Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.

Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.

Abstract: The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance.

Abstract: A positive-type photosensitive resin composition includes (A) a phenol resin modified by a compound having an unsaturated hydrocarbon group having 4 to 100 carbon atoms; (B) a compound that produces an acid by light; (C) a thermal crosslinking agent; and (D) a solvent. The positive-type photosensitive resin composition according to the present invention can be developed by an alkaline aqueous solution, and an effect thereof is that a resist pattern having sufficiently high sensitivity and resolution, excellent adhesion, and good thermal shock resistance can be formed.

Abstract: A positive tone photosensitive composition comprising: (A) an alkali-soluble resin having a phenolic hydroxyl group; (B) a phenol resin modified by a compound having an unsaturated hydrocarbon group containing 4 to 100 carbon atoms; (C) a compound that generates an acid by the action of light; (D) a thermal cross-linker that crosslinks the ingredient (A) and the ingredient (B) by heating; and (E) a solvent.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.

Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10?8 A/cm2.

Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

Abstract: A photolytic device for breaking down organic chlorine compounds, such as trichloroethylene and tetrachloroethylene, in a fluid includes a first reaction chamber, a second reaction chamber, and an acid component absorption column. The first reaction chamber and the second reaction chamber are connected in series, and the second reaction chamber and the acid component absorption column are connected in series. The first reaction chamber is a perfect mixing type chamber, and the second reaction chamber is an imperfect mixing type chamber. The first reaction chamber and the second reaction chamber each have an ultraviolet light source capable of emitting light of wavelength 300 nm or less.