Abstract: According to the embodiment, an optical imaging apparatus includes: an illuminator, a lens, an aperture, and an imaging element. Light is incident into the lens through an inspection object provided where the parallel light from the illuminator reaches. The light has passed through the solvent and the target, and/or through the solvent. The aperture is disposed on a focal plane of the lens. The aperture includes a passage region and a light-blocking region. The passage region allows passage of diffracted light in a direction different from a direction of the parallel light due to the target from the parallel light from the illuminator. The light-blocking region blocks the parallel light having passed through the solvent.

Abstract: A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.

Abstract: A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1—X ??(I) wherein —X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when —X is —OH, then R1 represents a group other than a hydrogen atom and an aro

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep nonprinting depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep nonprinting depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

Abstract: A negative-working photosensitive resin composition is dis-closed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1—X??(I) wherein —X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when —X is —OH, then R1 represents a group other than a hydrogen atom and an aro

Abstract: The present invention provides a process for forming a metal pattern in which a metal is chemically absorbed, and a pattern forming material and a crosslinkable monomer used for the process. The process includes: a step for forming a pattern by photolithography including an exposure step for carrying out exposure with a purified water-based developer having a pH of less than 7 on a pattern forming material containing (A) a matrix polymer having at least one of a carboxyl and a sulfonate group, and a rinsing step; a step for forming a metal-containing pattern by immersing the pattern in an aqueous solution containing a metal compound to allow for chemical absorption of a metal ion or a complex ion to the pattern; and a step for forming a metal pattern containing the elemental metal or further containing metal oxide by sintering the metal-containing pattern. A crosslinkable monomer containing a condensation product of a polyhydric alcohol with N-methylol(meth)acrylamide was used.

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photo-sensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1-X ??(I) wherein -X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when -X is —OH, then R1 represents a group other than a hydrogen atom and an aro

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula: in a range of 3.5 wt % or less based on the weight of the photosensitive resin composition. A photosensitive resin plate using the photosensitive resin composition is also disclosed. By this invention, a negative-working photosensitive resin composition particularly excellent in the reproducibility of the highlight areas and the independent fine lines and having the deep non-printing depth and good resolving properties, and a photosensitive resin plate using the resin composition are provided.

Abstract: A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I): R1—X??(I) wherein —X represents —OR2, —COOH, —SO3H, —CONHR2, —COR2, —SO2NHR2, —HNCONHR2, or —HNCOOR2; R1 and R2, which may be the same or different, each represents a hydrogen atom, a substituted or unsubstituted, saturated or unsaturated hydrocarbon group, provided that it does not contain a radical polymerizable ethylenic double bond, a substituted or unsubstituted alicyclic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, or a heterocyclic group; they may have an ether bond in the chain, provided that when —X is —OH, then R1represents a group other than a hydrogen atom and an aroma

Abstract: Disclosed is a negative-type photosensitive resin composition comprising component (A) that is a product of the Michael addition reaction between an amino group-containing compound (a-1) represented by the general formula (I): (wherein n is an integral number of 1-4), and a polyethyleneglycol di(meth)acrylate (a-2) represented by the general formula (II): (wherein R1 is a hydrogen or a methyl, and m is an integral number of 4-14). The composition of the invention is broadly be applicable in the technical fields of photo masks for etching use in the fabrication of CRT shadow masks, and lead frames for the mounting of IC chips; phosphor patterning of CRT; and further those of photosensitive resin plates, dry films, aqueous photosensitive paints, and aqueous photosensitive adhesives, etc.

Abstract: Disclosed is a negative-type photosensitive resin composition comprising component (A) that is a product of the Michael addition reaction between an amino group-containing compound (a-1) represented by the general formula (I): 1

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula (I):

Abstract: A negative-working photosensitive resin composition is disclosed, comprising (A) a film-forming polymer, (B) an unsaturated compound having a radical polymerizable ethylenic double bond, (C) a photopolymerization initiator, and (D) a thermal polymerization inhibitor, wherein the resin composition further contains (E) at least one member selected from compounds represented by following formula:

Abstract: A glass substrate having the first through fourth thin films formed thereon and a glass substrate having the fifth through seventh thin films formed thereon are bonded to each other with the thin-film forming surfaces facing each other through a seal member that is located at the surrounding portion of the substrates. Seal-portion spacers, which are to be mixed in the seal member, are made of glass beads with a spherical particle shape, and the rate thereof to the seal material is set to 7 to 20 Wt %. Further, the particle diameter of the spherical-shaped spacers is represented by (the layer thickness A of a liquid crystal layer)+(the total thickness B+B' of various thin films located within the effective display area)-(the total thickness C+C' of various thin films located in a seal portion)+(0.1 to 0.2 .mu.m).

Abstract: There is provided a plastic liquid crystal display device in which an aligning film processing can be carried out at 150 to 180.degree. C. and which can have optical characteristics comparable to those of the conventional glass substrate liquid crystal display device. The plastic liquid crystal device comprises a pair of plastic substrates, transparent electrodes, insulating films for protecting the electrodes, aligning films and a liquid crystal, wherein the aligning film is an aligning film which is formed by dissolving a high-temperature sintering organic polymer aligning film made of polyimide or a polyimide-like substance in a solvent, printing a resulting solution thereof on a substrate, removing only the solvent by heating and/or heating under reduced pressure, and sintering the substrate at 200.degree. C. or less.