Abstract: The present invention is an antenna provided with: a plurality of radiating parts formed on a base plate; a waveguide tube inside of which radio waves emitted from the radiating parts propagate; a lens having a plurality of curved surfaces having a substantially hyperbolic shape and disposed in an opening of the waveguide tube; and a protruding part formed in a tapered shape between the plurality of radiating parts. The tip of the protruding part is formed at a position lower than an opening surface.

Abstract: The present invention addresses the problem of providing an imaging device that prevents mismatching in image matching for parallax calculation even if the sharpnesses of an end part and center part of a processing area differ. An imaging device 1 according to the present invention is provided with a means for equalizing the sharpnesses of the processing areas of a reference image and a comparison image.

Abstract: A sensor has an antenna. The antenna includes a radiation source and a wave guide. The radiation source is formed on a substrate. The wave guide internally propagates electromagnetic waves radiated from the radiation source and radiates the electromagnetic waves as a beam. The wave guide has a radiation-side opening in which a first direction and a second direction are orthogonal to each other, and the second direction is longer than the first direction. In a cross-sectional shape of the beam, perpendicular to a radiation direction of the beam radiated from the wave guide, a first direction and a second direction are orthogonal to each other, and the second direction is narrower than the first direction.

Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.

Abstract: An onboard control device that is installed at a vehicle acquires land mark information including position information of a landmark which can be recognized on a road in which the vehicle is estimated to travel by a camera, a landmark image for recognition, a recognition evaluation value that represents ease of the recognition successfully performed and so on, and selects a landmark to be a subject for recognition based on the recognition evaluation value included in the landmark information. The onboard control device further evaluates the recognition results of the landmark to be a subject for recognition, and transmits the recognition results to the server with the landmark image recognized by the camera. The server aggregates the recognition evaluation results of the landmark and the recognized images and reflects them in the recognition evaluation values for the landmark information and landmark images to be transmitted to the onboard control device.

Abstract: The present invention provides an object recognition apparatus which, in a vehicle that detects an object present behind (including obliquely behind) the vehicle using a radio wave radar, is able to precisely recognize the position of the object present behind (including obliquely behind) the vehicle during traveling on a curve and a lane change, and a vehicle travel controller using the same.

Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.

Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.

Abstract: The present invention addresses the problem of providing an imaging device that prevents mismatching in image matching for parallax calculation even if the sharpnesses of an end part and center part of a processing area differ. An imaging device 1 according to the present invention is provided with a means for equalizing the sharpnesses of the processing areas of a reference image and a comparison image.

Abstract: The present invention provides an object recognition apparatus which, in a vehicle that detects an object present behind (including obliquely behind) the vehicle using a radio wave radar, is able to precisely recognize the position of the object present behind (including obliquely behind) the vehicle during traveling on a curve and a lane change, and a vehicle travel controller using the same.

Abstract: An onboard control device that is installed at a vehicle acquires land mark information including position information of a landmark which can be recognized on a road in which the vehicle is estimated to travel by a camera, a landmark image for recognition, a recognition evaluation value that represents ease of the recognition successfully performed and so on, and selects a landmark to be a subject for recognition based on the recognition evaluation value included in the landmark information. The onboard control device further evaluates the recognition results of the landmark to be a subject for recognition, and transmits the recognition results to the server with the landmark image recognized by the camera. The server aggregates the recognition evaluation results of the landmark and the recognized images and reflects them in the recognition evaluation values for the landmark information and landmark images to be transmitted to the onboard control device.

Abstract: A vehicle control apparatus that makes it possible to attempt fuel consumption improvement and exhaust gas reduction effectively without causing a sense of incompatibility in the driver is provided. When traveling following the preceding vehicle, kinetic energy required for an own vehicle in future is predicted on the basis of kinetic energy of the own vehicle, a velocity of a preceding vehicle, and a distance between the own vehicle and the preceding vehicle. It is determined whether there is kinetic energy enough for the own vehicle to be able to follow the preceding vehicle with inertial traveling, on the basis of the predicted kinetic energy and current kinetic energy. When it is determined that the kinetic energy is sufficient and the driving and traveling state of the own vehicle satisfies other traveling idling reduction conditions, control of stopping the engine is exercised.

Abstract: Disclosed is a semiconductor device that is capable of handling multiple different high-frequency contactless communication modes and that is formed by a multi-chip structure. A first semiconductor chip, which performs interface control of high-frequency contactless communication and data processing of communications data, is mounted on a wiring board; and a second semiconductor chip, which performs another data processing of the communication data, is mounted on the first semiconductor chip. In this case, transmission pads in the first semiconductor chip are arranged at positions farther from a periphery of the chip than those of receiving pads, and the second semiconductor chip is mounted by being biased on the first semiconductor chip so as to keep away the transmission pads.

Abstract: Occurrence of a void is suppressed when mounting semiconductor chips over a wiring substrate via a paste-like adhesive material. A die bonding step is provided which mounts semiconductor chips over a chip-mounting region of the wiring substrate via the adhesive material. The wiring substrate includes a plurality of wirings (first wirings) and dummy wirings (second wirings) formed on an upper surface of a core layer. The chip-mounting region is provided over the first wirings and the second wirings. In addition, the die bonding step includes a step of applying the adhesive material over an adhesive material application region over the chip-mounting region. Each of the second wirings is extended along a direction in which the adhesive material spreads in the die bonding step.

Abstract: Miniaturization and acceleration of the operating speed of a System In Package (SIP) type semiconductor device in which a memory chip and a microcomputer chip are mounted over a wiring board are promoted. When mounting a microcomputer chip and a memory chip over an upper surface of a wiring board, the memory chip is disposed such that second conductive pads of the wiring board arranged along a first chip side (a side along which data system electrode pads are arranged) of the memory chip are positioned, in the plan view, in a region between an extended line of a third chip side of the microcomputer chip and an extended line of a fourth chip side of the microcomputer chip. Thus, a length of a data system wiring for coupling a data system electrode pad of the microcomputer chip with the data system electrode pad of the memory chip is minimized.

Abstract: Miniaturization and acceleration of the operating speed of a System In Package (SIP) type semiconductor device in which a memory chip and a microcomputer chip are mounted over a wiring board are promoted. When mounting a microcomputer chip and a memory chip over an upper surface of a wiring board, the memory chip is disposed such that second conductive pads of the wiring board arranged along a first chip side (a side along which data system electrode pads are arranged) of the memory chip are positioned, in the plan view, in a region between an extended line of a third chip side of the microcomputer chip and an extended line of a fourth chip side of the microcomputer chip. Thus, a length of a data system wiring for coupling a data system electrode pad of the microcomputer chip with the data system electrode pad of the memory chip is minimized.

Abstract: A distance measuring apparatus comprising a transmission antenna to radiate a transmission radio wave; a reception antenna to receive a reflected signal from a target; an analog-to-digital converter to perform an analog-to-digital conversion for converting a reception signal; and a signal processing unit to process the converted signal and to detect the target, in which a transmission frequency of the transmission radio wave to be radiated is switched at a timing synchronized with a sampling frequency of the analog-to-digital conversion, the transmission frequency is switched in accordance with an arbitrary pattern within a frequency band, and the reception signal is rearranged in order on the basis of the arbitrary pattern at a time of the transmission to then be subject to a radar signal processing.

Abstract: A first semiconductor chip and a second semiconductor chip which form a stack are mounted on a module substrate by deflecting a center position of the semiconductor chips from the module substrate. In the side where the distance from the edge of the deflected semiconductor chip to the edge of a module substrate is shorter, the electrode pad on the first semiconductor chip and the electrode pad on the second semiconductor chip are directly connected with a wire. In the side where the distance from the edge of the deflected semiconductor chip to the edge of a module substrate is longer, the electrode pad on the first semiconductor chip and the electrode pad on the second semiconductor chip are combined with the corresponding bonding lead on the module substrate with a wire.

Abstract: Occurrence of a void is suppressed when mounting semiconductor chips over a wiring substrate via a paste-like adhesive material. A die bonding step is provided which mounts semiconductor chips over a chip-mounting region of the wiring substrate via the adhesive material. The wiring substrate includes a plurality of wirings (first wirings) and dummy wirings (second wirings) formed on an upper surface of a core layer. The chip-mounting region is provided over the first wirings and the second wirings. In addition, the die bonding step includes a step of applying the adhesive material over an adhesive material application region over the chip-mounting region. Each of the second wirings is extended along a direction in which the adhesive material spreads in the die bonding step.

Abstract: A scanning probe microscope, capable of performing shape measurement not affected by electrostatic charge distribution of a sample, which: monitors an electrostatic charge state by detecting a change in a flexure or vibrating state of a cantilever due to electrostatic charges in synchronization with scanning during measurement with relative scanning between the probe and the sample, and makes potential adjustment so as to cancel an influence of electrostatic charge distribution, thus preventing damage of the probe or the sample due to discharge and achieving reduction in measurement errors due to electrostatic charge distribution.