Abstract: An image capturing device employing as illumination source(s) (flash apparatus(es)) a plurality of light emitting diodes emitting light of different colors; wherein such light emitting diodes are respectively made to emit light in pulsed fashion in turn by emitted color during exposure time(s). Furthermore, during exposure time(s), such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color, and/or such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color over multiple iterations.

Abstract: An image capturing device employing as illumination source(s) (flash apparatus(es)) a plurality of light emitting diodes emitting light of different colors; wherein such light emitting diodes are respectively made to emit light in pulsed fashion in turn by emitted color during exposure time(s). Furthermore, during exposure time(s), such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color, and/or such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color over multiple iterations.

Abstract: A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted; and a coating member 4 which covers a surface of the light emitting element mounting member 3 where said light emitting elements 2 are mounted.

Abstract: There is provided a method that allows fabrication, through a simple process, of a good quality semiconductor light emitting device having a semiconductor light emitting element surrounded and thus covered with a fluorescent layer formed of resin uniform in thickness. At least two semiconductor light emitting elements are bonded to a substrate with a predetermined interval. Subsequently a first resin serving as a fluorescent layer is molded across the entire surface of the substrate substantially parallel to the top surface of the semiconductor light emitting element to cover the semiconductor light emitting element. After the first resin is cured, the first resin is at least partially diced.

Abstract: A light emitting element is die-bonded to a portion of a lead frame exposed at the bottom of an opening formed at a top face of a resin package. A reflector to direct light emitted from the light emitting element towards a predetermined direction is attached to the top face of the resin package. Lead terminals are arranged so as to protrude from two opposite side regions of the resin package. A predetermined lead terminal among the plurality of lead terminals, connected to a portion where the light emitting element is die-bonded, is bent upwards, and soldered to the reflector by solder paste.

Abstract: A semiconductor light emitting device includes a light emitting element, a heat radiating member, and a submount interposed between the light emitting element and the heat radiating member. The light emitting element is fixed to heat radiating member by a brazing material with the submount interposed. The heat radiating member has a groove on its surface to which the submount is fixed. With this configuration, a semiconductor light emitting device that is applicable to a large-sized light emitting element that is excellent in heat radiation and that has high reliability can be provided.

Abstract: A pulse drive method for a light-emitting semiconductor devices having a plurality of light-emitting elements emitting light at different wavelengths and comprising first lit steps in which light-emitting element(s) of any of the emitted wavelengths is/are made to light as a result of being driven at drive setting(s) for each emitted wavelength, optical output(s) from the lit light-emitting element(s) is/are detected, and the light-emitting element(s) drive setting(s) is/are adjusted based on the detected light-emitting element optical output(s); and unlit steps in which the light-emitting elements of all of the emitted wavelengths are unlit for prescribed unlit time. The first lit steps are carried out in repeated fashion while the driven light-emitting element(s) is/are switched so as to cause the light-emitting element(s) to sequentially light in pulsed fashion in turn by emitted wavelength, and the unlit step respectively intervenes between each pair of successive iterations of the first lit steps.

Abstract: A semiconductor light emitting device 1 includes: a plurality of light emitting elements 2; a light emitting element mounting member 3 on which said light emitting elements 2 are mounted; and a coating member 4 which covers a surface of the light emitting element mounting member 3 where said light emitting elements 2 are mounted.

Abstract: A current of the same amount or in a constant ratio is applied to each of a combination of a blue light emitting diode having a small wavelength variation and a green light emitting diode having a large wavelength variation. With this, as an amount of applied current increases, an oscillation wavelength of the green light emitting diode having the large wavelength variation changes from a long wavelength side to a short wavelength side and mixes with a blue color of the blue light emitting diode having the small wavelength variation to gradually change chromaticity as a whole. When desired chromaticity is obtained, the amount of the current is fixed.

Abstract: A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the first and second lead frames, and a heat-radiating member bonded to a back face of the first lead frame with a brazing member (electrically-conductive layer) containing metal interposed therebetween. The brazing member and the heat-radiating member are formed immediately below and around the light-emitting element.

Abstract: A light source module of the present invention includes: a first luminous element for emitting light having two peak wavelengths; and a second luminous element for emitting light having a single peak wavelength. With this configuration, it is possible to downsize the light source module, and improve a color reproducibility via a color filter.

Abstract: A first light emitting diode and a second light emitting diode are connected in parallel between a first node and a second node. The two light emitting diodes are connected to each other in such a manner that, an anode of each one light emitting diode is electrically connected to a cathode of the other light emitting diode. As a driving portion applies an AC voltage to each of the two light emitting diodes, a light emitting apparatus can alternately emit light of two colors (blue and green) and light of one color (red). Therefore, since white light can be generated with one driving circuit, size and cost reductions of a light emitting apparatus can be attained. As a result, a light emitting apparatus which is small and capable of easy adjustment of chromaticity can be provided.

Abstract: Light emitting semiconductor device(s) of the present invention is/are provided with three LED elements by way of lead frame(s) on substrate(s) Reflector(s)—having parabolically curved surface(s) at inner wall(s) thereof is/are installed at periphery or peripheries of these LED elements. Radiative angle(s) of light radiating from such reflector(s) is/are controlled by alteration of height(s) of reflector(s). Such height(s) may be lowered to increase radiative angle(s) ? of light therefrom so as to establish broader irradiative locus or loci and/or such height(s) may be raised to decrease radiative angle(s) ? of light radiating therefrom so as to establish narrower irradiative locus or loci.

Abstract: In a semiconductor laser device, a flange (33) of a cap (32) is provided with straight-line cut-off portions (34) that are the same in number as notches (36, 37) of a stem (35). With the cut-off portions (34) positioned so as not to overlap the notches (36, 37) of the stem (35) in position, welding between the cap (32) and the stem (35) is performed. The cut-off portions (34) of the cap (32) secure obtainment of a reference plane 38 with a large area in a place where the notches (36, 37) of the stem (35) are absent. As a result, sufficient precision in optical characteristics can be secured while suppressing an influence of unevenness of the stem (35) having a small diameter on a deviation angle ? of an optical axis from a normal line to a reference plane of an optical pickup.

Abstract: A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the first and second lead frames, and a heat-radiating member bonded to a back face of the first lead frame with a brazing member (electrically-conductive layer) containing metal interposed therebetween. The brazing member and the heat-radiating member are formed immediately below and around the light-emitting element.

Abstract: A current of the same amount or in a constant ratio is applied to each of a combination of a blue light emitting diode having a small wavelength variation and a green light emitting diode having a large wavelength variation. With this, as an amount of applied current increases, an oscillation wavelength of the green light emitting diode having the large wavelength variation changes from a long wavelength side to a short wavelength side and mixes with a blue color of the blue light emitting diode having the small wavelength variation to gradually change chromaticity as a whole. When desired chromaticity is obtained, the amount of the current is fixed.

Abstract: The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.

Abstract: A light emitting element is die-bonded to a portion of a lead frame exposed at the bottom of an opening formed at a top face of a resin package. A reflector to direct light emitted from the light emitting element towards a predetermined direction is attached to the top face of the resin package. Lead terminals are arranged so as to protrude from two opposite side regions of the resin package. A predetermined lead terminal among the plurality of lead terminals, connected to a portion where the light emitting element is die-bonded, is bent upwards, and soldered to the reflector by solder paste.

Abstract: A pulse drive method for a light-emitting semiconductor devices having a plurality of light-emitting elements emitting light at different wavelengths and comprising first lit steps in which light-emitting element(s) of any of the emitted wavelengths is/are made to light as a result of being driven at drive setting(s) for each emitted wavelength, optical output(s) from the lit light-emitting element(s) is/are detected, and the light-emitting element(s) drive setting(s) is/are adjusted based on the detected light-emitting element optical output(s); and unlit steps in which the light-emitting elements of all of the emitted wavelengths are unlit for prescribed unlit time. The first lit steps are carried out in repeated fashion while the driven light-emitting element(s) is/are switched so as to cause the light-emitting element(s) to sequentially light in pulsed fashion in turn by emitted wavelength, and the unlit step respectively intervenes between each pair of successive iterations of the first lit steps.

Abstract: An image capturing device employing as illumination source(s) (flash apparatus(es)) a plurality of light emitting diodes emitting light of different colors; wherein such light emitting diodes are respectively made to emit light in pulsed fashion in turn by emitted color during exposure time(s). Furthermore, during exposure time(s), such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color, and/or such light emitting diodes may be made to sequentially emit light in pulsed fashion in turn by emitted color over multiple iterations.