Patents by Inventor Hiroshi Tajima

Hiroshi Tajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200171479
    Abstract: The present invention provides a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having a most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter, the phosphate adsorbing agent for blood processing having a biocompatible polymer in the surface of the porous formed article.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 4, 2020
    Applicant: ASAHI KASEI MEDICAL CO., LTD.
    Inventors: Naoki MORITA, Hiroshi TAJIMA, Masashi KOGAWA
  • Patent number: 10638598
    Abstract: The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: April 28, 2020
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yuusuke Haruna, Takahiko Katsuki, Tsuyoshi Hasegawa, Hiroshi Tajima
  • Publication number: 20200045813
    Abstract: A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 ?m to 0.9 ?m thick.
    Type: Application
    Filed: September 26, 2019
    Publication date: February 6, 2020
    Inventors: Hiroshi TAJIMA, Masahiro WATANABE
  • Publication number: 20190373716
    Abstract: The present invention aims to provide a printed wiring board in which an increase in electrical resistance between a ground circuit and a reinforcement member of the printed wiring board is inhibited.
    Type: Application
    Filed: February 9, 2018
    Publication date: December 5, 2019
    Inventors: Yuusuke HARUNA, Takahiko KATSUKI, Tsuyoshi HASEGAWA, Hiroshi TAJIMA
  • Publication number: 20190261503
    Abstract: The present invention aims to provide a ground member that can be mounted on any position, wherein misalignment is less likely to occur between conductive filler particles of the ground member and a shielding layer of a shielding film when a shielded printed wiring board including the ground member is repeatedly heated and cooled to mount components thereon. The ground member of the present invention includes: a conductive external connection member having a first main surface and a second main surface opposite to the first main surface; conductive filler particles disposed adjacent to the first main surface; and an adhesive resin for fixing the conductive filler particles to the first main surface, wherein each conductive filler particle includes a low-melting-point metal.
    Type: Application
    Filed: February 9, 2018
    Publication date: August 22, 2019
    Inventors: Yuusuke HARUNA, Takahiko KATSUKI, Tsuyoshi HASEGAWA, Hiroshi TAJIMA
  • Patent number: 10159142
    Abstract: A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: December 18, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Yuusuke Haruna, Hiroshi Tajima, Masahiro Watanabe, Yukari Kobayashi, Kiyoharu Sekiguchi, Yoshihiro Hosoya
  • Publication number: 20180326136
    Abstract: The present invention relates to a phosphate adsorbing agent for blood processing comprising a porous formed article comprising an organic polymer resin and an inorganic ion adsorbent and having the most frequent pore size of 0.08 to 0.70 ?m measured with a mercury porosimeter. The present invention also relates to a blood processing system and a blood processing method involving the phosphate adsorbing agent for blood processing.
    Type: Application
    Filed: November 11, 2016
    Publication date: November 15, 2018
    Applicant: Asahi Kasei Medical Co., Ltd.
    Inventors: Naoki MORITA, Hiroshi TAJIMA, Ryou SASAKI, Hirokazu NAGAI, Akihiro OMORI
  • Patent number: 10051765
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: August 14, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Patent number: 10015915
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: July 3, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Hiroshi Tajima, Sirou Yamauchi, Kenji Kamino, Masahiro Watanabe
  • Publication number: 20180103540
    Abstract: It is possible to maintain high-reliable ground effect and reinforcement function over a long period. A printed wiring board includes a base member 112 that includes a ground wiring pattern 115 and a printed wiring board reinforcing member 135 bonded to the ground wiring pattern 115 in a conductive state. The printed wiring board reinforcing member 135 includes a metal base material layer 135a and a nickel layer 135b bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern 115 of the metal base material layer 135a by diffusion bonding.
    Type: Application
    Filed: June 1, 2016
    Publication date: April 12, 2018
    Inventors: Yuusuke HARUNA, Hiroshi TAJIMA, Masahiro WATANABE, Yukari KOBAYASHI, Kiyoharu SEKIGUCHI, Yoshihiro HOSOYA
  • Patent number: 9888619
    Abstract: Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: February 6, 2018
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD
    Inventors: Yusuke Haruna, Sirou Yamauchi, Hiroshi Tajima, Kenji Kamino
  • Patent number: 9867280
    Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: January 9, 2018
    Assignee: Tatsuta Electric Wire and Cable Co., Ltd.
    Inventors: Masahiro Watanabe, Hiroshi Tajima
  • Patent number: 9820376
    Abstract: A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layer 3 and is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: November 14, 2017
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventor: Hiroshi Tajima
  • Publication number: 20170290145
    Abstract: A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 ?m to 0.9 ?m thick.
    Type: Application
    Filed: August 31, 2015
    Publication date: October 5, 2017
    Inventors: Hiroshi TAJIMA, Masahiro WATANABE
  • Patent number: 9736924
    Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of a base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: August 15, 2017
    Assignee: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
    Inventors: Masahiro Watanabe, Hiroshi Tajima
  • Publication number: 20160345428
    Abstract: A reinforcing member for a flexible printed wiring board that maintains an electromagnetic wave shielding effect and a ground effect of the printed wiring board over a long period of time. A reinforcing member is disposed opposite a predetermined part of a ground wiring pattern and includes one surface opposing and in electrical conduction with the predetermined part of the ground wiring pattern. The other surface is in electrical conduction with an external ground member which is at a ground potential, the one surface and the other surface opposing each other. The reinforcing member includes a base made of conductive metal and a surface layer formed on a surface of the base to constitute at least a part of the other surface, the surface layer has higher conductivity and corrosion resistance than the base made of metal, and the surface layer is 0.004 to 0.2 ?m thick.
    Type: Application
    Filed: August 3, 2016
    Publication date: November 24, 2016
    Inventors: Masahiro WATANABE, Hiroshi TAJIMA
  • Publication number: 20160249446
    Abstract: A method of manufacturing a shield printed wiring board, a shield film, and a shield printed wiring board, which make it possible to achieve cost reduction, are provided. A method of manufacturing a shield printed wiring board 10 includes the steps of: forming a shield film 1 which includes an insulating layer 7 formed of resin in which polymerization has proceeded so that a resin cure degree is 90% or higher, a metal layer 8a stacked onto the insulating layer 7, and an adhesive layer 8b stacked onto the metal layer 8a; mounting the shield film 1 on a printed board 5; and thermally pressing the shield film 1 and the printed board 5 onto each other.
    Type: Application
    Filed: May 3, 2016
    Publication date: August 25, 2016
    Inventors: Hiroshi TAJIMA, Masayoshi IWASAKI, Kenji KAMINO, Yusuke HARUNA
  • Publication number: 20160205817
    Abstract: To provide a shield film which is capable of suitably shielding electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film and has good transmission characteristics, a shielded printed wiring board, and a method for manufacturing the shield film, a metal layer 3 which is 0.5 ?m to 12 ?m thick and an anisotropic conductive adhesive layer 4 which is anisotropic so as to be electrically conductive only in thickness directions are provided in a deposited manner, so that electric field waves, magnetic field waves, and electromagnetic waves progressing from one side to the other side of the shield film are suitably shielded.
    Type: Application
    Filed: February 9, 2016
    Publication date: July 14, 2016
    Inventors: Hiroshi TAJIMA, Sirou YAMAUCHI, Kenji KAMINO, Masahiro WATANABE
  • Publication number: 20160135290
    Abstract: A shape-retaining film which allows a flexible wiring board to retain its shape after the flexible wiring board is deformed by bending or the like, and a shape-retaining flexible wiring board including the shape-retaining film, is disclosed herein. A shape-retaining film includes a plastic-deformable metal layer and an adhesive layer which is formed on one surface side (lower side) of the metal layer 3 and is joined with a flexible wiring board. The shape-retaining film makes it possible to retain the shape of a deformed flexible wiring board. With this arrangement, the occurrence of a repellent force in the deformed flexible wiring board is prevented.
    Type: Application
    Filed: April 30, 2014
    Publication date: May 12, 2016
    Inventor: Hiroshi TAJIMA
  • Publication number: 20160010610
    Abstract: A fuel injection device injects natural gas from a first injection hole of a first housing and injects light oil form a second injection hole of a second housing. A weld part as a fixation part fixes positions of the first injection hole and the second injection hole such that a spray of natural gas injected from the first injection hole and a spray of light oil injected from the second injection hole contact each other. Thus the spray of light oil self-ignites by compression of air in a cylinder of an internal combustion engine and the spray of natural gas burns by ignition from a flame of the self-ignited light oil.
    Type: Application
    Filed: July 7, 2015
    Publication date: January 14, 2016
    Inventors: Tomoki FUJINO, Shinichiro KAWAKITA, Wakichi KONDOH, Yoshiaki NISHIJIMA, Hiroshi TAJIMA