Patents by Inventor Hiroshi Murase
Hiroshi Murase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7546672Abstract: It is an object of the invention to provide a technique for easily installing many turns of a coil winding on a stator. Representative method for manufacturing a motor includes preparing the coil wound into a ring-like form and tied, preparing the split core such that the spacing between the pair pole pieces in the circumferential direction of the split core corresponds to the inner dimension of the coil in the circumferential direction of the split core, inserting the tied coil into the two coil receiving parts through the openings and then, deforming the split core such that the spacing between the pair pole pieces is increased to be longer than the inner dimension of the coil.Type: GrantFiled: April 9, 2007Date of Patent: June 16, 2009Assignee: Makita CorporationInventor: Hiroshi Murase
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Patent number: 7490107Abstract: It enables easy and quick searching and delivery of information desired by a user based upon a portion of time-series data which consists of clip information from music, a movie, a commercial message, or the like. The user accesses an information search server from a user terminal which is connected to a network, and, using this portion of time-series data as a search key, performs searches upon said server for information related to the time-series data. The information search server returns the name of the tune, the title of the movie, the name of goods advertised in the commercial message or the like to the user terminal via said network as search results, and the search provider levies a price for said search from the user.Type: GrantFiled: May 18, 2001Date of Patent: February 10, 2009Assignee: Nippon Telegraph & Telephone CorporationInventors: Kunio Kashino, Takayuki Kurozumi, Hiroshi Murase
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Patent number: 7462921Abstract: A vanadium oxide film is formed on an interlayer insulating layer, and a silicon oxide film and a silicon nitride film are formed on the vanadium oxide film in this order. With a resist pattern used as a mask, the silicon nitride film is patterned. Then, the resist pattern is removed using a stripping solution or oxygen plasma ashing. Next, with the patterned silicon nitride film used as a mask, the silicon oxide film and the vanadium oxide film are etched to form a resistor film of vanadium oxide.Type: GrantFiled: March 23, 2005Date of Patent: December 9, 2008Assignees: NEC Corporation, NEC Electronics CorporationInventors: Naoyoshi Kawahara, Hiroshi Murase, Hiroaki Ohkubo, Yasutaka Nakashiba, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Patent number: 7391092Abstract: In a semiconductor integrated circuit device, a sheet-like temperature monitor member of vanadium oxide is provided, whose one end is connected to one via while the other end is connected to another via. A sheet-like thermal conducting layer of aluminum is provided below the temperature monitor member. A region equal to or greater than a half of the entire temperature monitor member overlies the thermal conducting layer in a plan view.Type: GrantFiled: March 24, 2005Date of Patent: June 24, 2008Assignees: NEC Electronics Corporation, NEC CorporationInventors: Hiroaki Ohkubo, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20070271767Abstract: It is an object of the invention to provide a technique for easily installing many turns of a coil winding on a stator. Representative method for manufacturing a motor includes preparing the coil wound into a ring-like form and tied, preparing the split core such that the spacing between the pair pole pieces in the circumferential direction of the split core corresponds to the inner dimension of the coil in the circumferential direction of the split core, inserting the tied coil into the two coil receiving parts through the openings and then, deforming the split core such that the spacing between the pair pole pieces is increased to be longer than the inner dimension of the coil.Type: ApplicationFiled: April 9, 2007Publication date: November 29, 2007Applicant: MAKITA CORPORATIONInventor: Hiroshi Murase
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Patent number: 7239002Abstract: In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An insulating layer is provided in such a way as to cover the multi-layer wiring layer and the pads, second vias are so formed as to reach the pads. Vanadium oxide is buried in the second vias by reactive sputtering, and a temperature monitor part of vanadium oxide is provided in such a way as to connect the second vias each other. Accordingly, the temperature monitor part is connected between the two wires.Type: GrantFiled: January 21, 2005Date of Patent: July 3, 2007Assignees: NEC Electronics Corporation, NEC CorporationInventors: Hiroaki Ohkubo, Kuniko Kikuta, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20070008182Abstract: An image processing device for a vehicle includes a radar for transmitting a radio wave outside of the vehicle and detecting an object in a first area outside of the vehicle by using a reflected wave of the transmitted radio wave; a camera for acquiring an image in a second area including the first area; and an image processing unit for processing the acquired image to detect, in the acquired image, the object detected by the radar. Visibility outside of the vehicle is detected based on result of detection of the radar and result of detection of the camera.Type: ApplicationFiled: June 7, 2006Publication date: January 11, 2007Applicant: DENSO CorporationInventors: Takayuki Miyahara, Hiroaki Kumon, Hiroshi Murase
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Patent number: 7054388Abstract: Signal detection having superior resistance with respect to feature distortions is realized. Reference and input feature time-series signals, each consisting of feature vectors, are respectively obtained from reference and input time-series signals. The reference and input feature time-series signals are respectively converted into reference and input coded time-series signals, each consisting of codes indicating classifications. A distortion is added to at least one signal of the reference and input time-series signals, the reference and input feature time-series signals, and the reference and input coded time-series signals. The degree of similarity between the reference time-series signal and a collation portion determined in the input coded time-series signal is calculated based on their histograms.Type: GrantFiled: April 25, 2001Date of Patent: May 30, 2006Assignee: Nippon Telegraph and Telephone CorporationInventors: Takayuki Kurozumi, Kunio Kashino, Hiroshi Murase
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Patent number: 7053326Abstract: In an integrated type gas-insulated switching apparatus, a plurality of switching devices are provided. Each of switching devices includes a contact and an insulated container in which the contact is contained. The contact comprises electrodes adapted to be contacted with each other and separated therefrom. The insulated container is filled with an insulating gas. A conductive container is provided, to which the plurality of switching devices are connected, respectively. An insulated structure supports the conductive container.Type: GrantFiled: March 12, 2004Date of Patent: May 30, 2006Assignee: Kabushiki Kaisha ToshibaInventors: Sachio Muraki, Hiroshi Murase, Reiji Ohara, Akio Kobayashi, Hirokazu Takagi
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Patent number: 6966934Abstract: A gas reclaiming equipment capable of separating SF6 gas from a mixed gas efficiently and shortening reclaiming work under reduced pressure. A gas separation equipment is provided between a gas insulated equipment and a gas liquefaction system. The gas separation equipment separates nitrogen gas from the mixed gas, and concentrates SF6 gas. Only SF6 gas is sent into the gas liquefaction system. The gas separation equipment uses pressure swing adsorption using an adsorbent with selective adsorption. Moreover, a buffer tank for storing mixed gas is provided between the gas separation equipment and the gas insulated equipment. The buffer tank and the gas liquefaction system are connected by a reflux-line. The reflux-line refluxes the gas in a gas phase in the gas liquefaction system to the buffer tank. Furthermore, the gas separation equipment is connected to a storage tank. The storage tank accumulates the nitrogen gas separated with the gas separation equipment.Type: GrantFiled: September 29, 2000Date of Patent: November 22, 2005Assignee: Kabushiki Kaisha ToshibaInventors: Toshikazu Sato, Toshiaki Inohara, Hiroshi Murase, Hiromi Naotsuka, Takahiro Imai
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Publication number: 20050221573Abstract: A vanadium oxide film is formed on an interlayer insulating layer, and a silicon oxide film and a silicon nitride film are formed on the vanadium oxide film in this order. With a resist pattern used as a mask, the silicon nitride film is patterned. Then, the resist pattern is removed using a stripping solution or oxygen plasma ashing. Next, with the patterned silicon nitride film used as a mask, the silicon oxide film and the vanadium oxide film are etched to form a resistor film of vanadium oxide.Type: ApplicationFiled: March 23, 2005Publication date: October 6, 2005Applicants: NEC Electronics Corporation, NEC CorporationInventors: Naoyoshi Kawahara, Hiroshi Murase, Hiroaki Ohkubo, Yasutaka Nakashiba, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20050218471Abstract: In a semiconductor integrated circuit device, a sheet-like temperature monitor member of vanadium oxide is provided, whose one end is connected to one via while the other end is connected to another via. A sheet-like thermal conducting layer of aluminum is provided below the temperature monitor member. A region equal to or greater than a half of the entire temperature monitor member overlies the thermal conducting layer in a plan view.Type: ApplicationFiled: March 24, 2005Publication date: October 6, 2005Applicants: NEC Electronics Corporation, NEC CorporationInventors: Hiroaki Ohkubo, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20050218470Abstract: In a semiconductor integrated circuit device, a logic circuit section is provided at the top surface of a P-type silicon substrate and a multi-level wiring layer. The device is further provided with a temperature sensor section in which a first temperature monitor member of vanadium oxide is provided above the multi-level wiring layer. A second temperature monitor member of Ti is provided at a lowermost layer of the multi-level wiring layer. The first and second temperature monitor members are connected in series between a ground potential wire and a power-source potential wire, with an output terminal connected to the node of both members. The temperature coefficient of the electric resistivity of the first temperature monitor member is negative, while that of the second temperature monitor member is positive.Type: ApplicationFiled: March 24, 2005Publication date: October 6, 2005Applicants: NEC Electronics Corporation, NEC CorporationInventors: Hiroaki Ohkubo, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20050173775Abstract: In a temperature sensor section of a semiconductor integrated circuit device, wires of the topmost wiring layer of a multi-layer wiring structure are formed. A sheet-like temperature monitor element of vanadium oxide is provided between two of the wires in such a way as to cover the two wires. Accordingly, the temperature monitor element is connected between the two wires of an underlying wiring layer of the multi-layer wiring structure through two vias and the two wires of the topmost wiring layer.Type: ApplicationFiled: February 8, 2005Publication date: August 11, 2005Applicants: NEC Electronics Corporation, NEC CorporationInventors: Naoyoshi Kawahara, Hiroshi Murase, Hiroaki Ohkubo, Kuniko Kikuta, Yasutaka Nakashiba, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20050161822Abstract: In a temperature sensor section of a semiconductor integrated circuit device, first vias of tungsten are formed at the topmost layer of a multi-layer wiring layer and pads of titanium are provided on regions of the multi-layer wiring layer which covers the vias. An insulating layer is provided in such a way as to cover the multi-layer wiring layer and the pads, second vias are so formed as to reach the pads. Vanadium oxide is buried in the second vias by reactive sputtering, and a temperature monitor part of vanadium oxide is provided in such a way as to connect the second vias each other. Accordingly, the temperature monitor part is connected between the two wires.Type: ApplicationFiled: January 21, 2005Publication date: July 28, 2005Applicants: NEC Electronics Corporation, NEC CorporationInventors: Hiroaki Ohkubo, Kuniko Kikuta, Yasutaka Nakashiba, Naoyoshi Kawahara, Hiroshi Murase, Naoki Oda, Tokuhito Sasaki, Nobukazu Ito
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Publication number: 20050084238Abstract: The object of the present invention is to provide a high-speed signal search method, device, and a recording medium for the same that can obtain detection results equivalent to precisely moving a window over the entire region of the input signal even when there is not precise movement of a window over the entire signal.Type: ApplicationFiled: October 22, 2004Publication date: April 21, 2005Inventors: Kunio Kashino, Hiroshi Murase, Gavin Smith
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Publication number: 20050053355Abstract: The object of the present invention is to provide a high-speed signal search method, device, and a recording medium for the same that can obtain detection results equivalent to precisely moving a window over the entire region of the input signal even when there is not precise movement of a window over the entire signal.Type: ApplicationFiled: October 22, 2004Publication date: March 10, 2005Inventors: Kunio Kashino, Hiroshi Murase, Gavin Smith
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Patent number: 6826350Abstract: The object of the present invention is to provide a high-speed signal search method, device, and a recording medium for the same that can obtain detection results equivalent to precisely moving a window over the entire region of the input signal even when there is not precise movement of a window over the entire signal.Type: GrantFiled: May 4, 1999Date of Patent: November 30, 2004Assignee: Nippon Telegraph and Telephone CorporationInventors: Kunio Kashino, Hiroshi Murase, Gavin Smith
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Publication number: 20040169015Abstract: In an integrated type gas-insulated switching apparatus, a plurality of switching devices are provided. Each of switching devices includes a contact and an insulated container in which the contact is contained. The contact comprises electrodes adapted to be contacted with each other and separated therefrom. The insulated container is filled with an insulating gas. A conductive container is provided, to which the plurality of switching devices are connected, respectively. An insulated structure supports the conductive container.Type: ApplicationFiled: March 12, 2004Publication date: September 2, 2004Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Sachio Muraki, Hiroshi Murase, Reiji Ohara, Akio Kobayashi, Hirokazu Takagi
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Publication number: 20040167785Abstract: There are included: an initial sub-signal creation section which creates, from an original signal, sub-signals of shorter length than the original signal; a created sub-signal selection section which, for the sub-signals produced by the initial sub-signal creation section, prunes the created sub-signal candidates to those for which the amount of data is less than for the original signal; a sub-signal re-creation section which determines a created sub-signal which is actually to be used, using the created sub-signal candidates produced by the created sub-signal selection section; a compression mapping determination section which determines, from the sub-signals produced by the sub-signal re-creation section, a mapping for calculation of a compressed signal; and a signal compression section which calculates a compressed signal corresponding to the sub-signals obtained by the sub-signal re-creation section, based upon the mapping obtained by the compression mapping determination section.Type: ApplicationFiled: December 3, 2003Publication date: August 26, 2004Inventors: Akisato Kimura, Kunio Kashino, Takayuki Kurozumi, Hiroshi Murase