Abstract: The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.

Abstract: Light emitting semiconductor device(s) of the present invention is/are provided with three LED elements by way of lead frame(s) on substrate(s). Reflector(s)—having parabolically curved surface(s) at inner wall(s) thereof is/are installed at periphery or peripheries of these LED elements. Radiative angle(s) of light radiating from such reflector(s) is/are controlled by alteration of height(s) of reflector(s). Such height(s) may be lowered to increase radiative angle(s) &thgr; of light therefrom after the fashion of curve(s) so as to establish broader irradiative locus or loci and/or such height(s) may be raised to decrease radiative angle(s) &thgr; of light radiating therefrom after the fashion of curve(s) so as to establish narrower irradiative locus or loci.

Abstract: In a semiconductor laser device, a flange (33) of a cap (32) is provided with straight-line cut-off portions (34) that are the same in number as notches (36, 37) of a stem (35). With the cut-off portions (34) positioned so as not to overlap the notches (36, 37) of the stem (35) in position, welding between the cap (32) and the stem (35) is performed. The cut-off portions (34) of the cap (32) secure obtainment of a reference plane 38 with a large area in a place where the notches (36, 37) of the stem (35) are absent. As a result, sufficient precision in optical characteristics can be secured while suppressing an influence of unevenness of the stem (35) having a small diameter on a deviation angle &thgr; of an optical axis from a normal line to a reference plane of an optical pickup.

Abstract: The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.

Abstract: A semiconductor laser device includes a base, a semiconductor laser chip and a resin layer enclosing the laser chip. The base may have a monitor photodiode mounted thereon in the vicinity of the laser chip. The resin layer enclosing the laser chip or both of the laser chip and the monitor diode chip is made of a single synthetic resin having a thickness not greater than 500 .mu.m and also having a surface substantially parallel to an outwardly oriented beam emitting end face of the laser chip.

Abstract: A driving circuit of a semiconductor laser includes a photodiode receiving a light of the semiconductor laser, a first detecting circuit for calculating a mean value signal of outputs of the semiconductor laser in accordance with an output of the photodiode, a second detecting circuit for calculating a maximum value signal of the outputs of the semiconductor laser, a circuit receiving the mean value signal for supplying a bias current for driving the semiconductor laser, a high-frequency superimposing circuit for modulating the bias current by high-frequency waves, and a modulating degree control circuit comparing the mean value signal with the maximum value signal for making a period of time for which the minimum value of the optical output values of the semiconductor laser becomes zero, in accordance with the comparison results.