Abstract: There are provided the body supported to the side of the combination switch and having the circular wall, the rotor connected rotatably to the body and coaxial with the wall section, the free motion spacer formed circularly between the body and the rotor and capable of freely turning with rotation of the rotor, the first guide section and the roller constituting the second guide section which are provided in the free motion spacer, the first flat cable arranged along in the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the first flat cable are fixed to the body and the rotor respectively and the first flat cable is reversed by always making the convex side of the reversing section in the first flat cable contact the first guide section, and the second flat cable arranged along the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the second flat cable ar

Abstract: The present invention provides a method of improving nanotopography of a surface of a wafer sliced from an ingot by using a wire saw apparatus, including improving straightness of feed of a work feed table which is included in the wire saw apparatus and used for feeding the ingot to a wire row formed by winding a wire around a plurality of rollers, and also provides a wire saw apparatus for slicing an ingot to manufacture a wafer, including: a wire row formed by winding a wire around a plurality of rollers; a work feed table for holding and feeding the ingot to the wire row; and a linear-motion guide for linearly guiding the work feed table, wherein a component having a wavelength of 20 to 200 mm in straightness of feed of the work feed table satisfies a PV value ?1.0 ?m. As a result, there are provided the method of eliminating slice waviness having periodicity to improve the nanotopography of the surface of the wafer and the wire saw apparatus.

Abstract: The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a cooling speed of the ingot when a slicing depth is equal to or above ? of a diameter is controlled to perform slicing by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while controlling a supply temperature only in a period from the moment that the slicing depth of the ingot reaches at least ? of the diameter to end of slicing. As a result, the slicing method is provided, in which rapid cooling of the ingot in the time close to end of slicing the ingot can be alleviated when a wire saw is used to slice the ingot, and generation of a nano-topography can be thereby suppressed and further high quality wafers having a uniform thickness are obtained by slicing.

Abstract: A compound semiconductor substrate which inhibits the generation of a crack or a warp and is preferable for a normally-off type high breakdown voltage device, arranged that a multilayer buffer layer 2 in which AlxGa1-xN single crystal layers (0.6?X?1.0) 21 containing carbon from 1×1018 atoms/cm3 to 1×1021 atoms/cm3 and AlyGa1-yN single crystal layers (0.1?y?0.5) 22 containing carbon from 1×1017 atoms/cm3 to 1×1021 atoms/cm3 are alternately and repeatedly stacked in order, and a nitride active layer 3 provided with an electron transport layer 31 having a carbon concentration of 5×1017 atoms/cm3 or less and an electron supply layer 32 are deposited on a Si single crystal substrate 1 in order. The carbon concentrations of the AlxGa1-xN single crystal layers 21 and that of the AlyGa1-yN single crystal layers 22 respectively decrease from the substrate 1 side towards the above-mentioned active layer 3 side. In this way, the compound semiconductor substrate is produced.

Abstract: The present invention is a static pressure pad for supporting both sides of a raw wafer without contact by a static pressure of a fluid supplied to the both sides of the raw wafer in a double-disc grinding machine for a semiconductor wafer, wherein in patterns of lands to be banks of surrounding pockets formed on a surface side of supporting the raw wafer of the static pressure pad, an outer circumferential land pattern required to support the raw wafer is a concentric circle with respect to a rotation center of the raw wafer, and a land pattern inside the outer circumferential land pattern is a non-concentric circle with respect to the rotation center of the raw wafer and asymmetrical with respect to all the straight lines which bisect the static pressure pad.

Abstract: There are provided a body, a rotor, a free motion spacer including a group of spacer sections arranged circularly between the body and the rotor and a reverse guide section in which a guide face is provided to be opposed to a roller in the group of spacer sections in the circumferential direction to form a reverse insert section and capable of turning with rotation of the rotor, and a flat cable which is reversed by inserting the reverse section into the reverse insert section in the free motion spacer and is wound around the outer and inner peripheral sides of the group of spacer sections where ribs 45 and 47 project from a wall face at the opposing side of a guide face toward the roller adjacent to the wall face in the circumferential direction of the reverse guide section, and a projection 49 for the stopper is provided in the rib, whereby when the reverse section of the flat cable is erroneously assembled between the wall face and the roller adjacent to the wall face, the reverse section runs on the rib a

Abstract: The present invention provides a compound semiconductor substrate, including: a single-crystal silicon substrate having a crystal face with (111) orientation; a first buffer layer which is formed on the single-crystal silicon substrate and is constituted of an AlxGa1-xN single crystal (0<x?1); a second buffer layer which is formed on the first buffer layer and is composed of a plurality of first unit layers each having a thickness of from 250 nm to 350 nm and constituted of an AlyGa1-yN single crystal (0?y<0.1) and a plurality of second unit layers each having a thickness of from 5 nm to 20 nm and constituted of an AlzGa1-zN single crystal (0.9<z?1), said pluralities of first and second unit layers having been alternately superposed; and a semiconductor device formation region which is formed on the second buffer layer and includes at least one nitride-based semiconductor single-crystal layer.

Abstract: A rotary connector device is provided for restraining an error of rotational transmission between a steering wheel and a steering-angle sensor and restricting an increase of a steering-wheel detection error, making it possible to perform timely vehicle control. The rotary connector has: a body which is supported at a combination switch side and is adapted to pass a steering shaft; a rotor adapted to pass the steering shaft; and an attachment adapted to rotatably couple the rotor to the body and conjunctively rotate relative to the rotor, sensor-engagement recessed portions engaging with a steering-angle sensor to transmit a rotation, the recessed portions being provided at the attachment, wherein wheel-engagement protrusions engaging with a steering wheel are provided at the attachment.

Abstract: The present invention provides a vehicle display device which can display fuel consumption information of a vehicle in a useful and optimum mode for a driver. A meter_EUC calculates an instantaneous fuel consumption of a vehicle based on a mileage and a fuel injection quantity within a set time, calculates an average fuel consumption of the vehicle based on respective cumulative values of the mileage and the fuel injection quantity repeatedly calculated for every set time, and displays the deviation of the instantaneous fuel consumption with respect to the average fuel consumption as fuel consumption information on a fuel consumption meter. The display on the fuel consumption meter is performed by swinging a pointer with respect to a neutral position.

Abstract: The present invention provides a method of improving nanotopography of a surface of a wafer sliced from an ingot by using a wire saw apparatus, including improving straightness of feed of a work feed table which is included in the wire saw apparatus and used for feeding the ingot to a wire row formed by winding a wire around a plurality of rollers, and also provides a wire saw apparatus for slicing an ingot to manufacture a wafer, including: a wire row formed by winding a wire around a plurality of rollers; a work feed table for holding and feeding the ingot to the wire row; and a linear-motion guide for linearly guiding the work feed table, wherein a component having a wavelength of 20 to 200 mm in straightness of feed of the work feed table satisfies a PV value ?1.0 ?m. As a result, there are provided the method of eliminating slice waviness having periodicity to improve the nanotopography of the surface of the wafer and the wire saw apparatus.

Abstract: A rotary connector apparatus includes a body supported fixedly, a rotor supported rotatably by the body and rotatable together with a steering wheel, a floating spacer disposed between the body and the rotor, rotatably floating according to rotation of the rotor, and having an inverting pass portion communicating between the inside and the outside in a radial direction, and a flat cable passing through the inverting pass portion to be inverted and wound on the sides of inner and outer peripheries of the floating spacer, a recessed portion provided with an outer peripheral face of the floating spacer so as to avoid hitting of the flat cable in a direction of a rotational axis of the floating spacer.

Abstract: The driving force control unit for a vehicle comprises a plurality of control modes for controlling a driving force, each of control modes having each driving force characteristic, a vehicle driving condition detecting unit for detecting a vehicle driving condition, a selector for selecting one control mode from the control modes, a temporary selector for changing the current mode to other mode, and a driving force indication value setting unit for setting a driving force indication value according to the vehicle driving condition and the driving force characteristic corresponding to the selected mode by the selector or the temporary selector.

Abstract: The driving force control unit comprises a plurality of control modes for controlling a driving force, each of control modes having each driving force characteristic; a vehicle driving condition detecting unit for detecting a vehicle driving condition; a selector for selecting one control mode from the plurality of control modes; a driving force setting unit for setting a driving force indication value according to the driving force characteristic selected by the selector based on the vehicle driving condition; and a shift lever position detector for detecting a shift lever position of a transmission. The control mode includes a reverse control mode having a reverse driving force characteristic suitable for traveling the vehicle in reverse direction. The driving force setting unit changes the control mode to the reverse control mode when the shift lever is detected in a position of a reverse range, and sets the driving force indication value according to the reverse driving force characteristic.

Abstract: The present invention provides a method for slicing a silicon single crystal ingot having a plane direction (110) by a wire saw to manufacture a (110) silicon wafer, wherein slicing is performed in such a manner that each angle formed between a traveling direction of a wire in the wire saw and a [?112 ] direction and a [1-12] direction in the (110) silicon single crystal ingot or a direction crystallographically equivalent to the directions exceeds 30°. As a result, the method for manufacturing the (110) silicon wafer that can suppress occurrence of breaking at the time of slicing and improve a production yield ratio can be provided.

Abstract: The invention is directed to a method for slicing an ingot in the form of a wafer by winding a wire around a plurality of grooved rollers and pressing the wire against the ingot while making the wire travel and supplying slicing slurry to the grooved rollers, in which when the ingot is sliced, an amount of displacement of the ingot changing in an axial direction is measured and an amount of axial displacement of the grooved rollers is controlled so as to correspond to the measured amount of axial displacement of the ingot, and thereby, the ingot is sliced while controlling a relative position of the wire relative to an entire length of the ingot changing in the axial direction. As a result, a slicing method and a wire saw apparatus are provided that can perform slicing in such a way that a Bow or a Warp in a wafer obtained by slicing can be reduced, for example, by controlling a slicing path built into an ingot so that, in particular, the slicing path becomes flattened.

Abstract: The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a supply temperature of the slurry for slicing is controlled, and slicing is performed in such a manner that the supply temperature of the slurry for slicing and a temperature of the ingot become at least 30° C. or above at end of slicing the ingot. As a result, there is provided the slicing method that can alleviate precipitous cooling of an ingot in the time close to end of slicing the ingot and thereby suppress production of a nano-topography when slicing the ingot by using a wire saw.

Abstract: There are provided a body, a rotor, a free motion spacer including a group of spacer sections arranged circularly between the body and the rotor and a reverse guide section in which a guide face is provided to be opposed to a roller in the group of spacer sections in the circumferential direction to form a reverse insert section and capable of turning with rotation of the rotor, and a flat cable which is reversed by inserting the reverse section into the reverse insert section in the free motion spacer and is wound around the outer and inner peripheral sides of the group of spacer sections where ribs 45 and 47 project from a wall face at the opposing side of a guide face toward the roller adjacent to the wall face in the circumferential direction of the reverse guide section, and a projection 49 for the stopper is provided in the rib, whereby when the reverse section of the flat cable is erroneously assembled between the wall face and the roller adjacent to the wall face, the reverse section runs on the rib a

Abstract: There are provided the body supported to the side of the combination switch and having the circular wall, the rotor connected rotatably to the body and coaxial with the wall section, the free motion spacer formed circularly between the body and the rotor and capable of freely turning with rotation of the rotor, the first guide section and the roller constituting the second guide section which are provided in the free motion spacer, the first flat cable arranged along in the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the first flat cable are fixed to the body and the rotor respectively and the first flat cable is reversed by always making the convex side of the reversing section in the first flat cable contact the first guide section, and the second flat cable arranged along the circumferential direction of the outer and inner peripheral sides of the free motion spacer in such a manner that both ends of the second flat cable ar

Abstract: A rotary connector device is provided for restraining an error of rotational transmission between a steering wheel and a steering-angle sensor and restricting an increase of a steering-wheel detection error, making it possible to perform timely vehicle control. The rotary connector has: a body which is supported at a combination switch side and is adapted to pass a steering shaft; a rotor adapted to pass the steering shaft; and an attachment adapted to rotatably couple the rotor to the body and conjunctively rotate relative to the rotor, sensor-engagement recessed portions engaging with a steering-angle sensor to transmit a rotation, the recessed portions being provided at the attachment, wherein wheel-engagement protrusions engaging with a steering wheel are provided at the attachment.

Abstract: There is provided a slicing method including winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, in which a test of slicing the ingot while supplying the slurry for slicing to the grooved rollers and controlling a supply temperature thereof is previously conducted to examine a relationship between an axial displacement of the grooved rollers and a supply temperature of the slurry for slicing, a supply temperature profile of the slurry for slicing is set based on the relationship between an axial displacement of the grooved rollers and a supply temperature of the slurry for slicing, and the slurry for slicing is supplied based on the supply temperature profile to slice the ingot while controlling an axial displacement of the grooved rollers and to uniform Sori of all wafers to be sliced out in one direction.