Patents by Inventor Hiroshi Murai

Hiroshi Murai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6492593
    Abstract: A gold wire, for semiconductor element connection, having 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, and 1-100 ppm by weight of Y. The gold wire further preferably has 1-100 ppm by weight of at least one of Eu, La, Ce and Lu, as well as 1-100 ppm by weight of at least one of Mg and Ti. The total amount of the added elements being no greater than 200 ppm by weight. The balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire.
    Type: Grant
    Filed: May 31, 2001
    Date of Patent: December 10, 2002
    Assignee: Tanaka Denshi Kogyo K.K.
    Inventors: Hiroshi Murai, Shuichi Mitoma, Takeshi Tokuyama, Mitutomo Motomura
  • Publication number: 20020007957
    Abstract: A gold wire, for semiconductor element connection, consisting of 5-100 ppm by weight of Ca, 5-100 ppm by weight of Gd, 1-100 ppm by weight of Y and preferably 1-100 ppm by weight of at least one from among rare earth elements other than Y, as well as 1-100 ppm by weight of at least one from among Mg, Ti and Pb, the total amount of these elements being no greater than 200 ppm by weight, the balance being gold and unavoidable impurities. A semiconductor element connection method by ball bonding or bump connection using the gold wire.
    Type: Application
    Filed: May 31, 2001
    Publication date: January 24, 2002
    Inventors: Hiroshi Murai, Shuichi Mitoma, Takeshi Tokuyama, Mitutomo Motomura
  • Patent number: 5568642
    Abstract: A new and useful computer system facilitates simplification of computer programs establishing a dedicated computer system adapted to a specific task, and makes it easy to program and to modify already established programs. The simple and easy method for establishing an application adapted dedicated computer system, operable on a plurality of data items for performing a plurality of functional processes for the data items, comprises the steps of establishing a plurality of program segments, each of to is exclusively assigned for one of the data items and has process content exclusively corresponding to one of the functional processes, and establishing a governing program for establishing systematic interrelationships between the program segments for performing a sequence of processes adapted to the dedicated application.
    Type: Grant
    Filed: February 28, 1996
    Date of Patent: October 22, 1996
    Assignee: Institute of Software Scientifical Constructions
    Inventors: Fumio Negoro, Tetsuri Murata, Kozo Sawamura, Junichi Yuki, Hiroshi Murai, Masayasu Onuki, Norihito Ito, Wieguo Jiang, Masako Yonemura
  • Patent number: 4234876
    Abstract: The sensor disclosed attaches to the neck of a hunting dog for determining its physical behavior thereof. It includes a sensor proper having a movable ball confined in a closed space. A voltage producing device at least partly defines the walls of the closed space. A gate circuit is electrically connected with the voltage producing device. Further, a discriminating signal generator is electrically connected with the voltage producing device so the dog's master can determine the dog's behavior.
    Type: Grant
    Filed: May 20, 1977
    Date of Patent: November 18, 1980
    Assignees: Riken-Denshi Kogyo Kabushiki Kaisha, Morimura Shoji Kabushiki Kaisha
    Inventor: Hiroshi Murai
  • Patent number: 3931434
    Abstract: A method of manufacturing dehydrated fruit used as an additive to powdered instant food which comprises covering preliminarily dried fruit with granulated sugar, flattening the fruit under pressure and dehydrating it until the dissolved sugar again solidifies.
    Type: Grant
    Filed: January 7, 1974
    Date of Patent: January 6, 1976
    Assignee: Nagatanien Honpo Co., Ltd.
    Inventor: Hiroshi Murai