Abstract: A semiconductor package has high reliability and a simple structure and configuration, can be removed as a function section performing the main data processing, substantially improves retainability and portability, and is connected to external equipment without the need of contact. The semiconductor package comprises a circuit board on one main side of which has a region in which IC chips can be mounted, ac IC chip mounted in said region on the surface of the circuit board, a shield resin layer that buries or covers at least part of the mounted IC chip, at least one loop-like antenna pattern integrally formed in a region of the main side other than the region in which the IC chip is mounted for transmitting and receiving signals without the need of contact, and an antenna pattern for power induction located independently of said antenna pattern and inducing power electromagnetically.

Abstract: In the disclosed method of manufacturing semiconductor devices with a single-sided resin-sealed package structure, when resin is filled into between the chip and the substrate, the occurrence of variations in the finishing dimensions of the package or defects in the outward appearance of the package is prevented.

Abstract: The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.

Abstract: A method of fabricating a semiconductor package comprising the steps of setting a semiconductor chip having a pad with protruding electrodes on an insulation board having a main surface on which a wiring circuit and connection terminals are formed and an other main surface on which flat-type external connecting terminals are formed, to align the protruding electrodes of the semiconductor chip with the connection terminals of the insulating board, wherein the insulating board is installed on a pressing stage, pressing the semiconductor chip onto the insulation board to connect the protruding electrodes to the connection terminals, clamping the semiconductor chip and the insulation board by clamping means to form a clamped unit which keeps the pressure on the semiconductor chip and the insulation board, transferring the clamped unit from the pressing stage to a resin supplying stage, supplying a sealing resin in a space formed between an upper surface of the circuit board and a lower surface of the semiconducto

Abstract: A thin IC card which is highly reliable, simple in construction and structure, to which a function section relating to main information processing can be easily attached, and which has improved portability, and a method for producing it are disclosed.

Abstract: According to this invention, there is provided a compound semiconductor substrate including, on a compound semiconductor base containing a high-concentration impurity, a high-resistance single-crystal layer consisting of the same compound semiconductor as the compound semiconductor constituting the base. Active elements are formed in the high-resistance single-crystal layer.

Abstract: An external storage device includes a storage medium series element containing at least a non-volatile memory device and external connection terminals connected to input/output terminals of the storage medium series element. An insulator molds the series element and terminals into a plate to form a plate-shaped external storage device. The terminals may be exposed in concavities or in a plane on a peripheral surface of the external storage device.

Abstract: An external storage device includes an external storage device main and an external storage device unit. The external storage device main includes a thin type external storage device module formed into a one-side sealed package and having a storage medium series element containing at least one non-volatile semiconductor memory device, and a flat type external connection terminal connected to an input/output terminal of the storage medium series element and led and exposed to a backside of the external storage device module. The external storage device unit includes an external storage device main detachable section for engaging, insertedly attaching and detaching the external storage device main, a resilient contact electrically connecting to the external connection terminal of the external storage device main to be mounted, and at least a part of circuit function for driving and controlling the storage medium series element.

Abstract: A diastereomer salt of optically active quinolinemevalonic acid of the formula ((-)I.multidot.

Abstract: There is disclosed a process for producing an aromatic hydroxylic compound by acid decomposition of a hydroperoxide having the general formula (I) ##STR1## wherein Ar represents an aromatic hydrocarbon group having a valence of n; and n represents an integer of 1 or 2, in the presence of an acid catalyst, thereby to provide an aromatic hydroxylic compound having the general formula (II)Ar--(OH)n (II)wherein Ar and n are the same as above defined, characterized in that tetrafluoroboric acid, hexafluorosilicic acid or hexafluorophosphoric acid is used as the acid catalyst. According to this process, the aromatic hydroxylic compound is obtained in a high yield while the by-production of hydroxyacetone is effectively suppressed.

Abstract: A diastereomer salt of optically active quinolinemevalonic acid of the formula ((-)I.

Abstract: A continuous casting method includes the steps of continuously supplying molten metal into a mold through at least one feed nozzle connected to the mold through a break ring, with the feed nozzle, the mold and the break ring forming at least a portion of a continuous casting apparatus, and intermittently withdrawing a cast piece formed from the molten metal in the mold thereby creating pressure in a space formed at a connecting point between the break ring, the mold and the cast piece as a result of the withdrawal from the mold. A shield means is placed to seal-off space between the at least one feed nozzle, and the mold to prevent entry of gas into the continuous casting apparatus and the pressure is reduced in the sealed-off space to thereby eliminate a pressure differential between the pressure in the sealed-off space and the pressure created in the space formed at the connecting point between the break ring, the mold and the cast piece during the intermittent withdrawal from the mold.

Abstract: A method is provided for forming an elongate body having thickness change, such as a car window molding. In the method, a vertical member is extruded into a fixed wall thickness and a fixed outline. A horizontal member is extruded into the same outline as that of the vertical member but has a smaller wall thickness than that of the vertical member. An apparatus is provided to perform the method. The apparatus has a slide core axially reciprocating in a bore of a die so as to change a shape of a forming space.

Abstract: An automatic stretch-wrapping apparatus for wrapping a load, including empty PET bottles, with a stretchable film. The apparatus includes a turntable for placing the load thereon, and the stretchable film is supplied from a roll of stretchable film in a vertical position via film tensioning rollers to a gripper device. The gripper device is mounted on the turntable for gripping the leading end of the film and can rotate not only with the turntable but also relative to the turntable. Also, a swing arm device is arranged for movement toward and away from the gripper device to cooperate with the gripper device and includes pusher blades for pushing the film toward the gripping fingers of the gripper device, a heatsealer, and a cutter. It is possible to automatically wrap the load by the film in only one turn thereof.

Abstract: The method of manufacturing the SB FET according to the present invention includes a first step of forming a refractory metal film on a semiconductor substrate, a second step of forming a first ion-implanted region within the semiconductor substrate, by an ion implantation process, a third step, independent of the second step, of forming second and third ion implantation regions in the semiconductor substrate by an ion implantation process during which impurity ions pass through the first film, with the second and third ion implantation regions being adjacent to the first ion implanted region.

Abstract: An image-receiving sheet for thermal transfer printing comprising a substrate and an image-receiving layer disposed on said substrate, characterized in that said image-receiving layer contains thermoplastic resin fine particle aggregates. And an image-receiving sheet comprising a substrate, an intermediate layer disposed on said substrate, and an image-receiving layer disposed on said intermediate layer, characterized in that at least said intermediate layer contains thermoplastic resin fine particle aggregates.

Abstract: A door lower molding that has a main body molded of a synthetic resin by extrusion. The main body is fixed along a lower end of a door of a vehicle. The main body has a seal lip extended thereon, which closely contacts a rocker molding of the vehicle body when the door is closed. A core made of a synthetic resin is embedded in the main body. The seal lip may be covered on its outer side with a skin which has a flaw resistance characteristic and on its inner side with a sealing layer including silicone to prevent freeze-sticking to the vehicle body.