Patents by Inventor Hiroshi Nishikawa

Hiroshi Nishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160042999
    Abstract: A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes separating each of the semiconductor devices or semiconductor integrated circuits. Each of the separated semiconductor devices or semiconductor integrated circuits is non-rectangular shaped, and the step of separating each of the semiconductor devices or semiconductor integrated circuits is performed by dry etching.
    Type: Application
    Filed: October 23, 2015
    Publication date: February 11, 2016
    Inventors: Masahiro Yamada, Kenya Iwasaki, Hiroshi Nishikawa
  • Patent number: 9246012
    Abstract: A display unit includes: an oxide semiconductor layer configured to form a channel; a first layer having electrical insulation or electrical conductivity; and a second layer including a hydrogen absorbent and disposed between the oxide semiconductor layer and the first layer.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: January 26, 2016
    Assignee: JOLED INC.
    Inventors: Shigehiro Yamakita, Eri Matsuo, Hiroshi Nishikawa, Kimihiro Shinya, Tomoatsu Kinoshita, Masanori Nishiyama, Kenichi Izumi
  • Patent number: 9235187
    Abstract: A removal device includes a scraping member extending in a crossing direction that crosses a movement direction in which a cleaning object moves, the scraping member scraping waste off a surface of the cleaning object at a contact portion of the scraping member that is in contact with the surface; and a pair of sealing members disposed on both outer sides of the scraping member in the crossing direction and sealing the both outer sides by contacting the surface. Each of the sealing members includes a protruding portion that protrudes beyond the contact portion upstream in the movement direction of the cleaning object. The protruding portion has a slit that extends diagonally from an edge of the protruding portion outward in the crossing direction and upstream in the movement direction, the edge facing inward in the crossing direction.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: January 12, 2016
    Assignee: FUJI XEROX CO., LTD.
    Inventor: Hiroshi Nishikawa
  • Patent number: 9196539
    Abstract: A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes forming a mask pattern on a surface of the wafer, and separating each of the semiconductor devices or semiconductor integrated circuits along the mask pattern formed on the surface of the wafer. The mask pattern is a repeated pattern without having a lattice line shape, and the step of separating each of the semiconductor devices or semiconductor integrated circuits is performed by plasma etching.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: November 24, 2015
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Masahiro Yamada, Kenya Iwasaki, Hiroshi Nishikawa
  • Publication number: 20150291364
    Abstract: A screw-drive conveying apparatus has on a conveying traveling body side, a first driven roller pair having a shorter distance between two driven front and rear rollers and a second driven roller pair having a longer distance between two driven front and rear rollers. A first screw shaft row with which the respective driven rollers of the first driven roller pair are engaged and a second screw shaft row with which the respective driven rollers of the second driven roller pair are engaged are provided on a traveling path side. The length of screw discontinued spaces between both screw shaft rows is equal to the distance between the driven rollers of the driven roller pair engaged with the screw shaft row on the upstream side.
    Type: Application
    Filed: June 26, 2015
    Publication date: October 15, 2015
    Inventors: Hiroshi Nishikawa, Toshiyuki Iba
  • Publication number: 20150268621
    Abstract: A removal device includes a scraping member extending in a crossing direction that crosses a movement direction in which a cleaning object moves, the scraping member scraping waste off a surface of the cleaning object at a contact portion of the scraping member that is in contact with the surface; and a pair of sealing members disposed on both outer sides of the scraping member in the crossing direction and sealing the both outer sides by contacting the surface. Each of the sealing members includes a protruding portion that protrudes beyond the contact portion upstream in the movement direction of the cleaning object. The protruding portion has a slit that extends diagonally from an edge of the protruding portion outward in the crossing direction and upstream in the movement direction, the edge facing inward in the crossing direction.
    Type: Application
    Filed: February 3, 2015
    Publication date: September 24, 2015
    Inventor: Hiroshi NISHIKAWA
  • Publication number: 20150235283
    Abstract: According to one embodiment, a commodity sales data processing apparatus includes a key for declaring execution of processing for causing, in a commodity transaction, a customer to make a motion for substantially directly facing an image pickup unit provided in a predetermined position, a customer-image pickup unit configured to pick up, according to operation of the key, using the image pickup unit, a face image of the customer substantially directly facing the image pickup unit, an age-group determining unit configured to compare the picked-up face image and face image data indicating features by age group stored in advance and determine an age group of the customer, and an associating unit configured to associate, according to the operation of the key, the determined age group with commodity information of a commodity traded in the commodity transaction.
    Type: Application
    Filed: February 13, 2015
    Publication date: August 20, 2015
    Inventor: Hiroshi Nishikawa
  • Patent number: 9041886
    Abstract: Disclosed herein is a liquid crystal display device including a plurality of pixels each having a reflecting section and a transmitting section, the pixels each including a plurality of sub-pixels resulting from alignment division, the liquid crystal display device including: an element layer formed on a substrate; an insulating film formed on the substrate so as to cover the element layer; a pixel electrode formed on the insulating film so as to be connected to the element layer; a gap adjusting layer formed on the insulating film on the element layer including a region of connection between the element layer and the pixel electrode; and a dielectric formed on a connecting part for making an electric connection between the sub-pixels.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: May 26, 2015
    Assignee: Japan Display, Inc
    Inventors: Takeo Koito, Hiroshi Nishikawa
  • Patent number: 8993603
    Abstract: A pharmaceutical composition containing one or more antifungal agents selected from an arylamidine derivative represented by the general formula: (wherein R1 represents an amidino group that may be substituted with a hydroxyl group that may be protected with an acyl group, an amidino group that may be substituted with an alkoxy group that may be substituted, or an amidino group that may be substituted with an aralkyloxy group that may be substituted; R2 and R3 identically or differently represent a hydrogen atom or a halogen atom) or a salt thereof, an azole antifungal agent, a polyene antifungal agent, a candin antifungal agent and a fluoropyrimidine antifungal agent has a strong antifungal activity and is useful for the treatment of fungal infection. A method for using them in combination is useful as an excellent therapeutic method for fungal infection.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: March 31, 2015
    Assignee: Toyama Chemical Co., Ltd.
    Inventors: Nobuhiko Nomura, Hiroshi Nishikawa, Noritomo Fujino
  • Publication number: 20150048361
    Abstract: A display unit includes: an oxide semiconductor layer configured to form a channel; a first layer having electrical insulation or electrical conductivity; and a second layer including a hydrogen absorbent and disposed between the oxide semiconductor layer and the first layer.
    Type: Application
    Filed: August 7, 2014
    Publication date: February 19, 2015
    Applicant: Sony Corporation
    Inventors: Shigehiro Yamakita, Eri Matsuo, Hiroshi Nishikawa, Kimihiro Shinya, Tomoatsu Kinoshita, Masanori Nishiyama, Kenichi Izumi
  • Publication number: 20140370688
    Abstract: A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes forming a mask pattern on a surface of the wafer, and separating each of the semiconductor devices or semiconductor integrated circuits along the mask pattern formed on the surface of the wafer. The mask pattern is a repeated pattern without having a lattice line shape, and the step of separating each of the semiconductor devices or semiconductor integrated circuits is performed by plasma etching.
    Type: Application
    Filed: September 2, 2014
    Publication date: December 18, 2014
    Inventors: Masahiro Yamada, Kenya Iwasaki, Hiroshi Nishikawa
  • Publication number: 20140365306
    Abstract: A user information providing apparatus according to an embodiment includes a database, an acquiring unit, an extracting unit, and a output unit. The database stores pieces of user information of a business operator. The acquiring unit acquires, as entry information, information of a place corresponding to the business operator and information of a wireless terminal which has entered the place. The extracting unit extracts a piece of user information of the business operator corresponding to the place which the wireless terminal has entered from the database, based on the entry information acquired. The output unit outputs the extracted piece of user information.
    Type: Application
    Filed: August 27, 2013
    Publication date: December 11, 2014
    Applicant: YAHOO JAPAN CORPORATION
    Inventors: Hiroshi OTA, Nobuyuki AKASHI, Hiroshi NISHIKAWA
  • Patent number: 8899571
    Abstract: A sheet-through document reading apparatus including: a document tray for containing a plurality of documents; a determination unit that determines a length of a document on the document tray; a feed unit that separates and feeds a document on the document tray; a resist convey unit that performs consistency processing on the document fed by the feed unit; a first drive unit that rotationally drives the resist convey unit; a read convey unit that feeds the document subjected to consistency processing by the resist convey unit; a second drive unit that rotationally drives the read convey unit; a reading unit that reads, at a fixed reading position, the document conveyed by the read convey unit; and a control unit for changing a relative conveying velocity between the resist convey unit and the read convey unit on the basis of a result of the determination by the determination unit.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: December 2, 2014
    Assignee: Konica Minolta, Inc.
    Inventor: Hiroshi Nishikawa
  • Patent number: 8841141
    Abstract: A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes: forming, on a surface of the wafer, a mask layer through which a line-shaped pattern to be removed for separating the semiconductor devices or semiconductor integrated circuits is exposed; and etching the exposed pattern to a depth equal to or larger than about ? of a thickness of the wafer. The line-shaped pattern is formed so as to prevent a test device formed on a gap between the semiconductor devices or semiconductor integrated circuits from remaining on separated semiconductor devices or semiconductor integrated circuits.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: September 23, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Masahiro Yamada, Kenya Iwasaki, Hiroshi Nishikawa
  • Patent number: 8792145
    Abstract: An image reading apparatus includes a conveying unit for conveying documents one by one, a first reading unit for optically reading the conveyed document through a first transparent member provided at a first reading position on a conveying path in the conveying unit, a first cleaning unit for cleaning the first transparent member provided at the first reading position, a second reading unit for optically reading the conveyed document through a second transparent member provided at a second reading position on the conveying path in the conveying unit and on a downstream side of the first reading position, and a second cleaning unit for cleaning the second transparent member provided at the second reading position. The second cleaning unit is higher in cleaning ability than the first cleaning unit.
    Type: Grant
    Filed: January 28, 2011
    Date of Patent: July 29, 2014
    Assignee: Konica Minolta Business Technologies, Inc.
    Inventor: Hiroshi Nishikawa
  • Patent number: 8724334
    Abstract: A circuit module and a manufacturing method for the same, reduce a possibility that a defect area where an electrically conductive resin is not coated may occur in a shield layer. A mother board is prepared. A plurality of electronic components are mounted on a principal surface of the mother board. An insulator layer is arranged so as to cover the principal surface of the mother board and the electronic components. The insulator layer is cut such that grooves and projections are formed in and on the principal surface of the insulator layer and the insulator layer has a predetermined thickness H. An electrically conductive resin is coated on the principal surface of the insulator layer to form a shield layer. The mother board including the insulator layer and the shield layer both formed thereon is divided to obtain a plurality of circuit modules.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: May 13, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroshi Nishikawa, Makoto Fujita, Fumikiyo Kawahara
  • Publication number: 20140127839
    Abstract: A method for separating a multiple number of semiconductor devices or semiconductor integrated circuits from a wafer on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed is provided. The method includes: forming, on a surface of the wafer, a mask layer through which a line-shaped pattern to be removed for separating the semiconductor devices or semiconductor integrated circuits is exposed; and etching the exposed pattern to a depth equal to or larger than about ? of a thickness of the wafer. The line-shaped pattern is formed so as to prevent a test device formed on a gap between the semiconductor devices or semiconductor integrated circuits from remaining on separated semiconductor devices or semiconductor integrated circuits.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: Tokyo Electron Limited
    Inventors: Masahiro Yamada, Kenya Iwasaki, Hiroshi Nishikawa
  • Patent number: 8712297
    Abstract: A transfer device includes an endless member caused to circulate by a driving unit, plural transfer members coming in contact with a rear surface of the endless member and transferring toner images on image holding members to the endless member, a support member movably supporting a specific transfer member of the transfer members located at a position which is more upstream in a circulation direction of the endless member than a contact position where a recording medium comes in contact with the endless member and which is closest to the contact position, a regulation member regulating the movement of the specific transfer member in a state where the specific transfer member is disposed at a position where the toner image formed on the corresponding image holding member is transferred to the endless member, and a first impelling member impelling the support member to the regulation member.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: April 29, 2014
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Shiro Ohashi, Hiroshi Nishikawa, Hiroki Shiba, Shinya Kumagai
  • Patent number: 8658436
    Abstract: [Problems] There are provided a chip separation method and a chip transfer method using features of dry etching. [Means for Solving the Problems] In the chip separation method, a multiple number of semiconductor devices or semiconductor integrated circuits are separated from a wafer 100 on which the multiple number of semiconductor devices or semiconductor integrated circuits are formed. The method includes forming, on a surface of the wafer 100, a mask layer through which a line-shaped pattern to be removed for separating the semiconductor devices or semiconductor integrated circuits is exposed; and etching the exposed pattern to a depth equal to or larger than about ? of a thickness of the wafer. One group of separated semiconductor devices or semiconductor integrated circuits has a distinguishable shape from another group of separated semiconductor devices or semiconductor integrated circuits.
    Type: Grant
    Filed: April 19, 2011
    Date of Patent: February 25, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Masahiro Yamada, Kenya Iwasaki, Hiroshi Nishikawa
  • Publication number: 20140024156
    Abstract: Disclosed herein is a liquid crystal display device including a plurality of pixels each having a reflecting section and a transmitting section, the pixels each including a plurality of sub-pixels resulting from alignment division, the liquid crystal display device including: an element layer formed on a substrate; an insulating film formed on the substrate so as to cover the element layer; a pixel electrode formed on the insulating film so as to be connected to the element layer; a gap adjusting layer formed on the insulating film on the element layer including a region of connection between the element layer and the pixel electrode; and a dielectric formed on a connecting part for making an electric connection between the sub-pixels.
    Type: Application
    Filed: September 24, 2013
    Publication date: January 23, 2014
    Applicant: Japan Display West Inc.
    Inventors: Takeo KOITO, Hiroshi NISHIKAWA