Patents by Inventor Hiroshi Kuroda

Hiroshi Kuroda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190167672
    Abstract: Provided is a superior, novel heterocyclic compound with improved solubility in oil such as sesame oil and benzyl benzoate, which has a broader treatment spectrum, causes less side effects, and is superior in tolerability and safety, and use thereof. A heterocyclic compound represented by the formula (I) wherein each symbol is as defined in the specification, or a salt thereof.
    Type: Application
    Filed: February 6, 2019
    Publication date: June 6, 2019
    Applicant: OTSUKA PHARMACEUTICAL CO., LTD.
    Inventors: Hiroshi YAMASHITA, Yohji SAKURAI, Motoyuki MIYAMOTO, Yuichi NAKAMURA, Hideaki KURODA, Takuya MINOWA
  • Patent number: 10307848
    Abstract: An electrical discharge machining electrode wire includes a core including a copper or a copper alloy, and a covering layer covering a periphery of the core and including a zinc. The covering layer includes an inner layer including a ?-phase of copper-zinc based alloy and covering the periphery of the core, and an outer layer including an ?-phase of copper-zinc based alloy and covering a periphery of the inner layer. An x-ray diffraction intensity of (0001) of the ?-phase is more than twice an x-ray diffraction intensity of (332) of the ?-phase.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: June 4, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Takayuki Tsuji, Hiromitsu Kuroda, Tetsuya Tokumitsu, Takamitsu Kimura, Yosuke Shiba, Hiroshi Matsuzaki, Yuichi Komuro, Shingo Amamiya
  • Patent number: 10026158
    Abstract: The present invention addresses the problem of providing an imaging device that prevents mismatching in image matching for parallax calculation even if the sharpnesses of an end part and center part of a processing area differ. An imaging device 1 according to the present invention is provided with a means for equalizing the sharpnesses of the processing areas of a reference image and a comparison image.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: July 17, 2018
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Toshiyuki Aoki, Takeshi Shima, Tatsuhiko Monji, Hiroshi Kuroda, Keiichi Betsui, Seiji Murata
  • Publication number: 20180164430
    Abstract: A sensor has an antenna. The antenna includes a radiation source and a wave guide. The radiation source is formed on a substrate. The wave guide internally propagates electromagnetic waves radiated from the radiation source and radiates the electromagnetic waves as a beam. The wave guide has a radiation-side opening in which a first direction and a second direction are orthogonal to each other, and the second direction is longer than the first direction. In a cross-sectional shape of the beam, perpendicular to a radiation direction of the beam radiated from the wave guide, a first direction and a second direction are orthogonal to each other, and the second direction is narrower than the first direction.
    Type: Application
    Filed: May 13, 2016
    Publication date: June 14, 2018
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Akira KURIYAMA, Hideyuki NAGAISHI, Hiroshi KURODA
  • Patent number: 9997499
    Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: June 12, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroshi Kuroda, Hideo Koike
  • Patent number: 9983022
    Abstract: An onboard control device that is installed at a vehicle acquires land mark information including position information of a landmark which can be recognized on a road in which the vehicle is estimated to travel by a camera, a landmark image for recognition, a recognition evaluation value that represents ease of the recognition successfully performed and so on, and selects a landmark to be a subject for recognition based on the recognition evaluation value included in the landmark information. The onboard control device further evaluates the recognition results of the landmark to be a subject for recognition, and transmits the recognition results to the server with the landmark image recognized by the camera. The server aggregates the recognition evaluation results of the landmark and the recognized images and reflects them in the recognition evaluation values for the landmark information and landmark images to be transmitted to the onboard control device.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: May 29, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yuki Horita, Taisetsu Tanimichi, Hiroshi Kuroda, Tomoichi Ebata
  • Patent number: 9934690
    Abstract: The present invention provides an object recognition apparatus which, in a vehicle that detects an object present behind (including obliquely behind) the vehicle using a radio wave radar, is able to precisely recognize the position of the object present behind (including obliquely behind) the vehicle during traveling on a curve and a lane change, and a vehicle travel controller using the same.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: April 3, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventor: Hiroshi Kuroda
  • Publication number: 20170330864
    Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.
    Type: Application
    Filed: July 31, 2017
    Publication date: November 16, 2017
    Inventors: Hiroshi KURODA, Hideo KOIKE
  • Patent number: 9754919
    Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: September 5, 2017
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroshi Kuroda, Hideo Koike
  • Publication number: 20170221188
    Abstract: The present invention addresses the problem of providing an imaging device that prevents mismatching in image matching for parallax calculation even if the sharpnesses of an end part and center part of a processing area differ. An imaging device 1 according to the present invention is provided with a means for equalizing the sharpnesses of the processing areas of a reference image and a comparison image.
    Type: Application
    Filed: August 17, 2015
    Publication date: August 3, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Toshiyuki AOKI, Takeshi SHIMA, Tatsuhiko MONJI, Hiroshi KURODA, Keiichi BETSUI, Seiji MURATA
  • Publication number: 20170053533
    Abstract: The present invention provides an object recognition apparatus which, in a vehicle that detects an object present behind (including obliquely behind) the vehicle using a radio wave radar, is able to precisely recognize the position of the object present behind (including obliquely behind) the vehicle during traveling on a curve and a lane change, and a vehicle travel controller using the same.
    Type: Application
    Filed: June 3, 2015
    Publication date: February 23, 2017
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventor: Hiroshi KURODA
  • Publication number: 20160305794
    Abstract: An onboard control device that is installed at a vehicle acquires land mark information including position information of a landmark which can be recognized on a road in which the vehicle is estimated to travel by a camera, a landmark image for recognition, a recognition evaluation value that represents ease of the recognition successfully performed and so on, and selects a landmark to be a subject for recognition based on the recognition evaluation value included in the landmark information. The onboard control device further evaluates the recognition results of the landmark to be a subject for recognition, and transmits the recognition results to the server with the landmark image recognized by the camera. The server aggregates the recognition evaluation results of the landmark and the recognized images and reflects them in the recognition evaluation values for the landmark information and landmark images to be transmitted to the onboard control device.
    Type: Application
    Filed: November 19, 2014
    Publication date: October 20, 2016
    Inventors: Yuki HORITA, Taisetsu TANIMICHI, Hiroshi KURODA, Tomoichi EBATA
  • Publication number: 20160123261
    Abstract: A vehicle control apparatus that makes it possible to attempt fuel consumption improvement and exhaust gas reduction effectively without causing a sense of incompatibility in the driver is provided. When traveling following the preceding vehicle, kinetic energy required for an own vehicle in future is predicted on the basis of kinetic energy of the own vehicle, a velocity of a preceding vehicle, and a distance between the own vehicle and the preceding vehicle. It is determined whether there is kinetic energy enough for the own vehicle to be able to follow the preceding vehicle with inertial traveling, on the basis of the predicted kinetic energy and current kinetic energy. When it is determined that the kinetic energy is sufficient and the driving and traveling state of the own vehicle satisfies other traveling idling reduction conditions, control of stopping the engine is exercised.
    Type: Application
    Filed: March 14, 2014
    Publication date: May 5, 2016
    Inventors: Takeo SHIBATA, Hiroshi KURODA
  • Publication number: 20140011453
    Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 9, 2014
    Inventors: Hiroshi Kuroda, Hideo Koike
  • Patent number: 8574963
    Abstract: Occurrence of a void is suppressed when mounting semiconductor chips over a wiring substrate via a paste-like adhesive material. A die bonding step is provided which mounts semiconductor chips over a chip-mounting region of the wiring substrate via the adhesive material. The wiring substrate includes a plurality of wirings (first wirings) and dummy wirings (second wirings) formed on an upper surface of a core layer. The chip-mounting region is provided over the first wirings and the second wirings. In addition, the die bonding step includes a step of applying the adhesive material over an adhesive material application region over the chip-mounting region. Each of the second wirings is extended along a direction in which the adhesive material spreads in the die bonding step.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: November 5, 2013
    Assignee: Renesas Electronics Corporation
    Inventor: Hiroshi Kuroda
  • Patent number: 8558393
    Abstract: Miniaturization and acceleration of the operating speed of a System In Package (SIP) type semiconductor device in which a memory chip and a microcomputer chip are mounted over a wiring board are promoted. When mounting a microcomputer chip and a memory chip over an upper surface of a wiring board, the memory chip is disposed such that second conductive pads of the wiring board arranged along a first chip side (a side along which data system electrode pads are arranged) of the memory chip are positioned, in the plan view, in a region between an extended line of a third chip side of the microcomputer chip and an extended line of a fourth chip side of the microcomputer chip. Thus, a length of a data system wiring for coupling a data system electrode pad of the microcomputer chip with the data system electrode pad of the memory chip is minimized.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: October 15, 2013
    Assignee: Renesas Electronics Corporation
    Inventor: Hiroshi Kuroda
  • Publication number: 20120273970
    Abstract: Miniaturization and acceleration of the operating speed of a System In Package (SIP) type semiconductor device in which a memory chip and a microcomputer chip are mounted over a wiring board are promoted. When mounting a microcomputer chip and a memory chip over an upper surface of a wiring board, the memory chip is disposed such that second conductive pads of the wiring board arranged along a first chip side (a side along which data system electrode pads are arranged) of the memory chip are positioned, in the plan view, in a region between an extended line of a third chip side of the microcomputer chip and an extended line of a fourth chip side of the microcomputer chip. Thus, a length of a data system wiring for coupling a data system electrode pad of the microcomputer chip with the data system electrode pad of the memory chip is minimized.
    Type: Application
    Filed: April 9, 2012
    Publication date: November 1, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: Hiroshi KURODA
  • Patent number: 8232914
    Abstract: A distance measuring apparatus comprising a transmission antenna to radiate a transmission radio wave; a reception antenna to receive a reflected signal from a target; an analog-to-digital converter to perform an analog-to-digital conversion for converting a reception signal; and a signal processing unit to process the converted signal and to detect the target, in which a transmission frequency of the transmission radio wave to be radiated is switched at a timing synchronized with a sampling frequency of the analog-to-digital conversion, the transmission frequency is switched in accordance with an arbitrary pattern within a frequency band, and the reception signal is rearranged in order on the basis of the arbitrary pattern at a time of the transmission to then be subject to a radar signal processing.
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: July 31, 2012
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Kuroda, Kazuo Matsuura
  • Patent number: 8138611
    Abstract: A first semiconductor chip and a second semiconductor chip which form a stack are mounted on a module substrate by deflecting a center position of the semiconductor chips from the module substrate. In the side where the distance from the edge of the deflected semiconductor chip to the edge of a module substrate is shorter, the electrode pad on the first semiconductor chip and the electrode pad on the second semiconductor chip are directly connected with a wire. In the side where the distance from the edge of the deflected semiconductor chip to the edge of a module substrate is longer, the electrode pad on the first semiconductor chip and the electrode pad on the second semiconductor chip are combined with the corresponding bonding lead on the module substrate with a wire.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: March 20, 2012
    Assignee: Renesas Electronics Corporation
    Inventors: Hiroshi Kuroda, Katsuhiko Hashizume
  • Publication number: 20120052628
    Abstract: Occurrence of a void is suppressed when mounting semiconductor chips over a wiring substrate via a paste-like adhesive material. A die bonding step is provided which mounts semiconductor chips over a chip-mounting region of the wiring substrate via the adhesive material. The wiring substrate includes a plurality of wirings (first wirings) and dummy wirings (second wirings) formed on an upper surface of a core layer. The chip-mounting region is provided over the first wirings and the second wirings. In addition, the die bonding step includes a step of applying the adhesive material over an adhesive material application region over the chip-mounting region. Each of the second wirings is extended along a direction in which the adhesive material spreads in the die bonding step.
    Type: Application
    Filed: August 2, 2011
    Publication date: March 1, 2012
    Applicant: RENESAS ELECTRONICS CORPORATION
    Inventor: Hiroshi KURODA