Patents by Inventor Hiroshi Takezaki
Hiroshi Takezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150024205Abstract: A method of producing polycarbonate-based polymer microparticles including forming an emulsion in a system in which a polycarbonate-based polymer (A), a polymer (B) different from the polycarbonate-based polymer (A) and an organic solvent (C) are dissolved and mixed together and which causes phase separation into two phases of a solution phase having the poly-carbonate-based polymer (A) as its main component and a solution phase having the polymer (B) different from the polycarbonate-based polymer (a) as its main component, and contacting a poor solvent for the polycarbonate-based polymer (A) with the emulsion at a temperature of 80° C. or higher to thereby precipitate microparticles of the polycarbonate-based polymer (A).Type: ApplicationFiled: January 18, 2013Publication date: January 22, 2015Inventors: Itaru Asano, Hiroshi Takezaki
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Publication number: 20140349113Abstract: The production of polyamide 1010 polymer particles, in which polyamide 1010 resin, a different polymer B and an organic solvent are dissolved and mixed and thereupon an emulsion is formed within a system for phase separation into two phases, being a solution phase having the polyamide 1010 resin as the main component and a solution phase having the polymer B as the main component, and thereafter a poor solvent of the polyamide 1010 resin is brought into contact therewith to precipitate the polyamide 1010 resin, wherein the formation of the emulsion is carried out at a temperature of 100° C. or higher, thereby making it possible to obtain highly crystalline polyamide 1010 particles having a high sphericity.Type: ApplicationFiled: July 11, 2012Publication date: November 27, 2014Applicant: TORAY INDUSTRIES, INC.Inventors: Makiko Saito, Hiroshi Takezaki
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Publication number: 20140162518Abstract: The invention provides a fiber reinforced composite material having high interlaminar toughness and compressive strength under wet heat conditions, as well as an epoxy resin composition for production thereof and a prepreg producible from the epoxy resin composition. The prepreg comprises at least constituents [A], [B], and [C] as specified below and reinforcement fiber, wherein 90% or more of constituent [C] exists in the depth range accounting for 20% of the prepreg thickness from the prepreg surface: [A] epoxy resin [B] epoxy resin curing agent [C] polymer particles insoluble in epoxy resin and falling under any of the following [Cx] to [Cz]: [Cx] polymer particles insoluble in epoxy resin and giving a particle diameter distribution chart meeting the following requirements from (x-i) to (x-iii): (x-i) the chart has at least two peaks, (x-ii) the particles giving the two highest peaks have a diameter ratio in the range of 1.Type: ApplicationFiled: July 25, 2012Publication date: June 12, 2014Applicant: TORAY INDUSTRIES, INC.Inventors: Yuko Shimizu, Nobuyuki Tomioka, Shirou Honda, Maki Nagano, Yuji Echigo, Hiroshi Takezaki, Junko Kawasaki, Hiroshi Taiko
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Publication number: 20130337263Abstract: A fine polymer particle production method includes producing an emulsion in a liquid prepared by dissolving and mixing a polymer A and a polymer B in organic solvents in which a solution phase composed primarily of the polymer A and a solution phase composed primarily of the polymer B are formed as separate phases, and bringing it into contact with a poor solvent for the polymer A to precipitate the polymer A. This method serves for easy synthesis of fine polymer particles with a narrow particle size distribution and the method can be effectively applied to production of highly heat-resistant polymers that have been difficult to produce with the conventional methods.Type: ApplicationFiled: August 8, 2013Publication date: December 19, 2013Applicant: Toray Industries, Inc.Inventors: Itaru Asano, Yuji Echigo, Hiroshi Takezaki
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Publication number: 20130309497Abstract: A process of producing polylactic acid-based resin microparticles includes a dissolving process that forms a system, which can cause phase separation into two phases of a solution phase mainly composed of polylactic acid-based resin (A) and a solution phase mainly composed of polymer (B) different from polylactic acid-based resin, by dissolving the polylactic acid-based resin (A) and the polymer (B) different from polylactic acid-based resin in an ether-based organic solvent (C), an emulsion-forming process that forms an emulsion by applying a shear force to the system, and a microparticle-forming process that precipitates polylactic acid-based resin microparticles by contacting the emulsion with a poor solvent which has lower solubility of the polylactic acid-based resin (A) than the ether-based organic solvent (C).Type: ApplicationFiled: December 22, 2011Publication date: November 21, 2013Applicant: Toray Industries, Inc.Inventors: Hiroshi Takezaki, Hiroshi Kobayashi, Makiko Saito, Itaru Asano
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Patent number: 8574669Abstract: A fine polymer particle production method includes producing an emulsion in a liquid prepared by dissolving and mixing a polymer A and a polymer B in organic solvents in which a solution phase composed primarily of the polymer A and a solution phase composed primarily of the polymer B are formed as separate phases, and bringing it into contact with a poor solvent for the polymer A to precipitate the polymer A. This method serves for easy synthesis of fine polymer particles with a narrow particle size distribution and the method can be effectively applied to production of highly heat-resistant polymers that have been difficult to produce with the conventional methods.Type: GrantFiled: May 20, 2009Date of Patent: November 5, 2013Assignee: Toray Industries, Inc.Inventors: Itaru Asano, Yuji Echigo, Hiroshi Takezaki
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Publication number: 20130183528Abstract: A process of producing polymer microparticles wherein, in a system which includes a polymer (A), a polymer (B) and an organic solvent and can cause phase separation into two phases of a solution phase mainly composed of the polymer (A) and a solution phase mainly composed of the polymer (B) when the polymer (A), the polymer (B) and the organic solvent are dissolved and mixed together, after an emulsion is formed at a temperature of 100° C. or higher, the polymer (A) is precipitated by bringing a poor solvent for the polymer (A) into contact with the emulsion.Type: ApplicationFiled: September 27, 2011Publication date: July 18, 2013Inventors: Yuji Echigo, Itaru Asano, Hiroshi Kobayashi, Hiroshi Takezaki
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Patent number: 8394491Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: GrantFiled: August 2, 2011Date of Patent: March 12, 2013Assignee: Toray Industries, Inc.Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20120328880Abstract: A process is provided for producing carbon microparticles, wherein resin microparticles, metal-containing resin microparticles or daughter-particle-containing resin microparticles are subjected to carbonization baking, and wherein the synthetic resin microparticles, the metal-containing resin microparticles or the daughter-particle-containing resin microparticles are produced by a process comprising mixing a polymer (A) such as polyacrylonitrile copolymer microparticles composed of a copolymer of an acrylonitrile monomer and a hydrophilic vinyl monomer with a polymer (B) that is different from the polymer (A) in an organic solvent to produce an emulsion and bringing the emulsion into contact with a poor solvent for the polymer (A), thereby causing the polymer (A) to precipitate; and the carbon microparticles.Type: ApplicationFiled: December 21, 2010Publication date: December 27, 2012Applicant: Toray Industries, Inc.Inventors: Itaru Asano, Hiroshi Takezaki
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Patent number: 8302388Abstract: After adjusting an exhaust gas temperature at an exit of a heat recovery unit (11) of an exhaust gas treating apparatus to not more than a dew point temperature of sulfur trioxide (SO3), a heavy metal adsorbent is supplied from a heavy metal adsorbent supply unit (16) disposed in an exhaust gas at an entrance of a precipitator (4) or an intermediate position within the precipitator (4), and the exhaust gas containing the heavy metal adsorbent is supplied into the precipitator (4). Preferably at this stage, the heavy metal adsorbent is supplied into the exhaust gas at the entrance of the precipitator (4) 0.1 seconds after the exhaust gas temperature at the exit of the heat recovery unit (11) has been adjusted to not more than the dew point temperature of SO3.Type: GrantFiled: December 24, 2007Date of Patent: November 6, 2012Assignee: Babcock-Hitachi Kabushiki KaishaInventors: Kazuki Kobayashi, Hirofumi Kikkawa, Hiroshi Ishizaka, Hiroshi Takezaki, Hiroyuki Nosaka
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Patent number: 8137798Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: GrantFiled: March 2, 2011Date of Patent: March 20, 2012Assignee: Toray Industries, Inc.Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20120058297Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2) (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: August 1, 2011Publication date: March 8, 2012Inventors: Nobuyuki ARAI, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Patent number: 8075988Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: GrantFiled: March 2, 2011Date of Patent: December 13, 2011Assignee: Toray Industries, Inc.Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20110291056Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: August 2, 2011Publication date: December 1, 2011Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20110287246Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: August 2, 2011Publication date: November 24, 2011Inventors: Nobuyuki ARAI, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20110151235Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: March 2, 2011Publication date: June 23, 2011Inventors: Nobuyuki ARAI, Norimitsu NATSUME, Kenichi YOSHIOKA, Junko KAWASAKI, Hiroshi TAKEZAKI
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Publication number: 20110147674Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: March 2, 2011Publication date: June 23, 2011Inventors: Nobuyuki ARAI, Norimitsu NATSUME, Kenichi YOSHIOKA, Junko KAWASAKI, Hiroshi TAKEZAKI
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Patent number: 7931958Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: GrantFiled: August 7, 2007Date of Patent: April 26, 2011Assignee: Toray Industries, Inc.Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki
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Publication number: 20110070442Abstract: A fine polymer particle production method includes producing an emulsion in a liquid prepared by dissolving and mixing a polymer A and a polymer B in organic solvents in which a solution phase composed primarily of the polymer A and a solution phase composed primarily of the polymer B are formed as separate phases, and bringing it into contact with a poor solvent for the polymer A to precipitate the polymer A. This method serves for easy synthesis of fine polymer particles with a narrow particle size distribution and the method can be effectively applied to production of highly heat-resistant polymers that have been difficult to produce with the conventional methods.Type: ApplicationFiled: May 20, 2009Publication date: March 24, 2011Applicant: Toray Industries, Inc.Inventors: Itaru Asano, Yuji Echigo, Hiroshi Takezaki
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Publication number: 20100178487Abstract: A prepreg containing a carbon fiber [A] and a thermosetting resin [B], and in addition, satisfying at least one of the following (1) and (2). (1) a thermoplastic resin particle or fiber [C] and a conductive particle or fiber [D] are contained, and weight ratio expressed by [compounding amount of [C] (parts by weight)]/[compounding amount of [D] (parts by weight)] is 1 to 1000. (2) a conductive particle or fiber of which thermoplastic resin nucleus or core is coated with a conductive substance [E] is contained.Type: ApplicationFiled: August 7, 2007Publication date: July 15, 2010Inventors: Nobuyuki Arai, Norimitsu Natsume, Kenichi Yoshioka, Junko Kawasaki, Hiroshi Takezaki