Abstract: The present invention relates to a bleaching activator granule containing (a) a bleaching activator and (b) a specified alcohol which is liquid at room temperature (25° C.).

Abstract: The present invention relates to a thermosetting resin composition for optical-semiconductor element encapsulation, the thermosetting resin composition including the following ingredients (A) to (D): (A) an epoxy group-containing siloxane compound represented by the following general formula (1) in which R1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, R2 is a divalent hydrocarbon group having 1 to 20 carbon atoms and may contain an oxygen atom for ether formulation or ester formulation inside thereof, and n is an integer of 0 to 20; (B) an acid anhydride curing agent; (C) a thermally condensable organosiloxane; and (D) a curing accelerator.

Abstract: The present invention relates to a resin composition for optical semiconductor devices, the resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a polyorganosiloxane; and (D) a white pigment.

Abstract: The present invention relates to a photocurable resin composition including the following ingredients (A), (B) and (C): (A) a linear chain epoxy resin represented by the following general formula (1), in which m indicates an integer of from 2 to 10, and R1 and R2 each represent a hydrogen atom or a fluorine atom; (B) an alicyclic epoxy resin having at least two epoxy groups in one molecule thereof; and (C) a phosphorus fluoride-based photopolymerization initiator.

Abstract: The present invention relates to a resin composition for optical components, the resin composition being an ultraviolet-curable transparent resin composition to be used as a material for an optical component, in which the resin component includes the following component (A) as a main component and the following component (B) being a photo-cationic polymerization initiator: (A) an epoxy resin having two or more epoxy groups in one molecule thereof; and (B) an onium salt containing a hexafluorophosphate ion as an anion component.

Abstract: The present invention relates to an epoxy resin composition for photosemiconductor element encapsulation, the epoxy resin composition including the following components (A) to (D): (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an acid anhydride curing agent, (C) a curing accelerator, and (D) an alcohol compound having three or more primary hydroxyl groups in one molecule thereof.

Abstract: The powder composition for paper manufacturing of the invention contains a hydrophobic organic compound (A), an emulsifying and dispersing agent (B), and optionally water-soluble saccharides (C) added based on necessity and has an average particle diameter of 0.1 to 2,000 ?m.

Abstract: An epoxy resin composition for semiconductor encapsulation, which comprises: (A) an epoxy resin having at least two epoxy groups in a molecule thereof; (B) a compound having at least two phenolic hydroxyl groups in a molecule thereof; and (C) particles of a compound represented by general formula (1), the particles having a maximum particle diameter of not greater than 30 ?m and a standard deviation of not greater than 5 ?m, the particles being dispersed in the epoxy resin composition: wherein X1 to X5, which may be the same or different, are each a hydrogen atom, an alkyl group having 1 to 9 carbon atoms, or a fluorine atom. The epoxy resin composition is an encapsulation material excellent in pot life, fluidity and curability, and has a lower chloride ion content. The epoxy resin composition provides a highly reliable semiconductor device excellent in moisture resistant reliability.

Abstract: The present invention relates to a process for producing an optical component, the process including: disposing a transparent stamp tool on a substrate or an imaging element through a transparent ultraviolet-curable resin composition layer; and irradiating the resin composition layer with an ultraviolet ray through the transparent stamp tool to thereby cure the resin composition layer, in which a resin composition contained in the resin composition layer contains a thermosetting resin as a main component and a photo-acid generator, and the ultraviolet ray passing through the transparent stamp tool is an ultraviolet ray having a wavelength of 320 nm or more.

Abstract: The present invention relates to a resin composition for optical components, which is an ultraviolet-curable transparent resin composition used as a material for an optical component, in which the resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an oxetane compound having one or more oxetanyl groups in one molecule thereof and (C) a photo-acid generator, and in which the component (C) is contained in an amount of 0.01 to 2.0 parts by weight based on 100 parts by weight of a total amount of the components (A) and (B). The present invention also relates to an optical component obtained by using the resin composition for optical components, and a production method thereof.

Abstract: The present invention relates to a bleaching activator granule containing (a) a bleaching activator and (b) a specified alcohol which is liquid at room temperature (25° C.).

Abstract: The present invention provides a method of manufacturing a semiconductor device in which a semiconductor element is mounted on a wiring circuit board and a clearance between the wiring circuit board and the semiconductor element is sealed with a sealing material, the method including: a sealing material arranging step of arranging the sealing material on at least one of a terminal-provided surface of the semiconductor element and a terminal-provided surface of the wiring circuit board; a sealing step of pressing the semiconductor element to the wiring circuit board under such a condition that a terminal of the semiconductor element and a terminal of the wiring circuit board are opposed with each other via the sealing material at a reduced pressure of 13300 Pa (absolute pressure) or less, thereby combining the semiconductor element with the wiring circuit board; and subsequent to the sealing step, a terminal connecting step of heating and fusing at least one of the terminal of the semiconductor element and the

Abstract: A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40° to 80° C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25° C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.

Abstract: A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C). (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.

Abstract: The invention provides a process for producing a bleaching activator composition, which includes removing a solvent and/or water from a mixture of a bleaching activator and a surfactant dispersed in a non-aqueous solvent, a bleaching activator composition produced by the process and a bleaching activator granule obtained by further granulating the bleaching activator composition.

Abstract: A resin composition usable for encapsulating a semiconductor, comprising (A) an epoxy resin having two or more epoxy groups in one molecule; (B) a curing agent; and (C) inorganic composite oxide particles constituted by silicon dioxide and at least one metal oxide selected from the group consisting of oxides of metal atoms belonging to Group III and Group IV of the Periodic Table excluding silicon; a semiconductor device comprising a wiring circuit board, a semiconductor element, and the above resin composition; and a method for manufacturing a semiconductor device comprising the steps of adhering a resin sheet comprising the resin composition of claim 1 and a stripping sheet to a semiconductor circuit side of a bump-mounting wafer, removing the stripping sheet leaving only the resin composition to the wafer, and cutting the wafer into individual chips.

Abstract: The powder composition for paper manufacturing of the invention contains a hydrophobic organic compound (A), an emulsifying and dispersing agent (B), and optionally water-soluble saccharides (C) added based on necessity and has an average particle diameter of 0.1 to 2,000 ?m.

Abstract: An object of the present invention is to provide an electronic part device which can be repaired even in the case of an electronic part device having a malfunction in electrical connection after carrying out underfill. The present invention is an electronic part device in which a semiconductor element (flip chip) (3) is mounted on a wiring circuit substrate (1) under such a state that an electrode part for connection (joint ball) disposed on the semiconductor element (flip chip) (3) and a circuit electrode (5) disposed on the wiring circuit substrate (1) are facing with each other. In addition, the gap between the wiring circuit substrate (1) and the semiconductor element (flip chip) (3) is filled by a filling resin layer (4) comprising a liquid epoxy resin composition which comprises the following component (D) and the following components (A) to (C) (A) A liquid epoxy resin. (B) A curing agent. (C) An N,N,N?,N?-tetra-substituted fluorine-containing aromatic diamine compound.

Abstract: The invention provides a process for producing a bleaching activator composition, which includes removing a solvent and/or water from a mixture of a bleaching activator and a surfactant dispersed in a non-aqueous solvent, a bleaching activator composition produced by the process and a bleaching activator granule obtained by further granulating the bleaching activator composition.