Abstract: The disclosure provides a piezoelectric device includes a piezoelectric vibrating piece and a coating layer. The piezoelectric vibrating piece includes an electrode and an exposed portion. The coating layer is constituted of a material with a sputtering rate lower than a sputtering rate of a material of the electrode, the coating layer covering the exposed portion.

Abstract: To provide a joint structure capable of suitably joining members which compose the joint structure, and to provide a joining method thereof. The joint structure includes a shaft member, and a cylindrical member an inner surface of which is fitted to an outer surface of the shaft member. The cylindrical member includes first crimped portions which are crimped along axial grooves provided in an axial direction of the shaft member; and a second crimped portion which fits the axial grooves and is crimped along a circumferential groove, the circumferential groove being provided on a circumferential surface of the shaft member by reducing a diameter of an axially intermediate portion in a radial direction.

Abstract: Provided are: a joining structure capable of suitably obtaining joining strength between components which compose the joining structure; and a joining method thereof. For this purpose, a joining structure (1) includes: a shaft member (10); and a thin-walled cylindrical member (20) that fits an inner circumferential surface thereof to an outer circumferential surface of the shaft member (10). The thin-walled cylindrical member (20) has: a first crimped portion (21), in which an axially intermediate portion is reduced in diameter in a radial direction, and is crimped to the shaft member (10); and a second crimped portion (22), in which an end surface (20a) is folded radially inward, and is crimped to the shaft member (10).

Abstract: A linear actuator is provided which is able to simplify its structure by adding a stopper function, too, to a detent mechanism and to prevent generation of radial load. The linear actuator comprises a ball screw mechanism, to which a rotational driving force is transmitted, for converting a rotational motion into a linear motion. The ball screw mechanism comprises radially projecting guide projections provided in a linear motion component, and a guide groove arranged in a securing portion facing the linear motion component and is engaged with the guide projections to guide the guide projections in an axial direction. The guide projection has a projection projecting by the predetermined length, while engaging into the guide groove, at a stroke end of the linear motion component and a locking portion provided in a rotary motion component is locked to the projection of the guide projection.

Abstract: A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film.

Abstract: A linear actuator is provided which is able to simplify its structure by adding a stopper function, too, to a detent mechanism and to prevent generation of radial load. The linear actuator comprises a ball screw mechanism, to which a rotational driving force is transmitted, for converting a rotational motion into a linear motion. The ball screw mechanism comprises radially projecting guide projections provided in a linear motion component, and a guide groove arranged in a securing portion facing the linear motion component and is engaged with the guide projections to guide the guide projections in an axial direction. The guide projection has a projection projecting by the predetermined length, while engaging into the guide groove, at a stroke end of the linear motion component and a locking portion provided in a rotary motion component is locked to the projection of the guide projection.

Abstract: An exemplary piezoelectric device includes a piezoelectric vibrating piece, on which excitation electrodes are formed, and a piezoelectric frame having a frame portion surrounding the piezoelectric vibrating piece. A plate (e.g., lid or base) is bonded to one surface of the frame portion. Fitting members are provided on both the frame and the plate. When the piezoelectric frame and plate are brought together for assembly, the fitting members fit together (e.g., interdigitate) to provide quick and error-free alignment. Then, the fitting members are bonded together by a bonding material.

Abstract: A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.

Abstract: An aluminum alloy is composed of 15% or more and 7.5% or less by mass of silicon, 0.45% or more and 0.8% or less by mass of magnesium, 0.05% or more and 0.35% or less by mass of chromium, and aluminum, assuming that the total amount of the alloy is 100% by mass.

Abstract: An exemplary piezoelectric device includes a piezoelectric vibrating piece, on which excitation electrodes are formed, and a piezoelectric frame having a frame portion surrounding the piezoelectric vibrating piece. A plate (e.g., lid or base) is bonded to one surface of the frame portion. Fitting members are provided on both the frame and the plate. When the piezoelectric frame and plate are brought together for assembly, the fitting members fit together (e.g., interdigitate) to provide quick and error-free alignment. Then, the fitting members are bonded together by a bonding material.

Abstract: In an exemplary method a piezoelectric wafer is prepared on which multiple piezoelectric frames are formed. Each frame has a piezoelectric vibrating piece including excitation electrodes, and a frame portion surrounds the vibrating piece. A lid wafer is prepared on which multiple respective lids are formed, each sized substantially similarly to the respective frames. A base wafer is prepared on which multiple of bases are formed, each sized substantially similarly to the respective frames. Each base has through-holes. Stripes of a first bonding film are formed on both major surfaces of the piezoelectric wafer around the periphery of each frame. Stripes of a second bonding film are formed on the inner major surface of the lid wafer, corresponding to respective stripes of the first bonding film. Stripes of a third bonding film are formed on the inner major surface of the base wafer, corresponding to respective stripes of the first bonding film.

Abstract: A transaction coordinating device 100 is composed, in which a transportation adjusting portion 140 is provided for adjusting an insertion of cargo transportation of a spot transaction with respect to a schedule of single and/or plural cargo transportation of predetermined fixed transactions, in the event an insertion of a spot transaction based on a temporary contract with respect to fixed transactions based on the contracts of predetermined period of time is adjusted. Accordingly, inserting cargo transportation of a spot transaction easily into a schedule of single and/or plural cargo transportation of fixed transactions becomes possible even in the event that a spot transaction arises suddenly, and further inserting a commodity transaction under a flexible contract into commodity transactions under rigid contract simply also becomes possible.

Abstract: The object of the present invention is to provide a rare-earth magnet having a sufficient corrosion resistance, and a method of manufacturing the same. The rare-earth element in accordance with a preferred embodiment comprises a magnet body containing a rare-earth element, and a protective layer formed on a surface of the magnet body. The protective layer in accordance with a preferred embodiment includes a first layer covering the magnet body and containing a rare-earth element, and a second layer covering the first layer and containing substantially no rare-earth element. Another protective layer in accordance with a preferred embodiment comprises an inner protective layer and an outer protective layer successively from the magnet body side. The outer protective layer is any of an oxide layer, a resin layer, a metal salt layer, and a layer containing an organic-inorganic hybrid compound.

Abstract: A compressor having a housing formed by a plurality of housing members that are connected together is disclosed. The compressor is configured in such a manner that refrigerant is compressed in the housing and discharged to the exterior. Each of the housing members contains 9 to 17 percent by mass of Si, 3.5 to 6 percent by mass of Cu, 0.2 to 1.2 percent by mass of Mg, 0.2 to 1.5 percent by mass of Fe, 0 to 1 percent by mass of Mn, 0.5 percent by mass or less of Ni, and a remaining portion containing Al and unavoidable impurities. It is preferred that the average hardness of each housing member is adjusted to HV130 to HV170 through solution heating in which the housing member is maintained at the treatment temperature of 450° C. to 510° C. for 0.5 hours or longer, followed by water quenching, and then by aging treatment in which the housing member is maintained at the treatment temperature of 170° C. to 230° C. for one to twenty-four hours after the c housing member is cast.

Abstract: A cast aluminum alloy excellent in the relaxation resistance property, comprising 9 to 17% by mass of Si, 3 to 6% by mass of Cu, 0.2 to 1.2% by mass of Mg, 0.2 to 1.5% by mass of Fe, 0.1 to 1% by mass of Mn, a balance consists of Al and unavoidable impurities, wherein a Ni content is not more than 0.5% by mass. The average hardness is adjusted to HV130 to HV160 by performing, after casting, solution heating by retaining the alloy at a treatment temperature of 450 to 510° C. for 0.5 hour or longer, performing water quenching and, thereafter, performing aging treatment by retaining the alloy at a treatment temperature of 170 to 230° C. for 1 to 24 hours.

Abstract: In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.

Abstract: In the surface acoustic wave device including a lead frame made of metal in which a plurality of inner leads 9 are formed, wherein a chip 1 comprising at least one piezoelectric substrate is mounted on a resin base 3 into which a lead frame is molded integrally, are provided a wire lead section metal surface 7a that is formed by exposing a wire lead section 7, which is electrically connected with an electrode of the chip through a bonding wire 4, out of inner leads that are arranged on both sides of the chip, from the resin base, and a chip lead section metal surface 10a that is formed by exposing a chip lead section 10, which is partially covered with the chip, from the resin base.

Abstract: An optical disc is includes a recording layer, a reflective layer, and a protective layer provided, in that order, on one surface of a light-transmissive substrate and a hard coating layer having a thickness in the range of 1 to 5 ?m on the other surface of the substrate. The hard coating layer is formed by applying and curing a solution comprising a hard coating agent containing colloidal silica and a UV-curable acrylic resin and a solvent containing butyl acetate as a principal constituent. The hard coating layer contains 90 mg/cm3 or less of residual solvent.

Abstract: An optical disc is includes a recording layer, a reflective layer, and a protective layer provided, in that order, on one surface of a light-transmissive substrate and a hard coating layer having a thickness in the range of 1 to 5 ?m on the other surface of the substrate. The hard coating layer is formed by applying and curing a solution comprising a hard coating agent containing colloidal silica and a UV-curable acrylic resin and a solvent containing propylene glycol monomethyl ether acetate as a principal constituent. The hard coating layer contains 110 mg/cm3 or less of residual solvent.