Abstract: A memory card is to be inserted into an electronic device so as to add a memory function. The memory card comprises a parent card and a child card, the child card including a semiconductor memory element and a lead as an external terminal of the memory element. The parent card includes a child card receiving portion and a child card insert port for inserting the child card into the child card receiving portion through the child card insert port, and a contact to be contacted with the lead of the child card within the child card receiving portion. A contact opening/closing slide plate is provided for causing a contacting portion of the contact to be shifted to a position in which it can contact with the lead while moving in the child card insert direction pushed by the child card. The parent card also includes a connector element for contacting with the electronic device.

Abstract: A semiconductor chip having a semiconductor substrate, a plurality of pads formed above the semiconductor substrate a first passivating film formed over an entire surface of the semiconductor substrate, and having openings above the pads the surface of the first passivating film being flat, a plurality of interconnection lines formed on the surface of the first passivating film, a second passivating film formed over the entire surface of the first passivating film and having through holes, the through holes being arranged in the form of an array, the surface of the second passivating film being flat, a plurality of contacts for connection to external leads each of the contacts being formed within and above a respective one of the through holes, the contacts being arranged in the form of an array.

Abstract: A memory card is to be inserted into an electronic device so as to add a memory function. The memory card comprises a parent card and a child card, the child card including a semiconductor memory element and a lead as an external terminal of the memory element. The parent card includes a child card receiving portion and a child card insert port for inserting the child card into the child card receiving portion through the child card insert port, and a contact to be contacted with the lead of the child card within the child card receiving portion. A contact opening/closing slide is provided for causing a contacting portion of the contact to be shifted to a position in which it can contact with the lead while moving in the child card insert direction pushed by the child card. The parent card also includes a connector element for contacting with the electronic device.

Abstract: With an auxiliary electrode having a shape corresponding to the end of a workpiece attached to an upper electrode of a high frequency heater for high-frequency heating the end of the workpiece extruded, the workpiece is high-frequency heated intensively and uniformly between the auxiliary electrode and the lower electrode. After heating, the end of the workpiece is molded into a predetermined shape by a couple of stamping molds.

Abstract: Described herein are mevalonolactone derivatives having a quinoline ring of formula (I) ##STR1## wherein the R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, Y and Z variables are described therein.

Abstract: The invention provides a method for purifying a crude naphthalenedicarboxylic acid comprising the steps of mixing a crude naphthalenedicarboxylic acid and a water/alcohol solvent to esterify a part of the naphthalenedicarboxylic acid, thereby dissolving a naphthalenedicarboxylic ester into the solvent, and then contacting the resulting reaction mixture with hydrogen in the presence of a hydrogenation catalyst to hydrogenate impurities which are contained in the crude naphthalenedicarboxylic acid and which are capable of being hydrogenated, thereby dissolving and removing hydrogenation products into the water/alcohol solvent. A mixture of a naphthalene dicarboxylic acid and a naphthalenedicarboxylic ester with reduced impurity contents, or a high-purity naphthalenedicarboxylic acid can be obtained.

Abstract: A semiconductor package socket comprises an insulating support substrate, pin contacts arranged in a constant-pitch lattice-array and which are attached in a manner that permits advance or retreat in a direction which is almost perpendicular to a main surface of the support substrate, a pin contact movement driving mechanism which advances or retreats the pin contacts en bloc, and a guide frame which has spaces to accommodate said pin contacts, which is freely detachable and which can cover areas other than those required by the pin contacts.

Abstract: A semiconductor package comprises a circuit board having a wiring circuit including at least a connecting portion, the wiring circuit being formed on a first main surface of the circuit board, a semiconductor chip mounted on the first main surface of the circuit board on face-down basis, an insulation resin layer filled in a space between the semiconductor chip and the circuit board, and a flat-type external connecting terminal electrically connected to the semiconductor chip and formed and exposed to a second main surface of the circuit board.

Abstract: A compound of the formula ##STR1## Z=--CH(OH)--CH.sub.2 --CH(OH)--CH.sub.2 --COO.1/2Ca have HMG--CoA inhibiting effects, making them useful as inhibitors of cholesterol biosynthesis. The compound may be prepared as a pharmaceutical for reducing hyperlipidemia, hyperlipoproteinemia or atherosclerosis.

Abstract: Described herein are mevalonolactone derivatives having a quinoline ring of formula (I) ##STR1## wherein the R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, Y and Z variables are described therein.

Abstract: A method for producing aryl alkyl hydroperoxides which comprises selectively oxidizing an aryl alkyl hydrocarbon having the formula: ##STR1## wherein P and Q are hydrogen or an alkyl and may be the same or different from each other; x is an integer of 1-3; and Ar is an aromatic hydrocarbon group having a valence of x, with an oxygen-containing gas in the presence of a transition metal complex which contains, as a ligand, a cyclic polyfunctional amine compound having at least three nitrogen atoms in the ring forming molecular chain or an open chain polyfunctional amine compound having at least three nitrogen atoms in the main chain of the molecule.

Abstract: A card type memory device comprises a semiconductor chip having a nonvolatile semiconductor memory formed with external connection terminals and a metal frame comprising bed sections and external terminal electrode sections with a step section formed between the bed section and the external terminal electrode section, the bed sections of the metal frame being electrically connected to the external terminal electrode sections of the semiconductor chip. At least one surface and outer peripheral surface of the semiconductor chip are resin sealed such that at least electrode surfaces of the external terminal electrode sections of the metal frame are exposed substantially flush with a resin-sealed body surface. By doing so, a semiconductor package is formed. The semiconductor package is buried in a recess in a card type base board such that the electrode surfaces of the external terminal electrode sections of the metal frame in the semiconductor package is buried substantially flush with an external surface.

Abstract: A semiconductor package comprises a resin type board or a ceramic type board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a sealing resin layer filled between the lower surface of the semiconductor chip and the upper surface of the board, and flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board with constant pitches in a lattice shape.

Abstract: In the production of polyethylene naphthalate of the present invention, the esterification reaction between naphthalenedicarboxylic acid and ethylene glycol is conducted while causing water to be present in a reaction system from a start of reaction, in the presence of at least one catalyst selected from the group consisting of nitric, carboxylic, phosphoric and hydrogenphosphoric acid metal salts and alkyl amines according to necessity, to thereby attain an esterification ratio of 45 to 80%, so that a liquid mixture of naphthalenedicarboxylic acid esterification reaction products containing naphthalenedicarboxylic acid, carboxyl-hydroxyethoxycarbonylnaphthalene and bis(hydroxyethoxycarbonyl)naphthalene is obtained. Subsequently, a crystallized reaction product is separated from this liquid mixture to thereby obtain a mixture of esterification reaction products. Thereafter, this mixture having ethylene glycol added thereto according to necessity is subjected to polycondensation.

Abstract: A semiconductor package has a wiring circuit containing a conductive terminal formed on a first face of a substrate and a flat external connecting terminal electrically connected to the wiring circuit formed on a second face. An electrode pad is formed on a first face of a semiconductor chip. This semiconductor chip is mounted on the substrate with its first face down to oppose the first face of the substrate. A ball bump as a protruded electrode formed on the conductive terminal of the substrate and a ball bump as a protruded electrode formed on the electrode pad of the semiconductor chip are connected by solid phase diffusion. And, a sealing resin layer is formed in the space between the substrate and the semiconductor chip opposed to each other with a second face of the semiconductor chip exposed.

Abstract: A one-sided sealed type semiconductor device comprising a substrate proper for a one-sided resin mold provided on the first main surface thereof with a wiring circuit including connection parts for semiconductor elements and on the second main surface thereof with flat type external connection terminals led out thereon via a through hole, semiconductor elements set in place and packaged in predetermined areas of the first main surface of the substrate proper, a transfer mold resin layer for sealing solely the surface having the semiconductor elements packaged thereon, and a metallic layer formed on the first main surface independently of wiring circuit and outside the area having the wiring circuit.

Abstract: A window molding for automobiles, which is installed around the periphery of a windshield, including a leg and a head. The head is formed to permit the creation of two different water guide portions extending along the molding, one that will function along the roof line and another along the side edge of the windshield. The side water guide portion prevents water from going from the windshield to the side windows. The roof line water guide portion opens toward the window frame and prevents water from flowing from the roof onto the windshield.

Abstract: The first semiconductor package comprises a board equipped wiped with a wiring circuit including a connection on a main surface, a semiconductor chip mounted face down having input/output terminal corresponding to the connection of the board, flat external connector terminals leading to and are exposed on the other main surface of the board, and filled via hole connection to be electrically connected to the wiring circuit through a filled via hole installed right above each external connector terminal. Further, the second semiconductor package utilizes the above-described construction but the flat external connector terminals are led to and exposed on the other main surface of the board in a constant-pitch lattice-array.

Abstract: An automobile window molding includes an elongated leg having an embedded core member, an outer head portion having a contact portion, an inner support portion, a seal lip and a position control portion. The molding is suited to position a window in a supporting window frame. The head portion is integrally formed at an upper end of the leg and extends over a portion of the front widow glass. The contact portion is defined by a projection positioned between the head portion and the inner support portion so as to touch the end surface of the front window glass. The inner support portion is formed at a lower end of the leg and is configured to touch an inner surface of the front window glass. The perimeter of the front window glass is held between the head portion and the inner support portion. At least one seal lip is formed on the leg so as to contact a window frame.

Abstract: A semiconductor chip having a semiconductor substrate, a plurality of pads formed above the semiconductor substrate a first passivating film formed over an entire surface of the semiconductor substrate, and having openings above the pads the surface of the first passivating film being flat, a plurality of interconnection lines formed on the surface of the first passivating film, a second passivating film formed over the entire surface of the first passivating film and having through holes, the through holes being arranged in the form of an array, the surface of the second passivating film being flat, a plurality of contacts for connection to external leads each of the contacts being formed within and above a respective one of the through holes, the contacts being arranged in the form of an array.