Abstract: The present invention provides a heat conductive silicone rubber composite sheet that is suitable as a heat dissipating member provided between a heat generating electronic component and a heat dissipating component such as a heat dissipating fin, wherein the heat conductive silicone rubber composite sheet has a laminated structure with good electrical insulation and thermal conductivity, as well as excellent strength, flexibility, and particularly superior interlayer adhesion.

Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

Abstract: A cutting tool holder unit is composed of a cutting tool holder adapted to detachably mount a cutting tool thereon, and a front cover of a flange shape slidably fitted into a side of the cutting took holder mounted on a multi-spindle head. A groove formed on the inner circumferential surface of the front cover is slidably fitted into a groove formed on the cutting tool holder to form a cutting oil circulating channel and a cutting oil injection port is opened at an upstream position of a cutting tool mounting section relative to the direction of rotation of the cutting tool holder.

Abstract: A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

Abstract: A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.

Abstract: A substrate package structure includes bumps disposed on a surface side of a first substrate and a surface side of a second substrate. The bump at the first substrate and the bump at the second substrate are press-fitted to each other while the one surface of the first substrate and the one surface of the second substrate are confronted to each other, thereby connecting the first and second substrates to each other. The bump at the first substrate is constructed so that the tip portion thereof is designed to have a flat surface, and the bump at the second substrate is constructed so that the tip portion is designed to have a projecting portion narrower than the tip portion of the bump at the first substrate.

Abstract: A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

Abstract: A wire bonding method for bonding a plurality of conducting wires to connect first conductors and second conductors has the following steps. 1) Bonding a first conducting ball on a first first conductor. 2) Bonding a first conducting wire on the first conducting ball, the first conducting wire being connected to a first second conductor. 3) Bonding a second conducting ball on a second first conductor. 4) Bonding a second conducting wire on the second conducting ball, the second conducting wire being connected to a second second conductor. Here, the second first conductor or the second second conductor is the first conducting wire bonded on the first conducting ball.

Abstract: The present invention provides a heat conductive silicone rubber composite sheet that is suitable as a heat dissipating member provided between a heat generating electronic component and a heat dissipating component such as a heat dissipating fin, wherein the heat conductive silicone rubber composite sheet has a laminated structure with good electrical insulation and thermal conductivity, as well as excellent strength, flexibility, and particularly superior interlayer adhesion.

Abstract: A production process for a long fiber-filled thermoplastic resin composition using an apparatus having an extruder with at least two raw material feeding ports and a resin impregnating bath at the tip of the extruder, comprising the steps of feeding a resin mixture to a first feeding port provided at an upstream position of the extruder, feeding alkaline earth metals to a second feeding port provided at a downstream position of the extruder, melt-kneading to a mixture, allowing the obtained molten resin mixture to flow into the resin impregnating bath, passing a continuous fiber bundle through the molten resin mixture in the resin impregnating bath to impregnate the continuous fiber bundle with the resin mixture.

Abstract: A method for producing a reinforced thermoplastic resin composition in a stable manner for long periods of time, comprising providing a melt-kneading apparatus with a plurality of supply ports arranged in line with the direction, along which a molten resin flows, supplying a polyolefin resin, a solid modifier and a solid radical generator through a first supply port positioned on the most upstream side of the extruder; supplying a flake inorganic filler through a second supply port arranged at a position on the downstream side of the first supply port; supplying a fibrous reinforcing material through a third supply port arranged at a position on the downstream side of the second supply port; and supplying an unsaturated silane compound through a liquid-introducing port arranged at a position on the immediately downstream side of the first supply port and on the upstream side of the second supply port, to thus melt and knead these components.

Abstract: A gate driver includes an edge detection circuit, an ON pulse generation circuit, first and second OFF pulse generation circuit and a status hold circuit. The first OFF pulse generation circuit generates a first OFF pulse in response to a leading or trailing edge of a control input signal, which is detected by the edge detection circuit. The status hold circuit drives an output element in response to the ON pulse outputted from the ON pulse generation circuit and holds driving status of the output element until a first OFF pulse is outputted from the first OFF pulse generation circuit. The second OFF pulse generation circuit generates a second OFF pulse in response to a protect operation signal and supplies this pulse to the status hold circuit, thereby to stop driving of the output element.

Abstract: An organopolysiloxane, a hydrolyzable group-bearing methylpolysiloxane, a thermal conductive filler, and a curing agent are blended to form a silicone rubber composition which is minimized in viscosity or plasticity increase and remains effectively moldable and workable even when loaded with a large amount of the thermal conductive filler. It cures into a silicone rubber part having a high thermal conductivity.

Abstract: A gate driver includes an edge detection circuit, an ON pulse generation circuit, first and second OFF pulse generation circuit and a status hold circuit. The first OFF pulse generation circuit generates a first OFF pulse in response to a leading or trailing edge of a control input signal, which is detected by the edge detection circuit. The status hold circuit drives an output element in response to the ON pulse outputted from the ON pulse generation circuit and holds driving status of the output element until a first OFF pulse is outputted from the first OFF pulse generation circuit. The second OFF pulse generation circuit generates a second OFF pulse in response to a protect operation signal and supplies this pulse to the status hold circuit, thereby to stop driving of the output element.

Abstract: A heat shrinkable silicone tube is prepared from a silicon rubber composition comprising (A) a diorganopolysiloxane, (B) a thermoplastic resin, (C) finely divided silica, (D) an inorganic filler of titanium white, alumina, quartz powder or talc having a mean particle size of 0.5-15 .mu.m, and (E) a curing agent by extrusion molding the silicone rubber composition into a tubular shape preferably at a drawdown of 150-250%, vulcanizing the tube, and heat stretching the tube in a radial direction. The tube exhibits axial orientation during the stretching step and a shrinking step subsequent thereto and is thus tearable.