Abstract: A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.

Abstract: An electronic device includes a bus bar that includes a first terminal and a second terminal and extends between the first terminal and the second terminal on a side of a first surface of a substrate; first solder configured to pass through the substrate in a thickness direction and connect a first through terminal connected to a first electronic component that is disposed on a second surface side of the substrate and the first terminal; and second solder configured to pass through the substrate in the thickness direction and connect a second through terminal connected to a second electronic component disposed on the second surface side of the substrate and the second terminal.

Abstract: A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

Abstract: A thermal humidity measuring device includes first and second heating elements, and is capable of obtaining a plurality of measurement values (measured values) by effectively utilizing each of the heating elements, which includes measuring humidity by the first heating element. A thermal humidity measuring device includes a first bridge circuit that includes a first heating element that senses humidity, and a second bridge circuit that includes a second heating element that heats air around the first heating element. In the thermal humidity measuring device, a first output signal is extracted from the first bridge circuit, and the humidity is sensed. A second output signal is extracted from the second bridge circuit, and the second output signal includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Abstract: Provided is a sensor element that can be manufactured without using hydrofluoric acid or hot phosphoric acid solution. A sensor element 100 includes a base material 10 and a semiconductor chip 20 bonded to the base material 10. The semiconductor chip 20 includes a semiconductor substrate 21, a support film 22 provided on a surface 21a of the semiconductor substrate 21, and a substrate chamber 23 provided in a concave shape on the semiconductor substrate 21 to form a cavity facing an element region 22A of the support film 22, an insulating layer 24 provided on a rear surface 21b of the semiconductor substrate 21, and a bonding layer 25 provided between the insulating layer 14 and the base material 10. The insulating layer 24 includes at least one of a silicon oxynitride film and a silicon oxide film. The bonding layer 25 includes a low-melting point glass.

Abstract: According to the conventional knowledge, a thermal humidity measurement device has problems in which the direction of air flow is limited to one direction is too hard to handle in securing the humidity responsiveness because there are limitations on the mounting direction of the thermal humidity measurement device and the state of air flow. An introduction guide protrudes from an air introduction surface to the outside of a measurement chamber, is parallel to a humidity introduction port surface, and has a portion not in contact with an inlet surface of a humidity introduction tube as seen from any direction to guide the flow of air to the humidity introduction tube from any direction of 360°.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.

Abstract: There is provided a pressure detecting device whose number of connection points and number of parts are small. A pressure detecting device 100 includes a sensor unit 30 which includes a strain detecting element which detects a strain amount of a pressure receiving surface 11p strained when receiving a pressure, and a processing circuit which processes a signal from the strain detecting element, and includes a housing 10 which houses the sensor unit 30, and terminals 20a and 20c which are connected to the sensor unit 30 and part of which is exposed retractably from the housing 10, and the terminals 20a and 20c include spring mechanisms 22a and 22c which are provided in the housing 10 and can elastically deform.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: A pressure sensor which detects a combustion pressure of an engine includes: a contact part which is in direct or indirect contact with a casing of the engine when the pressure sensor is attached to the engine; and a pressure detection unit which detects the combustion pressure and outputs a signal corresponding to the combustion pressure, wherein the pressure detection unit includes a pressure detection element which detects the combustion pressure and outputs a signal, and a circuit unit which converts the signal obtained from the pressure detection element into a signal corresponding to the combustion pressure, and the pressure detection unit is provided at a location positioned more inside the engine than the contact part when the pressure sensor is attached to the engine.

Abstract: It is an object to provide a highly reliable physical-quantity measurement device which can relax thermal stress at a time of bonding and suppress creep or drift of a sensor output. To attain the above-described object, a physical-quantity measurement device according to the present invention includes a semiconductor element, and a base board connected to the semiconductor element with a plurality of layers being interposed. In the plurality of layers, a stress relaxing layer including at least metal as a main ingredient and a glass layer including glass as a main ingredient are formed each in a layered form including one or more layers. At least one of the stress relaxing layer and the glass layer includes low-melting-point glass, and a softening point of the low-melting-point glass is equal to or lower than the highest heat temperature that the semiconductor element can resist.

Abstract: A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

Abstract: An RFID tag includes an antenna extending in a longitudinal direction and a reinforcing member extending such that the center thereof projects to opposite sides in a transverse direction. The reinforcing member includes first and second crossover edge portions crossing with the antenna at one and the other side in the longitudinal direction, a first inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, a second inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction, a third inclination edge portion inclined so as to approach the antenna from the center side toward one side in the longitudinal direction, and a fourth inclination edge portion inclined so as to approach the antenna from the center side toward the other side in the longitudinal direction.

Abstract: A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.

Abstract: It is an object of the present invention to provide a thermal humidity measuring device that has a configuration including a first heating element and a second heating element and that is capable of obtaining a plurality of measurement values (measured values) including humidity measured by the first heating element, by effectively utilizing each of the heating elements. A thermal humidity measuring device 1 includes a first bridge circuit 2 that includes a first heating element 4 that senses humidity, and a second bridge circuit 3 that includes a second heating element 10 that heats air around the first heating element 4. In the thermal humidity measuring device 1, a first output signal Va5 is extracted from the first bridge circuit 2, and the humidity is sensed. A second output signal Va15 is extracted from the second bridge circuit 3, and the second output signal Va15 includes information relating to at least any one of pressure, an air flow rate, and air temperature.

Abstract: Provided is a humidity measuring apparatus that can measure a humidity of gas with high accuracy even in an environment with pulsation of gas to be measured, in measuring a humidity of gas with a humidity measuring apparatus using a thermal humidity detecting element. The humidity detecting element is disposed in a space offset from an extension line of a pressure introduction passage in a storage chamber, or a space formed on a depth side of a member provided on an extension line of the pressure introduction passage in the storage chamber such that gas introduced from a pressure introduction port into the pressure introduction passage is bent at least once before reaching the humidity detecting element.

Abstract: Provided is a physical quantity measurement device in which a bonding temperature of a bonding layer is lowered to a temperature not affecting an operation of a semiconductor chip and an insulating property of the semiconductor chip and a base is secured. The physical quantity measurement device includes a base (diaphragm), a semiconductor chip (strain detection element) to measure a physical quantity on the basis of stress acting on the base, and a bonding layer to bond the semiconductor chip to the base. The bonding layer has a first bonding layer bonded to the semiconductor chip, a second bonding layer bonded to the base, and an insulating base material disposed between the first bonding layer and the second bonding layer. The first and second bonding layers and contain glass.

Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.