Patents by Inventor Hiroshi Takezaki
Hiroshi Takezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9777130Abstract: Polyphenylene sulfide microparticles have a linseed oil absorption amount of 40 to 1,000 mL/100 g and a number average particle diameter of 1 to 200 ?m. The porous PPS microparticles have a large specific surface area and therefore promote fusion of particles when molded into various molded bodies by applying thermal energy, thus enabling formation or molding of a coating layer of particles at a lower temperature in a shorter time. The porous PPS microparticles have a porous shape and therefore enable scattering light in multiple directions and suppression of specific reflection of reflected light in a specific direction, thus making it possible to impart shading effect and matte effect when added to a medium.Type: GrantFiled: December 17, 2014Date of Patent: October 3, 2017Assignee: Toray Industries, Inc.Inventors: Takahiko Otsubo, Itaru Asano, Yoko Wakahara, Hiroshi Takezaki
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Publication number: 20170204484Abstract: An apparatus for shaving a tap hole surface of a blast furnace or the like wherein efficiency can be improved, and a worker can be freed from physically burdensome work in the vicinity of the lower furnace wall of a blast furnace under high temperature. The apparatus includes a surface shaving unit having smoothing bits, and a rotating mechanism unit that, when the surface shaving unit is pressed against the tap hole surface, rotates the surface shaving unit, by utilizing the pressing force, by a predetermined angle in a predetermined direction substantially parallel to the surface, and holds the surface shaving unit at the rotated position. The rotating mechanism unit eliminates the need for work such that every time a conventional surface shaving unit is separated from the tap hole surface after being pressed against the surface, a worker manually rotates the surface shaving unit by a predetermined angle.Type: ApplicationFiled: December 25, 2015Publication date: July 20, 2017Applicant: TRYTEC CO., LTD.Inventors: Hiroshi TAKEZAKI, Shinichi FUJISAWA
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Patent number: 9676936Abstract: The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G? of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180° C., and that (ii) the ratio of the storage elastic modulus G? of the material constituting the particles at 160° C. to the storage elastic modulus G? of the material at 200° C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].Type: GrantFiled: January 24, 2014Date of Patent: June 13, 2017Assignee: TORAY INDUSTRIES, INC.Inventors: Yuko Shimizu, Hiroshi Kobayashi, Nobuyuki Tomioka, Hiroshi Takezaki, Shirou Honda
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Patent number: 9676937Abstract: [Problem] To provide: a fiber-reinforced composite material having both Mode I interlaminar fracture toughness and compressive strength under wet heat conditions; an epoxy resin composition for producing the fiber-reinforced composite material; and a prepreg produced using the epoxy resin composition. [Solution] An epoxy resin composition comprising at least the following constituents [A], [B] and [C]: [A] an epoxy resin; [B] composite polyamide microparticles which satisfy such a requirement (b1) the materials constituting the particles are a polyamide (B1) and a thermoplastic elastomer resin (B2), such a requirement (b2) that the melting point or the glass transition temperature of the polyamide (B1) is higher than 100° C. and such a requirement (b3) the number average particle diameter is 0.1 to 100 ?m; and [C] a curing agent.Type: GrantFiled: August 1, 2014Date of Patent: June 13, 2017Assignee: TORAY INDUSTRIES, INC.Inventors: Hiroshi Kobayashi, Takahiko Otsubo, Hiroshi Takezaki, Nobuyuki Tomioka
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Patent number: 9617395Abstract: The production of polyamide 1010 polymer particles, in which polyamide 1010 resin, a different polymer B and an organic solvent are dissolved and mixed and thereupon an emulsion is formed within a system for phase separation into two phases, being a solution phase having the polyamide 1010 resin as the main component and a solution phase having the polymer B as the main component, and thereafter a poor solvent of the polyamide 1010 resin is brought into contact therewith to precipitate the polyamide 1010 resin, wherein the formation of the emulsion is carried out at a temperature of 100° C. or higher, thereby making it possible to obtain highly crystalline polyamide 1010 particles having a high sphericity.Type: GrantFiled: July 11, 2012Date of Patent: April 11, 2017Assignee: Toray Industries, Inc.Inventors: Makiko Saito, Hiroshi Takezaki
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Publication number: 20170088677Abstract: A method of producing polymer particles includes, in a system in which a polymer A and a polymer B are dissolved in and mixed with an organic solvent to undergo phase separation into two phases which are a solution phase containing the polymer A as a major component and a solution phase containing the polymer B as a major component, continuously adding an emulsion including the polymer A, the polymer B and the organic solvent, and a poor solvent for the polymer A to a vessel continuously to allow the polymer A to precipitate; and separating polymer A particles from the vessel continuously.Type: ApplicationFiled: June 1, 2015Publication date: March 30, 2017Inventors: Yoshinori Kondo, Yuji Echigo, Akira Kitamura, Hiroshi Takezaki
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Patent number: 9567443Abstract: A method of producing polycarbonate-based polymer microparticles including forming an emulsion in a system in which a polycarbonate-based polymer (A), a polymer (B) different from the polycarbonate-based polymer (A) and an organic solvent (C) are dissolved and mixed together and which causes phase separation into two phases of a solution phase having the polycarbonate-based polymer (A) as its main component and a solution phase having the polymer (B) different from the polycarbonate-based polymer (a) as its main component, and contacting a poor solvent for the polycarbonate-based polymer (A) with the emulsion at a temperature of 80° C. or higher to thereby precipitate microparticles of the polycarbonate-based polymer (A).Type: GrantFiled: January 18, 2013Date of Patent: February 14, 2017Assignee: Toray Industries, Inc.Inventors: Itaru Asano, Hiroshi Takezaki
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Publication number: 20160362524Abstract: A polyarylene sulfide resin powder/grain composition in which 100 weight parts of polyarylene sulfide resin powder/grain material whose average particle diameter exceeds 1 ?m and is less than or equal to 100 ?m and whose uniformity degree is less than or equal to 4 has been blended with 0.1 to 5 weight parts of an inorganic fine particle having an average particle diameter greater than or equal to 20 nm and less than or equal to 500 nm.Type: ApplicationFiled: February 13, 2015Publication date: December 15, 2016Inventors: Kei Watanabe, Kazusada Takeda, Hiroshi Takezaki, Kei Makita, Yosuke Nishimura
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Publication number: 20160311995Abstract: Polyphenylene sulfide microparticles have a linseed oil absorption amount of 40 to 1,000 mL/100 g and a number average particle diameter of 1 to 200 ?m. The porous PPS microparticles have a large specific surface area and therefore promote fusion of particles when molded into various molded bodies by applying thermal energy, thus enabling formation or molding of a coating layer of particles at a lower temperature in a shorter time. The porous PPS microparticles have a porous shape and therefore enable scattering light in multiple directions and suppression of specific reflection of reflected light in a specific direction, thus making it possible to impart shading effect and matte effect when added to a medium.Type: ApplicationFiled: December 17, 2014Publication date: October 27, 2016Inventors: Takahiko Otsubo, Itaru Asano, Yoko Wakahara, Hiroshi Takezaki
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Publication number: 20160304714Abstract: Fine polymer particles made by a method include producing an emulsion in a liquid prepared by dissolving and mixing a polymer A and a polymer B in organic solvents in which a solution phase composed primarily of the polymer A and a solution phase composed primarily of the polymer B are formed as separate phases, wherein the solvents in the two phases resulting from the phase separation are substantially identical to each other, and contacting the emulsion with a poor solvent for the polymer A to precipitate the polymer A, wherein the particles have a glass transition point of 150° C. or more and 400° C. or less, an average particle diameter of 1 ?m or more to 100 ?m or less, and a particle diameter distribution index of the particles is 2 or less, wherein the polymer A is nonvinyl type polymer.Type: ApplicationFiled: June 30, 2016Publication date: October 20, 2016Inventors: Itaru Asano, Yuji Echigo, Hiroshi Takezaki
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Patent number: 9416233Abstract: Composite polyamide fine particles include a polyamide (A1) which has a melting point or a glass transition temperature of over 100° C. and a polymer (A2) which is different from the polyamide (A1). The composite polyamide fine particles have: a dispersion structure in which a plurality of domains each having an average particle diameter of 0.05 to 100 ?m whose main component is the polymer (A2) are dispersed in a polyamide (A1) based matrix; an average particle diameter of 0.1 to 500 ?m; and a sphericity of 80 or more.Type: GrantFiled: February 8, 2013Date of Patent: August 16, 2016Assignee: Toray Industries, Inc.Inventors: Hiroshi Kobayashi, Takahiko Otsubo, Hiroshi Takezaki
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Patent number: 9410004Abstract: A fine polymer particle production method includes producing an emulsion in a liquid prepared by dissolving and mixing a polymer A and a polymer B in organic solvents in which a solution phase composed primarily of the polymer A and a solution phase composed primarily of the polymer B are formed as separate phases, and bringing it into contact with a poor solvent for the polymer A to precipitate the polymer A. This method serves for easy synthesis of fine polymer particles with a narrow particle size distribution and the method can be effectively applied to production of highly heat-resistant polymers that have been difficult to produce with the conventional methods.Type: GrantFiled: August 8, 2013Date of Patent: August 9, 2016Assignee: Toray Industries, Inc.Inventors: Itaru Asano, Yuji Echigo, Hiroshi Takezaki
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Publication number: 20160122523Abstract: By first forming an emulsion in a system that separates into two phases which include a solution phase containing an ethylene-vinyl alcohol copolymer (A) as the main component and a solution phase containing a polymer (B) different from the ethylene-vinyl alcohol copolymer (A) as the main component when the copolymer (A), the polymer (B), and an organic solvent (C) having an SP value of 20 (J/cm3)1/2 to 30 (J/cm3)1/2 are dissolved and mixed together, and then causing the ethylene-vinyl alcohol copolymer (A) to precipitate as microparticles by bringing a poor solvent (D) of the ethylene-vinyl alcohol copolymer (A) into contact with the emulsion, it is possible to obtain ethylene-vinyl alcohol copolymer microparticles that have a narrow particle size distribution wherein the particle size distribution index in a dry-powder state is 2 or less, have a true spherical particle shape, and exhibit excellent re-dispersibility into liquid.Type: ApplicationFiled: May 21, 2014Publication date: May 5, 2016Applicant: Toray Industries, Inc.Inventors: Takahiko Otsubo, Itaru Asano, Hiroshi Takezaki
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Publication number: 20160122528Abstract: [Problem] To provide: a fiber-reinforced composite material having both Mode I interlaminar fracture toughness and compressive strength under wet heat conditions; an epoxy resin composition for producing the fiber-reinforced composite material; and a prepreg produced using the epoxy resin composition. [Solution] An epoxy resin composition comprising at least the following constituents [A], [B] and [C]: [A] an epoxy resin; [B] composite polyamide microparticles which satisfy such a requirement (b1) the materials constituting the particles are a polyamide (B1) and a thermoplastic elastomer resin (B2), such a requirement (b2) that the melting point or the glass transition temperature of the polyamide (B1) is higher than 100° C. and such a requirement (b3) the number average particle diameter is 0.1 to 100 ?m; and [C] a curing agent.Type: ApplicationFiled: August 1, 2014Publication date: May 5, 2016Applicant: TORAY INDUSTRIES, INC.Inventors: Hiroshi KOBAYASHI, Takahiko OTSUBO, Hiroshi TAKEZAKI, Nobuyuki TOMIOKA
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Patent number: 9221955Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: GrantFiled: August 1, 2011Date of Patent: December 29, 2015Assignee: TORAY INDUSTRIES, INC.Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20150368857Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: September 1, 2015Publication date: December 24, 2015Applicant: TORAY INDUSTRIES, INC.Inventors: Nobuyuki ARAI, Norimitsu NATSUME, Kenichi YOSHIOKA, Junko KAWASAKI, Hiroshi TAKEZAKI
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Publication number: 20150353697Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: August 2, 2011Publication date: December 10, 2015Inventors: Nobuyuki ARAI, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20150344686Abstract: The invention provides a prepreg that can give a fiber-reinforced composite material exhibiting stable and excellent interlaminar fracture toughness and impact resistance under wide molding conditions. The prepreg includes at least a reinforcement fiber [A], a thermosetting resin [B], and the following component [C] wherein 90% or more of the material [C] is present inside a region of the prepreg that extends from any surface of the prepreg to a prepreg site having, from the surface, a depth of 20% of the thickness of the prepreg. The component [C] satisfies requirements that (i) the storage elastic modulus G? of the material constituting the particles is more than 1 MPa, and 70 MPa or less at 180° C., and that (ii) the ratio of the storage elastic modulus G? of the material constituting the particles at 160° C. to the storage elastic modulus G? of the material at 200° C. ranges from 1 to 5; and is insoluble in the thermosetting resin [B].Type: ApplicationFiled: January 24, 2014Publication date: December 3, 2015Applicant: TORAY INDUSTRIES, INC.Inventors: Yuko SHIMIZU, Hiroshi KOBAYASHI, Nobuyuki TOMIOKA, Hiroshi TAKEZAKI, Shirou HONDA
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Publication number: 20150318067Abstract: Conductive microparticles, each are composed of a polymer microparticle and a conductive layer formed by coating the surface of the polymer microparticle with a metal. The conductive microparticles have an elastic modulus (E) at 5% displacement of 1-100 MPa. Especially when the conductive microparticles have a shape recovery ratio (SR) of 0.1-13% under a load of 9.8 mN, a particle size distribution index of 1-3 and a particle size of 0.1-100 ?m, the conductive microparticles can exhibit excellent conduction reliability in applications such as conductive adhesives for flexible boards.Type: ApplicationFiled: January 14, 2014Publication date: November 5, 2015Inventors: Itaru Asano, Ayano Ohno, Hiroshi Takezaki
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Publication number: 20150218359Abstract: Provided are: fine vinylidene fluoride resin particles which are solid and have an average particle diameter of 0.3 ?m or more but less than 100 ?m, a particle diameter distribution index of 1-2, a repose angle of less than 40°, and an average sphericity of 80 or more said fine vinylidene fluoride particles being suitable for coating materials and coating applications; and a method for producing the fine vinylidene fluoride resin particles.Type: ApplicationFiled: August 26, 2013Publication date: August 6, 2015Applicant: TORAY INDUSTRIES, INC.Inventors: Yuji Echigo, Makiko Saito, Itaru Asano, Yoko Wakahara, Hiroshi Takezaki