Abstract: A protrusion is formed on a first part of an inner-cabin side wall of an installation base member of a protector with a sensor. The first part is closer to a connecting wall than a second part opposite the first part. The protrusion is on a virtual line in cross section. The virtual line is where convex substances, keys for example, hanging on passengers' clothes conceivably pass through. The virtual line extends toward a connecting point from a rear part of an automobile body closer to an interior of the automobile body than a reference line. The reference line is parallel with a direction in which a flange protrudes and extends from the connecting point. The connecting point is a part of an inner-cabin side end of a hollow part closest to an interior of the automobile body. The inner-cabin side end is connected with the installation base member.

Abstract: A protrusion is formed on a first part of an inner-cabin side wall of an installation base member of a protector with a sensor. The first part is closer to a connecting wall than a second part opposite the first part. The protrusion is on a virtual line in cross section. The virtual line is where convex substances, keys for example, hanging on passengers' clothes conceivably pass through. The virtual line extends toward a connecting point from a rear part of an automobile body closer to an interior of the automobile body than a reference line. The reference line is parallel with a direction in which a flange protrudes and extends from the connecting point. The connecting point is a part of an inner-cabin side end of a hollow part closest to an interior of the automobile body. The inner-cabin side end is connected with the installation base member.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type, a third semiconductor region of the first conductivity type, a first electrode, a first insulating layer, and a second electrode. The first semiconductor region includes a first region and a second region. The second semiconductor region is provided on the first semiconductor region in the first region. The third semiconductor region is provided on the first semiconductor region in the second region. The first electrode is provided on the third semiconductor region. The first electrode is electrically connected to the third semiconductor region. The first insulating layer is provided on the first electrode. The second electrode is provided on the second semiconductor region. A portion of the second electrode is positioned on the first insulating layer.

Abstract: A vehicle direction indicator light includes a light source and a light emitting body. The light emitting body guides light to the outside of the vehicle, and includes an outer emitting surface facing the outside of the vehicle, an inner emitting surface facing the inside of the vehicle, and a tip surface connecting the inner and outer emitting surfaces and facing a front or rear side of the vehicle. The outer emitting surface has a step shape in which a first surface portion that faces the outside of the vehicle and a second surface portion that faces the front side or the rear side of the vehicle are alternatingly connected to each other in a longitudinal direction of the vehicle. Light emitted through the second surface portion and the tip surface has a higher intensity than the light emitted through the first surface portion.

Abstract: A vehicle direction indicator light includes a light source and a light emitting body. The light emitting body guides light to the outside of the vehicle, and includes an outer emitting surface facing the outside of the vehicle, an inner emitting surface facing the inside of the vehicle, and a tip surface connecting the inner and outer emitting surfaces and facing a front or rear side of the vehicle. The outer emitting surface has a step shape in which a first surface portion that faces the outside of the vehicle and a second surface portion that faces the front side or the rear side of the vehicle are alternatingly connected to each other in a longitudinal direction of the vehicle. Light emitted through the second surface portion and the tip surface has a higher intensity than the light emitted through the first surface portion.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes a polishing step, a first amorphous silicon film formation step, a single crystallization step and a buffer layer formation step. In the first amorphous silicon film formation step, a first amorphous silicon film of the first conductivity type is formed on the polished back surface of the high-resistance layer, the first amorphous silicon film having a higher impurity concentration than the high-resistance layer. In the single crystallization step, the first amorphous silicon film is single-crystallized by irradiating the first amorphous silicon film with a first laser. In the buffer layer formation step, the formation and single-crystallization of the first amorphous silicon film are repeated more than once to form a buffer layer of the first conductivity type on the back surface of the high-resistance layer, the buffer layer having a higher impurity concentration than the high-resistance layer.

Abstract: An electric device includes flat acrylic lens, and a blue light emitting diode. The lens includes bottom face upon which light is incident from the diode; front face from which light is emergent; pair of side portions opposed to each other and inclined by a predetermined angle with respect to the front face and the bottom face; and back face arranged so that end portions of the pair of side can be connected, substantially making a right angle with the bottom face. The pair of side portions reflects the light sent from the bottom face in the direction of the front face. When the side portions are directed to the back face, an inclination angle of the side plate with respect to the bottom face portion gradually comes close to a right angle.

Abstract: A tape drive apparatus employing a tape cassette including a solid-state memory in a cassette half unit that accommodates a magnetic tape. When recording application data on the magnetic tape, the application data is written in an area of a preset size of the memory, beginning from a leading end of the application data. In this manner, it is assured that the management information located at the leading end of the application data can be stored in the memory. In reproducing the application data from the tape cassette, the management information stored in the memory is exploited to save time in accessing the management information recorded on the magnetic tape.

Abstract: An electric device includes flat acrylic lens, and a blue light emitting diode. The lens includes bottom face upon which light is incident from the diode; front face from which light is emergent; pair of side portions opposed to each other and inclined by a predetermined angle with respect to the front face and the bottom face; and back face arranged so that end portions of the pair of side can be connected, substantially making a right angle with the bottom face. The pair of side portions reflects the light sent from the bottom face in the direction of the front face. When the side portions are directed to the back face, an inclination angle of the side plate with respect to the bottom face portion gradually comes close to a right angle.

Abstract: A tape drive apparatus employing, as a recording medium, a tape cassette (1) including a memory (4) in a cassette half unit (6) having accommodated a magnetic tape (3). When recording the application data on the magnetic tape (3), the application data to be recorded on the magnetic tape (3) is written in an area of a preset size of the memory (4), beginning from the leading end of the application data to be recorded on the magnetic tape (3). In this manner, at least the management information located at the leading end of the application data can be stored in the memory (4). In reproducing the application data from the tape cassette (1), the management information stored in the memory (4) is exploited to save time for accessing the management information recorded on the magnetic tape (3) to speed up the accessing to the data recorded on the magnetic tape (3).

Abstract: In a thin-film transistor to be used in an active matrix liquid crystal display device, each of a gate signal line, a source signal line, and a drain extraction electrode has a three-layer structure. Specifically, each of these members is made up of a lower layer made of a titanium film, an intermediate layer made of an aluminum film, and an upper layer made of a titanium film containing nitrogen. Since the respective upper layers, in contact with a gate insulating film or an interlayer insulating film made of a silicon nitride film, are made of titanium films containing nitrogen, they have superior adhesion to the silicon nitride film. Consequently, film peeling, etc. during the manufacturing process can be suppressed. Further, providing the titanium film beneath the aluminum film contributes to reduction of the resistance of the aluminum film.

Abstract: A die clamping apparatus including a movable plate which is in connection with a pushing-out pin which is projected from and retracted to a moving die and which is held movably with respect to a moving die plate, a clamp member for obtaining a constraint of the movable member, an air cylinder and a hook member. Only a movement of the movable member is constraint by the air cylinder with respect to the moving die plate when the latter is moved in a die opening direction from a die opening limit position, so that a resultant relative movement between the movable plate and the moving die plate, which causes the pushing-out pin to be projected from the moving die, resulting in a removal of a molded product, while the constraint of the movable member prevents the moving die plate from being moved in the die closing direction when the moving die plate in the die opening limit position is under non clamping condition.