Abstract: Provided is a display module capable of reducing connection resistance between a mounting board and a display. A display module includes a mounting board provided with a bump, and a display mounted on the mounting board and provided with a connection terminal bonded to the bump by solid-phase diffusion bonding.

Abstract: A power converter includes first and second components on which male and female fitting members of each of a plurality of pairs of fitting members are arranged, with a pair of first alignment keys formed in the first and second components as reference positions. The first and second components are coupled to each other by the female fitting member clamping an insertion portion of the male fitting member inserted between first and second clamping portions of the female fitting member arranged so as to face each other in a state where the pair of first alignment keys are positionally aligned. The first and second clamping portions are each bent so as to form one of protrusions toward one of surfaces thereof facing each other. A gap is formed in a distal end portion of each of the first and second clamping portions.

Abstract: An object of the present invention is to provide: an optical element in which incident light can be transmitted or reflected at an angle in the predetermined direction and the wavelength dependence of the amount of transmitted light or reflected light is small; and an optical element including the optical element. The optical element according to the present invention comprises: an optically-anisotropic layer that is formed using a composition including a liquid crystal compound and an infrared absorbing colorant, in which the optically-anisotropic layer has a liquid crystal alignment pattern in which a direction of an optical axis derived from the liquid crystal compound changes while continuously rotating in at least one in-plane direction, and an absorption of the infrared absorbing colorant in a wavelength range of 700 to 2000 nm in a minor axis direction is higher than an absorption of the infrared absorbing colorant in a wavelength range of 700 to 2000 nm in a major axis direction.

Abstract: An electric power converter includes a first board, a second board, and a first board-to-board connector that electrically and mechanically connects the first board and the second board. The first board-to-board connector includes a male fitting member and a female fitting member. Each of a first clamp portion and a second clamp portion of the female fitting member includes a first contact forming portion and a second contact forming portion that are curved in a protruding shape, and a first spring portion and a second spring portion that are connected to the first contact forming portion and the second contact portion, respectively, and that are curved in corrugated shapes. An insert clamped between the first contact forming portion and the second contact forming portion forms an electrical contact, and the first spring portion and the second spring portion are independently deformable.

Abstract: A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

Abstract: A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.

Abstract: A radio frequency module includes a mounting substrate including a first main surface and a second main surface opposite to the first main surface. A first electronic component is disposed on the first main surface of the mounting substrate. A second electronic component is disposed on the second main surface of the mounting substrate. A plurality of connection terminals are disposed on the second main surface of the mounting substrate. A wiring layer faces the second main surface of the mounting substrate. The wiring layer includes a plurality of external connection electrodes, each connected to at least one of the second electronic component and the plurality of connection terminals. At least one of the plurality of external connection electrodes overlaps the second electronic component when viewed in plan in a thickness direction of the substrate.

Abstract: An integrated circuit (IC) includes a first switch, a second switch, and an amplifier electrically connected between the first switch and the second switch. An RF signal path passes through first switch, the amplifier, and the second switch in this order. The IC includes an input terminal and an output terminal that are to be connected to each other between the first switch and the amplifier or between the amplifier and the second switch outside of the IC with a component connected therebetween. In a top view of the IC, a first region of the first switch, a second region of the amplifier, and a third region of the second switch are disposed on a straight line such that a virtual straight line connects any point of the first region, any point of the second region, and any point of the second region in this order.

Abstract: An integrated circuit (IC) includes a first switch, a second switch, an amplifier electrically connected between the first switch and the second switch, and a base. The first switch, the second switch, and the amplifier are provided on the base. In a top view of the base, the amplifier is disposed between the first switch and the second switch.

Abstract: A semiconductor IC includes a first radio-frequency element (e.g., an inductor in a low-noise amplifier), a second radio-frequency element (e.g., an inductor in a low-noise amplifier), a first via conductor (e.g., a via conductor that is placed between the first radio-frequency element and the second radio-frequency element and that is connected to a ground potential.

Abstract: Provided is a display device capable of suppressing deterioration in reliability. A display device includes: a plurality of light-emitting elements; a contact portion provided around a region in which the plurality of light-emitting elements are formed; an insulating layer having a step on the contact portion; and a protective layer covering the light-emitting elements, the contact portion, and the insulating layer. The light-emitting element includes: a first electrode; a second electrode having a peripheral portion connected to the contact portion; and a light-emitting layer provided between the first electrode and the second electrode. The step rises in a direction from an inner side of the display device toward an outer circumference side, and A peripheral edge of the second electrode is provided closer to the region than the step.

Abstract: A multilayer circuit board includes a resin body, signal wires, ground conductors, and a via conductor. The resin body includes resin layers made from thermoplastic resin. The signal wires and the ground conductors are each on or inside the resin body. The via conductor connects corresponding ones of the signal wires to each other or corresponding ones of the ground conductors to each other. The ground conductors include a counter ground conductor on or inside the resin body, facing a signal wire in a stacking direction in which the resin layers are stacked, and overlapping the signal wire in plan view in the stacking direction. The counter ground conductor is made of a graphite sheet including main surfaces and end surfaces covered with a conductor layer. The graphite sheet extends over rigid and flexible portions in plan view in the stacking direction.

Abstract: A multilayer circuit board includes a board body including insulator layers stacked upon each other, a first land pattern at the board body to mount a passive component, a second land pattern at the board body to mount an active component, and a heat-dissipation layer between the insulator layers and extending along main surfaces of the insulator layers. The heat-dissipation layer includes a hole extending therethrough in a stacking direction of the insulator layers. In a plan view from the stacking direction, an outer edge of the hole of the heat-dissipation layer is on an outer side of the first land pattern, or overlaps the first land pattern.

Abstract: A radio frequency module includes: a module substrate including a first principal surface and a second principal surface opposite to each other; a plurality of external-connection terminals (e.g., a plurality of post electrodes) disposed on the second principal surface; a semiconductor component disposed on the second principal surface and including a first low-noise amplifier and/or a second low-noise amplifier; and a metal member set at a ground potential and covering at least part of a surface of the semiconductor component, the surface being opposite to a surface that faces the module substrate.

Abstract: A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin disposed to cover the first surface and the first component; a shield film covering at least a side surface of the first sealing resin; a first ground terminal mounted on the first surface; and a protruding portion formed to extend laterally at any position of the first ground terminal in a direction perpendicular to the first surface. The protruding portion is electrically connected to a portion of the shield film that covers the side surface of the first sealing resin.

Abstract: A radio-frequency module includes a mounting board, a first electronic component, and a second electronic component. The second electronic component is lower in height than the first electronic component. The mounting board includes dielectric layers, conductive layers, and via-conductors. In the mounting board, the dielectric layers and the conductive layers are stacked in the thickness direction of the mounting board. The mounting board has a first region and a second region. The first region overlaps the first electronic component and extends from a first major surface to a second major surface. The second region overlaps the second electronic component and extends from the first major surface to the second major surface. In the mounting board, the conductive layers in the first region are fewer than the conductive layers in the second region. In the mounting board, the first region is thinner than the second region.

Abstract: An object of the present invention is to provide a radio communication apparatus, a wireless LAN router, an unauthorized access prevention method, and a radio communication system that have security for protection against unauthorized access. A radio communication apparatus (1) according to the present invention includes: first radio communication means (10) for functioning as an access point for radio communication; second radio communication means (20) for functioning as an access point for radio communication; and storage means (21) for storing dummy information. The first radio communication means (10) has a security level higher than that of the second radio communication means (20), and the second radio communication means (20) is capable of transmitting the dummy information stored in the storage means (21).

Abstract: A module includes a substrate including a first surface, at least one first component mounted on the first surface, a shield member mounted on the first surface to cover the first component, and a first sealing resin arranged at least between the shield member and the first surface. The shield member includes a top surface portion in a form of a plate and a plurality of leg portions that extend from the top surface portion toward the first surface.

Abstract: A radio frequency circuit includes a substrate, a first terminal disposed on a first principal surface of the substrate, a second terminal disposed on the first principal surface, a first-surface mounted component disposed on the first principal surface or inside the substrate, and a second-surface mounted component disposed on a second principal surface of the substrate which is opposite the first principal surface. A radio-frequency signal, which is input to the first terminal, is transmitted, for output from the second terminal, so as to make at least one round trip between the first principal surface and the second-surface mounted component, which is disposed on the second principal surface, through wiring lines disposed in the substrate.

Abstract: A radio frequency module includes: a module substrate that includes a principal surface on which external-connection terminals are disposed; a power amplifier that is disposed on the principal surface of the module substrate and amplifies a radio frequency transmission signal; and a heat dissipator that dissipates heat of the power amplifier. The heat dissipator includes: a heat dissipation plate that covers a surface of the power amplifier which is opposite to a surface that faces the module substrate; and at least a first leg that extends from the heat dissipation portion toward the principal surface of the module substrate.