11 on the interposer 10.

Abstract: To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers.

Abstract: A laser machining apparatus in which three or more beam splits are made incident on one machining lens so that high speed machining can be achieved, and the machining quality (shapes, dimensions, accuracy and straightness of machined holes) is excellent. The optical paths of beams A and B having the same polarization direction are aligned almost in one and the same direction by a total reflection/transmission type beam combining means 31c using a difference in incident angle. After that, the optical paths of the beams A and B and the optical path of a beam C different in polarization direction therefrom are aligned almost in one and the same direction by a polarizing type beam combining means 32. Then, the beams A, B and C are made incident on a machining lens 45.

Abstract: A method for determining a position of a reference point in which there is no influence of aberration of a camera lens or the like, but an error caused by a failure in shape of an alignment mark can be reduced. An alignment mark consisting of a plurality of pattern portions (and background portions) centering at a design reference point is provided in advance. Positions of centers of border lines of the patterns are calculated. Obtained coordinate values of the centers are averaged in each axial direction. The averaged coordinate values are regarded as coordinate values of a machining reference point. Thus, even when a defect occurs in any pattern portion, an error caused by the defect is reduced so that the accuracy in machining can be improved.

Abstract: There is provided a printed circuit board whose peel strength is large and a printed circuit board fabrication method and a printed circuit board machining apparatus that allow a fabrication time and a fabrication cost to be reduced. The fabrication method of the printed circuit board comprises steps of forming a resist layer on a surface of the printed circuit board whose surface is made of an insulator, of forming a hole that is connected from the surface of the resist layer to a conductor pattern of an inner layer and a hole and grooves having a depth not connected with the conductor layer of the inner layer by irradiating lasers, of filling a conductive material into the holes and the grooves to form a conductor pattern and of removing the resist layer to project a portion of the conductor pattern out of the surface of the insulating layer.

Abstract: An optical connector comprising: first and second movable members 7, 8 held on an optical connector body 6 to be axially movable in a longitudinal direction; locking means for locking the first and second movable members when the first movable member is located at a predetermined locking position in a tip part of the optical connector body, and integrally moving the first and second movable members; and unlocking means formed in the optical connector body 6, and including a locking acting portion which acts on the locking means when the first movable member is located rearwardly of a predetermined unlocking position in a rear part of the optical connector body, to unlock the first and second movable members, and which locks the first and second movable members when the first movable member is located forwardly of the unlocking position, and a second movable member hooking portion 10 for inhibiting rearward movement of the second movable member after the first and second movable members are unlocked, and where

Abstract: A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam 4, which is shaped into a rectangular having a length sufficiently larger than its width, in a cross-section perpendicular to a central axis thereof; executing a belt-like machining on a certain region of the printed circuit board 6, while moving a mask 1 and the printed circuit board 6 in opposite directions, in a direction of the width of the line beam 4 (i.e.

Abstract: The invention provides a method and an apparatus for forming a plurality of ultraviolet-wavelength laser beams, and a laser machining apparatus, in which the machining efficiency can be improved due to easy maintenance and inspection while deterioration of wavelength conversion means can be prevented to reduce the running cost. A laser beam with a near infrared wavelength output from a laser oscillator is branched into a plurality of laser beams by a laser distribution unit. Each branched laser beam is partially converted into a laser beam whose wavelength is ½ of the near infrared wavelength by a wavelength converter.

Abstract: A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey.

Abstract: A printed circuit board manufacturing method by which the manufacturing time can be shortened and the manufacturing cost can be reduced. A printed circuit board has an insulating layer on its surface. Positions (first positions) of the printed circuit board where lands are disposed are irradiated with a CO2 laser beam (first laser beam) so as to form holes with a depth h from the surface. The printed circuit board is then scanned with an excimer laser beam (second laser beam) through a mask. The beam shape of the excimer laser beam is rectangular. Thus, holes reaching the lands are formed in the positions where the lands are disposed, and grooves for forming lines are formed (second positions). In this case, the holes reaching the lands may be formed by the CO2 laser beam.

Abstract: An optical connector includes a connector body that has a first optical fiber housed in advance in a ferrule so as to project from a back end of the ferrule opposite to the connecting end surface and an anchoring fixture that anchors a second optical fiber that is to be optically connected to the first optical fiber, and by pressing the anchoring fixture into the connector body while the second optical fiber is anchored in this anchoring fixture, the anchoring fixture and the connector body are connected to optically connect the first optical fiber and the second optical fiber, and the connecting portion that connects the anchoring fixture and the connector body form a movable connecting portion that is adapted to vary the direction of the anchoring fixture with respect to the connector body.

Abstract: An interposer bonding device bonds an interposer having an interposer-side terminal to a base circuit sheet provided with a base-side terminal. The interposer bonding device has a press anvil that holds the base circuit sheet on which the interposer is laminated and a bonding head that moves with respect to the press anvil. The bonding head has a pressing surface that presses the rear surface of the interposer by abutting against this surface. The pressing surface scans the rear surface of the interposer by the relative movement of the bonding head with respect to the press anvil and presses the whole surface of the interposer-side terminal toward the base circuit sheet.

Abstract: A production method for producing sanitary tampons implements a cord placement step of placing at least two continuous string-like cords in parallel on surfaces of at least two cotton pad pieces sequentially placed along a sewing line in a sewing direction of a sewing machine, a first cord sewing step of sewing the cord to one of two cotton pad pieces placed in an adjacent manner, a second cord sewing step of sewing the cord to the other of the two cotton pad pieces, and a cord switching step of switching the cords to be sewn to the cotton pad piece between the first cord sewing step and the second cord sewing step.

Abstract: A transfer apparatus has a first conveying device for holding and conveying a transferring-work to be transferred; a second conveying device for holding and conveying a carrier work on which the transferring-work is placed; and a transfer device to receive the transferring-work from the first conveying device and transfer the transferring-work to the carrier work of the second conveying device. The transfer device has two or more end-effectors that revolve along the same circumference to convey the transferring-work, and each of the end-effectors revolves independently of the other end-effectors. Each of the end-effectors has a holding surface that holds the transferring-work, and the holding surface is able to advance and retract along a revolution axis of each of the end-effectors.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A conveying apparatus includes a first conveying device and a second conveying device for holding and conveying a work, and a transfer device for receiving the work from the first conveying device and transferring the received work to the second conveying device. The transfer device has two or more end-effectors that revolve along the same circumference to convey the work, and each of the end-effectors revolves independently of at least any of the other end-effectors.

Abstract: An optical connector includes a connector body that has a first optical fiber housed in advance in a ferrule so as to project from a back end of the ferrule opposite to the connecting end surface and an anchoring fixture that anchors a second optical fiber that is to be optically connected to the first optical fiber, and by pressing the anchoring fixture into the connector body while the second optical fiber is anchored in this anchoring fixture, the anchoring fixture and the connector body are connected to optically connect the first optical fiber and the second optical fiber, and the connecting portion that connects the anchoring fixture and the connector body form a movable connecting portion that is adapted to vary the direction of the anchoring fixture with respect to the connector body.