Patents by Inventor Hiroshi Ishiyama

Hiroshi Ishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7826226
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: November 2, 2010
    Assignee: Denso Corporation
    Inventor: Hiroshi Ishiyama
  • Patent number: 7742272
    Abstract: It is realized to efficiently energize a lifting magnet device, and reduce the devices used in an energization system of the lifting magnet device in size, energy consumption, and noise as well. Other than a lifting magnet device 8, the handling machine includes an engine 1 and an electric generator 5, which form a power source; a storage battery 20 for storing electric energy from the power source; and a generator motor (or a drive source for a driven body) 18 for driving an upper rotary body in which regenerative electric energy can be produced. The power source and the storage battery 20 are connected to be capable of supplying electric energy to the lifting magnet device 8. The generator motor 18 for driving the upper rotary body is connected to be capable of supplying its own regenerative electric energy to the storage battery 20.
    Type: Grant
    Filed: July 8, 2005
    Date of Patent: June 22, 2010
    Assignee: Sumitomo (SHI) Construction Machinery Manufacturing Co., Ltd.
    Inventors: Takashi Kubo, Kiminori Sano, Hiroshi Ishiyama, Tadao Komoriya
  • Patent number: 7724523
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: May 25, 2010
    Assignee: Denso Corporation
    Inventor: Hiroshi Ishiyama
  • Publication number: 20100046112
    Abstract: A storage device includes: a head that reads and writes data stored in a storage medium; an arm that holds the head; a voice coil motor formed of a coil and a magnet, the voice coil motor that lets a current flow through the coil to move the arm; a disk enclosure that accommodates the storage medium, the head, the arm, and the voice coil motor; a temperature sensor that detects a temperature in the disk enclosure; and a controller that determines an amount of current flowing through the coil for moving the head to a target position on the storage medium and estimates a temperature of the coil from the amount of current flowing through the coil, the temperature in the disk enclosure detected by the temperature sensor, and a predetermined value.
    Type: Application
    Filed: June 11, 2009
    Publication date: February 25, 2010
    Applicant: FUJITSU LIMITED
    Inventor: Hiroshi Ishiyama
  • Patent number: 7616406
    Abstract: A rotary type actuator comprises an actuator assembly rotatably attached to a base and supporting a head at an end thereof via an arm and supporting a coil at the other end thereof, and a magnetic circuit unit having a yoke and a magnet secured to the base. The latch mechanism has a projection arranged from the inner periphery of the magnet provided in the magnetic circuit toward the rotational center and a latching magnet which produces an attraction force directed toward the latch position caused by leaking magnetic flux between itself and the projection near the latch position where the actuator assembly is in contact with the stopper and holds it at the latch position.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: November 10, 2009
    Assignee: Fujitsu Limited
    Inventors: Shinji Fujimoto, Hiroshi Ishiyama
  • Publication number: 20090251858
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Application
    Filed: June 4, 2009
    Publication date: October 8, 2009
    Applicant: Denso Corporation
    Inventors: Daisuke Harada, Hiroshi Ishiyama
  • Publication number: 20090251859
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Application
    Filed: June 4, 2009
    Publication date: October 8, 2009
    Applicant: Denso Corporation
    Inventors: Daisuke Harada, Hiroshi Ishiyama
  • Patent number: 7508668
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: March 24, 2009
    Assignee: Denso Corporation
    Inventors: Daisuke Harada, Hiroshi Ishiyama
  • Patent number: 7400472
    Abstract: A guide pin is set in common in first and second voids defined in the peripheries of first and second flexible printed wiring boards. The second void has the shape identical to the shape of the first void. When the guide pin rotates around a rotation axis so as to bring the guide pin in contact with the peripheries of the first and second flexible printed wiring boards inside the first and second voids, the first and second flexible printed wiring boards can be arranged. This leads to arrangement of the first and second flexible printed wiring boards at a time in a facilitated manner.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: July 15, 2008
    Assignee: Fujitsu Limited
    Inventors: Yukihiro Komura, Mitsuhiro Izumi, Hiroshi Ishiyama
  • Publication number: 20080164607
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Application
    Filed: March 11, 2008
    Publication date: July 10, 2008
    Applicant: Denso Corporation
    Inventors: Daisuke Harada, Hiroshi Ishiyama
  • Publication number: 20080068772
    Abstract: It is realized to efficiently energize a lifting magnet device, and reduce the devices used in an energization system of the lifting magnet device in size, energy consumption, and noise as well. Other than a lifting magnet device 8, the handling machine includes an engine 1 and an electric generator 5, which form a power source; a storage battery 20 for storing electric energy from the power source; and a generator motor (or a drive source for a driven body) 18 for driving an upper rotary body in which regenerative electric energy can be produced. The power source and the storage battery 20 are connected to be capable of supplying electric energy to the lifting magnet device 8. The generator motor 18 for driving the upper rotary body is connected to be capable of supplying its own regenerative electric energy to the storage battery 20.
    Type: Application
    Filed: July 8, 2005
    Publication date: March 20, 2008
    Inventors: Takashi Kubo, Kiminori Sano, Hiroshi Ishiyama, Tadao Komoriya
  • Patent number: 7320097
    Abstract: A serial to parallel conversion circuit is provided. The circuit includes a shift register including flip-flops latch circuits, and control circuits. The flip-flops are connected in cascade, with a first stage flip-flop supplied with a transfer start signal that is sequentially transferred through the shift register, responsive to a shift clock signal. The latch circuits receive the output signals of the flip-flops, and latch and output a data signal, responsive to the output signals. The control circuits correspond to the flip-flops, and a first stage control circuit receives the shift clock signal and a start pulse and each remaining control circuit receives the shift clock signal and an output signal of a corresponding flip-flop. Each control circuit sets a state of a corresponding flip-flop to control a pulse width of an output signal. The frequency of said shift clock signal is set to lower than a data transfer frequency.
    Type: Grant
    Filed: February 25, 2005
    Date of Patent: January 15, 2008
    Assignee: NEC Electronics Corporation
    Inventor: Hiroshi Ishiyama
  • Publication number: 20070297095
    Abstract: A rotary type actuator comprises an actuator assembly rotatably attached to a base and supporting a head at an end thereof via an arm and supporting a coil at the other end thereof, and a magnetic circuit unit having a yoke and a magnet secured to the base. The latch mechanism has a projection arranged from the inner periphery of the magnet 36 provided in the magnetic circuit toward the rotational center and a latching magnet which produces an attraction force directed toward the latch position caused by leaking magnetic flux between itself and the projection near the latch position where the actuator assembly is in contact with the stopper and holds it at the latch position.
    Type: Application
    Filed: September 28, 2006
    Publication date: December 27, 2007
    Inventors: Shinji Fujimoto, Hiroshi Ishiyama
  • Publication number: 20070279805
    Abstract: A guide pin is set in common in first and second voids defined in the peripheries of first and second flexible printed wiring boards. The second void has the shape identical to the shape of the first void. When the guide pin rotates around a rotation axis so as to bring the guide pin in contact with the peripheries of the first and second flexible printed wiring boards inside the first and second voids, the first and second flexible printed wiring boards can be arranged. This leads to arrangement of the first and second flexible printed wiring boards at a time in a facilitated manner.
    Type: Application
    Filed: August 15, 2006
    Publication date: December 6, 2007
    Inventors: Yukihiro Komura, Mitsuhiro Izumi, Hiroshi Ishiyama
  • Patent number: 7200007
    Abstract: A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: April 3, 2007
    Assignee: Denso Corporation
    Inventors: Hidehiko Yasui, Hiroshi Ishiyama
  • Patent number: 7190054
    Abstract: A semiconductor module includes a semiconductor chip having a first surface and a second surface; a first electrode plate contacting the first surface of the semiconductor chip; a second electrode plate contacting the second surface of the semiconductor chip; and a resin mold for sealing the first and second electrode plates and the semiconductor chip. The resin mold includes an inner pressure release portion for releasing a pressure in the resin mold.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: March 13, 2007
    Assignee: Denso Corporation
    Inventor: Hiroshi Ishiyama
  • Publication number: 20060284308
    Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.
    Type: Application
    Filed: August 20, 2004
    Publication date: December 21, 2006
    Applicant: Denso Corporation
    Inventors: Daisuke Harada, Hiroshi Ishiyama
  • Publication number: 20060221505
    Abstract: A head actuator that positions a head to perform information recording or playback on a computer readable storage medium, has a voice coil flanked by magnets. Through the voice coil a drive current flows and a damper to fit in a space between the voice coil and one of the magnets is formed on at least a portion of the voice coil. The head actuator vibration is controlled to achieve a more compact information storage apparatus and high-density recording. For example, on a voice coil (51) of a head actuator (20), a damping material (71) consisting of single layer viscoelasticity is formed along one lap of the voice coil (51). The damping material (71) is a single layer to not take up dimensions in the thickness direction, and, while pursuing making the apparatus more compact, it is possible to hold down vibration generated by the actuator (20).
    Type: Application
    Filed: March 29, 2006
    Publication date: October 5, 2006
    Applicant: Fujitsu Limited
    Inventors: Shinji Fujimoto, Tsuneyori Ino, Mitsuhiro Izumi, Hiroshi Ishiyama
  • Patent number: 7015578
    Abstract: A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the second electrode bonded to the second device surface, the first terminals connecting to a device control circuit, the second terminals connecting to a device driving circuit, and mold resin unifying the devices, the first electrode, the second electrode, the first terminals, and the second terminals in a unit. The mold resin is so formed that the first electrode face and second electrode face are exposed. The cooling members sandwich the semiconductor modules through insulating members. The semiconductor unit has the first electrode face of the first electrode coplanar with the first resin face of the mold resin, and/or the second electrode face of the second electrode coplanar with the second resin face of the mold resin.
    Type: Grant
    Filed: May 26, 2004
    Date of Patent: March 21, 2006
    Assignee: Denso Corporation
    Inventors: Shigenobu Nakamura, Hiroshi Ishiyama, Yasuyuki Sakai
  • Publication number: 20050259402
    Abstract: A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 24, 2005
    Applicant: DENSO CORPORATION
    Inventors: Hidehiko Yasui, Hiroshi Ishiyama