Abstract: Disclosed is a serial to parallel conversion circuit in which the shift clock frequency is lowered to close to the frequency on the data line to achieve low power dissipation. The serial to parallel conversion circuit at least includes a shift register (FF1 to FFn), to the first stage of which is entered a data transfer start signal STPO and which sequentially transfers the data transfer start signal by input shift clock signal, a plural number of latch circuits (LT1 to LTn) receiving signals sequentially output from the shift register as latch clock signal to latch a data signal serially supplied to a data line, and control circuits (Con1 and Con2) receiving at least shift clock signal CLKO supplied to flip-flops and the output signals of the flip-flops.

Abstract: A holding mechanism for a rotating member includes a main member having a rotating shaft; a leg member rotationally attached to the rotating shaft to change from a housed state to a stand-up state; and a stopper formed on the main member at a position away from the rotating shaft. The stopper holds the stand-up state of the leg member. The leg member in the stand-up state can be rotated to the housed state by pushing the leg member.

Abstract: A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the second electrode bonded to the second device surface, the first terminals connecting to a device control circuit, the second terminals connecting to a device driving circuit, and mold resin unifying the devices, the first electrode, the second electrode, the first terminals, and the second terminals in a unit. The mold resin is so formed that the first electrode face and second electrode face are exposed. The cooling members sandwich the semiconductor modules through insulating members. The semiconductor unit has the first electrode face of the first electrode coplanar with the first resin face of the mold resin, and/or the second electrode face of the second electrode coplanar with the second resin face of the mold resin.

Abstract: A semiconductor module includes a semiconductor chip having a first surface and a second surface; a first electrode plate contacting the first surface of the semiconductor chip; a second electrode plate contacting the second surface of the semiconductor chip; and a resin mold for sealing the first and second electrode plates and the semiconductor chip. The resin mold includes an inner pressure release portion for releasing a pressure in the resin mold.

Abstract: A holding mechanism for a rotating member includes a main member having a rotating shaft; a leg member rotationally attached to the rotating shaft to change from a housed state to a stand-up state; and a stopper formed on the main member at a position away from the rotating shaft. The stopper holds the stand-up state of the leg member. The leg member in the stand-up state can be rotated to the housed state by pushing the leg member.

Abstract: A guide plate 45 is placed at a guiding and holding member 42 which is fixed to a region of an inner panel 34 adjacent to the upper end portion 49A of a B pillar garnish. The guide plate 45 has a base end portion 45A which extends from the vehicle interior side to the vehicle exterior side. The base end portion 45A is fixed to the guiding and holding member 42. The cross sectional configuration of the guide plate 45 when viewed from the vehicle front is formed in a substantial U shape which surrounds the folded air bag body and whose opening portion faces the outer side of the vehicle interior. When the air bag body is expanded, the guide plate 45 is extended as well so as to cover the upper end portion 49A of the center pillar garnish 49. As a result, the air bag body can expand more smoothly, and the displacement of the center pillar garnish from the vehicle body can be prevented.

Abstract: A guide plate 45 is placed at a guiding and holding member 42 which is fixed to a region of an inner panel 34 adjacent to the upper end portion 49A of a B pillar garnish. The guide plate 45 has a base end portion 45A which extends from the vehicle interior side to the vehicle exterior side. The base end portion 45A is fixed to the guiding and holding member 42. The cross sectional configuration of the guide plate 45 when viewed from the vehicle front is formed in a substantial U shape which surrounds the folded air bag body and whose opening portion faces the outer side of the vehicle interior. When the air bag body is expanded, the guide plate 45 is extended as well so as to cover the upper end portion 49A of the center pillar garnish 49. As a result, the air bag body can expand more smoothly, and the displacement of the center pillar garnish from the vehicle body can be prevented.

Abstract: An air bag cover is formed of synthetic resin and is connected to and held by the body of a car in a plurality of discontinuous portions thereof along the peripheral edge of an opening formed on the interior side of the car in such a manner that the air bag cover not only can cover an air bag folded in the peripheral edge of the opening on the car interior side, but also, when an air bag main body of the air bag is developed and expanded, can be so opened and moved as to allow the air bag main body to project toward the opening side. The air bag cover further includes a restricting wall which projects toward the body of the car in such a manner that it can connect together these connecting/holding portions while the restricting wall is disposed on the back surface side of the air bag cover, in more particular, on the side of the folded air bag main body that is distant from the opening and on the opening side of connecting/holding portions.

Abstract: Mounting portions of an air bag body are respectively nipped by positioning plates which are each fastened and fixed to a pillar inner panel by a weld nut and a bolt via the plates. Caulking portions are formed on the plates so that the mounting portions of the air bag device are in advance fixed between the plates. A convex portion is formed on the plate, and with the convex portion being engaged with a hole formed in the pillar inner panel, relative rotation of the plate and a vehicle body is prevented. As a result, rotation of the air bag body in a direction in which the mounting portions are fastened, which occurs during mounting of the air bag body to the vehicle body, can be prevented.

Abstract: A structure for mounting a head-protecting airbag body which inflates in the form of a curtain at least along a roof side rail across a B pillar is provided with an airbag body expansion direction restricting member which is disposed on the roof side rail in the vicinity of a upper end portion of a B pillar garnish covering the B pillar and has a guide wall extending toward the upper end portion of the B pillar garnish, and moving restricting portions which are disposed on the upper end portion of the B pillar garnish and the airbag body expansion direction restricting member and engage each other when a side collision occurs so as to restrict movement of the upper end portion of the B pillar garnish. When a vehicle body is deformed upon a slide collision, the upper end portion of the B pillar garnish attempts to move in a vehicle occupant compartment inner direction.

Abstract: A power converter having substantially a "U" shape is mounted on the axial side of a motor from which a drive shaft protrudes. Due to the opening end of the "U" shape, the power converter may be removed from the motor or mounted thereon while a load such as vehicle wheels are connected to the motor.

Abstract: A process of assembling a semiconductor laser device which is reduced in number of assembling steps and a semiconductor laser device which can be produced at a reduced cost are disclosed. The semiconductor laser device comprises a stem having a lead mounting hole perforated therein and a lead extending through the lead mounting hole of the stem and fixed in an electrically isolated condition to the stem by way of an electrically insulating resin press fitted in the lead mounting hole. The lead is assembled to the stem by applying a pressure to the stem with the electrically insulating resin fitted in the lead mounting hole of the stem.