Abstract: In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed.

Abstract: The purpose of the present invention is to provide a semiconductor device that is small and has diagnosability, and that can quickly recover from power source malfunctions. Provided is a semiconductor device that includes: a control signal generation circuit that generates control signals which differ according to the fluctuation time of power-source voltage; and a control circuit that changes an operation sequence according to the differences in the control signals.

Abstract: A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.

Abstract: An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface; a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity; a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

Abstract: An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract: An electronic component includes a substrate configured to include a first portion that first thermal conductivity, and have a first surface and a second surface opposite to the first surface;a second portion configured to be formed inside the first portion, and have second thermal conductivity lower than the first thermal conductivity;a first terminal configured to be formed to correspond to the second portion on a side of the first surface; and a second terminal configured to be formed on a side of the second surface.

Abstract: A laminated chip includes: semiconductor chips that are laminated; and multiple types of adhesive insulating resin films that include mutually different characteristics and that are filled between the semiconductor chips, wherein the multiple types of the adhesive insulating resin films are arranged in a chip plane direction, depending on a demand characteristic for each region in a chip plane.

Abstract: A channel distribution type cooling plate where a space between a first coolant storage part for inflow of coolant and a second cooling storage part for outflow of coolant formed at the two ends of an upper space of a main body provided with a lower space for removing heat of a heat generating member is partitioned by a meandering type partition wall to form coolant distribution paths connected to the first coolant storage part and coolant collection paths connected to the second coolant storage part, the bottom of the coolant distribution paths and the coolant collection paths are communicated by a plurality of through holes with the lower space, and side surfaces of the partition wall at the coolant distribution path sides are formed with subchannels for running coolant from the first coolant storage part, in order to improve the cooling efficiency at the coolant outlet side.

Abstract: In a pressure sensor having a configuration in which strain gauges are provided on a diaphragm, a change in sensor characteristic caused by a positional shift of the strain gauges is suppressed, and a change in sensor output in response to a change in temperature is suppressed.

Abstract: An object of the present invention is to realize a pressure sensor with a small variation in sensor characteristics. The pressure sensor includes a diaphragm having longitudinal and lateral sides, and four strain gauges disposed on the diaphragm. The four strain gauges are arranged at a center of the diaphragm. Two of the four strain gauges are arranged along a lateral direction, and other two strain gauges are arranged along a longitudinal direction.

Abstract: To implement a downsized pressure sensor apparatus, a pressure sensor apparatus of the present invention includes a housing including a first pressure introduction passage for introducing a first pressure and a second pressure introduction passage for introducing a second pressure, a first pressure detection element provided in the housing and configured to detect the pressure introduced from the first pressure introduction passage, and a second pressure detection element provided in the housing and configured to detect the pressure introduced from the second pressure introduction passage, wherein a circuit substrate is placed above the first and second pressure detection elements, and a first intermediate terminal configured to electrically connect the first pressure detection element with the circuit substrate and a second intermediate terminal configured to electrically connect the second pressure detection element with the circuit substrate are inserted into the housing.

Abstract: After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.

Abstract: A thermal gas-flow measuring instrument has a first heating resistor placed in the gas to be measured. A temperature sensing resistor is positioned upstream or downstream of the first heating resistor and generates signals relating to the flow rate. Between the first heating resistor and the support for supporting the first heating resistor is a second heating resistor that is electrically insulated from the first heating resistor. The second heating resistor suppresses the heat being transferred from the first heating resistor to the support. A control circuit controls the temperatures of the first heating resistor and the second heating resistor so that the operational temperature range of the second heating resistor or the temperature range at the joint section between the first heating resistor and the second heating resistor is at or above the temperature at which water droplets evaporate to disappear by film boiling.

Abstract: A thermal gas-flow measuring instrument has a first heating resistor placed in the gas to be measured. A temperature sensing resistor is positioned upstream or downstream of the first heating resistor and generates signals relating to the flow rate. Between the first heating resistor and the support for supporting the first heating resistor is a second heating resistor that is electrically insulated from the first heating resistor. The second heating resistor suppresses the heat being transferred from the first heating resistor to the support. A control circuit controls the temperatures of the first heating resistor and the second heating resistor so that the operational temperature range of the second heating resistor or the temperature range at the joint section between the first heating resistor and the second heating resistor is at or above the temperature at which water droplets evaporates to disappear by film boiling.

Abstract: After the periphery of the magnetic sensitive element is surrounded by an elastic member, the magnetic sensitive element is mold-formed with resin material. Soft epoxy or gel resin is employed as the elastic member, poured in an element-mounting space and solidified. The magnetic sensitive element is surrounded by silicone rubber. Such construction allows the magnetic sensitive element not to be affected by vibration and allows the elastic member to absorb the stress which is created due to the thermal deformation of the molded resin.

Abstract: A capsule including a physiologically acceptable nonionic surfactant coating. The coating provides excellent glide, anti-static properties and printing quality without preventing its degradation.

Abstract: A sprinkler head includes a body having one end adapted for connection to a supply of pressurized fluid and the other end closed by a valve element, and a thermally responsive assembly for normally holding the valve element in a closed position and opening the valve element at a preset temperature to cause the pressurized fluid to flow out of the other end of the body. The thermally responsive assembly includes a holder and a fusible alloy contained within the holder and held in place by a plunger. The fusible alloy is free of lead and/or cadmium and includes at least two materials selected from the group consisting of tin, bismuth, indium, zinc, gallium and silver.

Abstract: A sprinkler head includes a body having one end adapted for connection to a supply of pressurized fluid and the other end closed by a valve element, and a thermally responsive assembly for normally holding the valve element in a closed position and opening the valve element at a preset temperature to cause the pressurized fluid to flow out of the other end of the body. The thermally responsive assembly includes a holder and a fusible alloy contained within the holder and held in place by a plunger. The fusible alloy is free of lead and/or cadmium and includes at least two materials selected from the group consisting of tin, bismuth, indium, zinc, gallium and silver.

Abstract: According to the invention, a primary winding of an ignition coil is coupled with an insulated-gate bipolar transistor (IGBT). The IGBT is controlled by a current restriction circuit, which includes a control transistor for performing the on-off operation of the IGBT such that the IGBT is made conductive upon occurrence of an ignition control signal, and nonconductive, when a primary current of the ignition coil reaches a certain value depending on a reference voltage determined by a bias circuit. The bias circuit has a condenser, which is charged by a base current of the control transistor to change the base potential of the transistor slowly, when the transistor is made nonconductive.