Patents by Inventor Hiroshi Kagata
Hiroshi Kagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20050067177Abstract: A module includes a ceramic substrate, first and second electrodes provided on the ceramic substrate, a component having third and fourth electrodes connected to the first and second electrodes, respectively, and a resin filled in a space between the component and the ceramic substrate. The ceramic substrate has a surface thereof having a recess formed therein. The first and second electrodes are provided on the surface of the ceramic substrate so that the recess is located between the first and second electrodes. The component is located over the recess and spaced from the ceramic substrate with a space including the recess. The space including the recess is filled with the resin. The module allows each component to be surface mounted at higher bonding strength, thus preventing short-circuit between the electrodes on the substrate and improving the operation reliability.Type: ApplicationFiled: September 29, 2004Publication date: March 31, 2005Inventors: Ryuichi Saito, Hiroshi Kagata, Masaaki Katsumata
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Publication number: 20050030701Abstract: A dielectric ceramics includes a main ingredient, and a supplemental ingredient in an amount of 0.05 to 2 wt % for the main ingredient. The main ingredient is expressed by xBiO3/2-yCaO-zNbO5/2 and is within a scope of a specified quadrilateral region in a ternary system diagram, and the supplemental ingredient is a glass composition including at least SiO2, Li2O and MO (M includes at least one of Ca, Sr and Ba). A ceramic electronic component is produced by co-firing a dielectric layer composed of the dielectric ceramics and a conductive layer mainly composed of silver, and has a low degradation in Q value and excellent microwave characteristics.Type: ApplicationFiled: August 6, 2004Publication date: February 10, 2005Applicant: Matsushita Elec. Ind. Co. Ltd.Inventors: Hidenori Katsumura, Ryuichi Saito, Hiroshi Kagata
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Patent number: 6835681Abstract: A dielectric ceramic composition containing a first component and a second component (25 to 80 wt %) is used. The first component is a complex oxide represented by Formula: xZrO2-yTiO2-zL(1+u)/3M(2−u)/3O2 (L is at least one element selected from the group consisting of Mg, Zn, Co, and Mn, and M is at least one element selected from the group consisting of Nb and Tb. x, y, z, and u are numerical values represented by x+y+z=1, 0.10≦x≦0.60, 0.20 ≦y≦0.60, 0.01≦z≦0.70, 0≦u≦1.90). The second component is a glass composition containing an oxide of at least one element selected from the group consisting of Si, B, Al, Ba, Ca, Sr, Zn, Ti, La, and Nd.Type: GrantFiled: December 19, 2001Date of Patent: December 28, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kojiro Okuyama, Hiroshi Kagata, Junichi Kato, Hiroyuki Hase
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Patent number: 6822534Abstract: A laminated filter includes: a first dielectric layer having a first shield electrode on one principal plane; a second dielectric layer having resonator electrodes on one principal plane; a third dielectric layer having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer having a second shield electrode on one principal plane; a fifth dielectric layer whose at least one principal plane is exposed outside; and a grounding electrode provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole provided in the above-described first dielectric layer.Type: GrantFiled: January 10, 2003Date of Patent: November 23, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazuhide Uriu, Hiroyuki Nakamura, Toru Yamada, Tsutomu Matsumura, Hiroshi Kagata, Kouji Kawakita, Toshio Ishizaki
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Patent number: 6765460Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: December 10, 2002Date of Patent: July 20, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
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Patent number: 6762369Abstract: A multilayer ceramic substrate includes a glass ceramic body, a conductive pattern, and a via conductor. The conductive pattern is formed in the glass ceramic body and on at least one principal surface of the glass ceramic body. The via conductor makes a connection between the predetermined conductive patterns. The via conductor includes a conductive material and a Mo compound or a Mo metal. The conductive material includes at least one selected from the group consisting of Ag, Au, Pt and Pd as a main component. The amount of Mo compound or Mo metal is in the range of 0.05 to 10 parts by weight in terms of Mo metal with respect to 100 parts by weight of the conductive material. This multilayer ceramic substrate can achieve sufficient flatness and high dimensional accuracy, while preventing defects that occurs in the vicinity of electrodes after firing.Type: GrantFiled: October 28, 2002Date of Patent: July 13, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Ryuichi Saito, Hidenori Katsumura, Hiroshi Kagata
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Patent number: 6762142Abstract: A dielectric ceramic is made of a sintered body of a complex oxide including at least one element selected from the group consisting of Zr, Ti and Mn, at least one element selected from the group consisting of Mg, Zn and Co, and at least one element selected from the group consisting of Nb and Ta, wherein, the complex oxide is represented by a formula xZrO2-yTiO2-zA(1+w)/3B(2−w)/3O2 where ‘A’ in the formula denotes at least one element selected from the group (A) consisting of Mg, Zn and Co, ‘B’ denotes at one element selected from the group (B) consisting of Nb and Ta; x, y, z and w denote values in the respective ranges of 0.20≦x≦0.55, 0.40≦y≦0.55, 0.05≦z≦0.25, and 0≦w≦0.30, and x, y and z have a relationship represented as x+y+z=1; MnO is present in a range of 0.1 mol % to 1.Type: GrantFiled: September 19, 2002Date of Patent: July 13, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kojiro Okuyama, Junichi Kato, Hiroshi Kagata, Kenji Iijima
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Publication number: 20040041309Abstract: It is an object of the present invention to provide a ceramic component with high reliability and accuracy in dimension in which electrical characteristics thereof are not largely deteriorated and defects such as cracks around the inner electrodes in the substrate after firing are inhibited, in a firing technique with high accuracy in dimension for sandwiching a glass ceramic laminate with heat-shrinkage inhibiting sheets and firing them.Type: ApplicationFiled: August 26, 2003Publication date: March 4, 2004Inventors: Hidenori Katsumura, Ryuichi Saito, Tsukasa Wakabayashi, Hiroshi Kagata
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Publication number: 20030147197Abstract: A laminated filter includes: a first dielectric layer 2101a having a first shield electrode on one principal plane; a second dielectric layer 2101b having resonator electrodes on one principal plane; a third dielectric layer 2101c having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer 2101d having a second shield electrode on one principal plane; a fifth dielectric layer 2101d whose at least one principal plane is exposed outside; and a grounding electrode 2108 provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole 2109 provided in the above-described first dielectric layer.Type: ApplicationFiled: January 10, 2003Publication date: August 7, 2003Inventors: Kazuhide Uriu, Hiroyuki Nakamura, Toru Yamada, Tsutomu Matsumura, HIroshi Kagata, Kouji Kawakita, Toshio Ishizaki
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Publication number: 20030117242Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: ApplicationFiled: December 10, 2002Publication date: June 26, 2003Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
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Publication number: 20030116891Abstract: A dielectric ceramic is made of a sintered body of a complex oxide including at least one element selected from the group consisting of Zr, Ti and Mn, at least one element selected from the group consisting of Mg, Zn and Co, and at least one element selected from the group consisting of Nb and Ta, wherein, the complex oxide is represented by a formula xZrO2-yTiO2-zA(1+w)/3B(2−w)/3O2 where ‘A’ in the formula denotes at least one element selected from the group (A) consisting of Mg, Zn and Co, ‘B’ denotes at one element selected from the group (B) consisting of Nb and Ta; x, y, z and w denote values in the respective ranges of 0.20≦x≦0.55, 0.40≦y≦0.55, 0.05≦z≦0.25, and 0≦w≦0.30, and x, y and z have a relationship represented as x+y+z=1; MnO is present in a range of 0.1 mol % to 1.Type: ApplicationFiled: September 19, 2002Publication date: June 26, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kojiro Okuyama, Junichi Kato, Hiroshi Kagata, Kenji Iijima
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Patent number: 6579817Abstract: A dielectric ceramic composition including at least a first component containing Al2O3, MgO and ROa (R is at least one element selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Tb and Gd; a is a value stoichiometrically determined in accordance with the valence of R); SiO2 as a second component; and a third component containing a glass composition including two or more components containing at least one selected from the group consisting of SiO2 and B2O3. A dielectric ceramic composition stably has a high strength in a high frequency band such as microwave, millimeter wave, etc., and has a small dielectric constant, a low loss, and a small temperature constant at capacitance.Type: GrantFiled: April 20, 2001Date of Patent: June 17, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kenji Harada, Hiroshi Kagata, Hidenori Katsumura
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Publication number: 20030094307Abstract: A multilayer ceramic substrate includes a glass ceramic body, a conductive pattern, and a via conductor. The conductive pattern is formed in the glass ceramic body and on at least one principal surface of the glass ceramic body. The via conductor makes a connection between the predetermined conductive patterns. The via conductor includes a conductive material and a Mo compound or a Mo metal. The conductive material includes at least one selected from the group consisting of Ag, Au, Pt and Pd as a main component. The amount of Mo compound or Mo metal is in the range of 0.05 to 10 parts by weight in terms of Mo metal with respect to 100 parts by weight of the conductive material. This multilayer ceramic substrate can achieve sufficient flatness and high dimensional accuracy, while preventing defects that occurs in the vicinity of electrodes after firing.Type: ApplicationFiled: October 28, 2002Publication date: May 22, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Ryuichi Saito, Hidenori Katsumura, Hiroshi Kagata
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Patent number: 6518863Abstract: A dielectric laminated device, has a layered product including a plurality of dielectric layers; and a plurality of strip line conductors arranged in the interior of the layered product, wherein the thickness of at least part of the side part of at least one strip line conductor among the plurality of strip line conductors is thicker than that of the central part.Type: GrantFiled: May 23, 2001Date of Patent: February 11, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Emiko Kawahara, Toru Yamada, Hiroshi Kagata
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Publication number: 20030020569Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: ApplicationFiled: September 24, 2002Publication date: January 30, 2003Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
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Patent number: 6510607Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: June 27, 2001Date of Patent: January 28, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
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Patent number: 6456172Abstract: A multilayered ceramic RF device having at least one radio frequency filter includes a low temperature-cofired multilayered ceramic body having a plurality of ceramic layers laminated one upon another and fired together. The low temperature-cofired multilayered ceramic body also has a first electrode pattern formed therein and a second electrode pattern formed thereon. The first and second electrode patterns are electrically connected to one another through a via hole. A bare semiconductor chip is mounted on the low temperature-cofired multilayered ceramic body with a face down bonding, and the bare semiconductor chip is coated with a sealing resin. The at least one radio frequency filter is a multilayered filter formed in the low temperature-cofired multilayered ceramic body, and the multilayered filter includes a part of the first and second electrode patterns.Type: GrantFiled: October 20, 2000Date of Patent: September 24, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Makoto Sakakura
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Publication number: 20020111261Abstract: A dielectric ceramic composition containing a first component and a second component (25 to 80 wt %) is used. The first component is a complex oxide represented by Formula: xZrO2—yTiO2—zL(1+u)/3M(2−u)/3O2 (L is at least one element selected from the group consisting of Mg, Zn, Co, and Mn, and M is at least one element selected from the group consisting of Nb and Tb. x, y, z, and u are numerical values represented by x+y+z=1, 0.10≦x≦0.60, 0.20≦y≦0.60, 0.01≦z≦0.70, 0≦u≦1.90). The second component is a glass composition containing an oxide of at least one element selected from the group consisting of Si, B, Al, Ba, Ca, Sr, Zn, Ti, La, and Nd.Type: ApplicationFiled: December 19, 2001Publication date: August 15, 2002Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kojiro Okuyama, Hiroshi Kagata, Junichi Kato, Hiroyuki Hase
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Patent number: 6346866Abstract: By using a method for manufacturing a dielectric laminated. device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: November 15, 1999Date of Patent: February 12, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
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Publication number: 20020000900Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: ApplicationFiled: November 15, 1999Publication date: January 3, 2002Inventors: HIDEAKI NAKAKUBO, TOSHIO ISHIZAKI, TORU YAMADA, HIROSHI KAGATA, TATSUYA INOUE, SHOICHI KITAZAWA